Group 1 - The global server market is entering a new growth cycle starting in 2024, driven by the increasing demand for AI computing power, with an expected CAGR of 18.8% from 2024 to 2029 [2] - The PCB industry is recovering from a phase of adjustment due to weak consumer electronics and inventory cycles, with emerging demands from AI servers and high-performance infrastructure expected to drive growth from 2024 [2][3] - Domestic PCB manufacturers are actively expanding production and increasing capital expenditures, focusing on high-end products such as HDI and multi-layer boards [2][3] Group 2 - The global PCB equipment market is projected to reach 51 billion yuan in 2024, with a year-on-year growth of 9.0%, and a CAGR of 4.9% from 2020 to 2024 [3] - The demand for PCB equipment is significantly boosted by AI computing infrastructure, with the market expected to grow to 77.5 billion yuan by 2029, reflecting a CAGR of 8.7% from 2024 to 2029 [3] - Drilling, exposure, and testing equipment represent the highest value segments in the PCB equipment market, accounting for 20.75%, 16.99%, and 15.00% respectively in 2024 [3] Group 3 - The drilling equipment segment is expected to benefit from increased demand for high-end HDI, with both mechanical and laser drilling seeing growth due to the rising complexity of HDI designs [3] - The exposure equipment market is currently dominated by foreign brands, with low domestic penetration, particularly in LDI technology which is more suited for HDI [4] - The demand for plating equipment is increasing due to the higher number of plating cycles required for advanced HDI, alongside quality control pressures [5] Group 4 - Major equipment manufacturers are showing a clear upward trend, with expectations for accelerated performance in the future [6] - Key players in the drilling segment include Dazhu CNC (301200), while the exposure segment is led by Xinqi Micro (688630) and Tianzhun Technology (688003) [7] - The plating segment is highlighted by Dongwei Technology (688700), with Keg Precision (301338) noted for its role in the solder paste printing segment [7]

Group 1 - Hefei Chipcore Microelectronics Equipment Co., Ltd. has obtained a patent for a "Calibration Assembly and Exposure Device" with the authorization announcement number CN223260027U, applied on August 2024 [1] - The patent describes a calibration assembly that includes a bracket, calibration component, and light guide component, designed to simplify and enhance the reliability of the assembly structure [1] - The use of the light guide component allows for the adjustment of the calibration beam path, improving the precision of the calibration assembly and increasing the yield rate of the subsequent exposure device [1] Group 2 - Hefei Chipcore Microelectronics Equipment Co., Ltd. was established in 2015 and is primarily engaged in the manufacturing of instruments and meters, with a registered capital of 131.74 million RMB [2] - The company has made investments in 4 enterprises and participated in 147 bidding projects, holding 25 trademark records and 371 patent records [2] - Additionally, the company possesses 23 administrative licenses [2]

Investment Rating - The report maintains a "Recommended" rating for leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd. [4][5] Core Viewpoints - The PCB industry is experiencing rapid advancements in packaging and high-density interconnect technologies, with traditional HDI and substrate technologies evolving into mSAP processes to meet the demands of high-speed signal transmission and large-scale integration [1][2] - The demand for PCB is driven by AI applications, leading to significant expansions in production capacity among leading companies, with total investments exceeding 30 billion RMB [2][20] - The core materials for PCB, including copper foil, electronic cloth, and resin, are undergoing upgrades to meet the high-frequency and high-speed requirements of AI applications [2][20][26] Summary by Sections 1. CoWoP and mSAP as Core Technologies - CoWoP (Chip-on-Wafer-on-PCB) is emerging as a future packaging route, enhancing interconnect density and reducing costs by directly using large-size PCBs [1][11] - mSAP (Modified Semi-Additive Process) is becoming the core process for achieving sub-10 µm line capabilities, essential for high-performance applications [1][14] 2. PCB Capacity Expansion and Material Upgrades - Leading PCB manufacturers are actively expanding production capacity, with significant investments announced by companies like Huadian Co., Ltd. and Shenghong Technology [2][20] - The upgrade of core materials includes the transition of copper foil from HVLP1 to HVLP5, electronic cloth to third-generation low-dielectric cloth, and resin to hydrocarbon and PTFE types [2][20][28] 3. Tight Supply of Core Equipment and Acceleration of Domestic Substitution - The supply of core PCB equipment, including drilling, plating, and etching imaging, is tight, with domestic manufacturers accelerating their layouts in advanced process equipment [2][49] - Companies like Dazhu CNC and Ding Tai High-Tech are focusing on high-layer boards and HDI equipment to meet the increasing demands of the industry [2][49] 4. Investment Recommendations - The report suggests focusing on leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd., as well as material companies with core technologies like Honghe Technology and Zhongcai Technology [3][4] - Equipment manufacturers involved in domestic substitution, such as Dazhu CNC and Xinqi Microelectronics, are also highlighted as potential investment opportunities [3][4]

Market Performance - The specialized equipment sector increased by 0.65% on August 22, with Huicheng Vacuum leading the gains [1] - The Shanghai Composite Index closed at 3825.76, up 1.45%, while the Shenzhen Component Index closed at 12166.06, up 2.07% [1] Top Gainers in Specialized Equipment Sector - Huicheng Vacuum (301392) closed at 190.20, up 9.72%, with a trading volume of 51,700 and a transaction value of 956 million [1] - Guangli Technology (300480) closed at 17.98, up 8.25%, with a trading volume of 413,800 and a transaction value of 733 million [1] - Lingyun Light (688400) closed at 36.59, up 7.30%, with a trading volume of 272,700 and a transaction value of 977 million [1] Top Losers in Specialized Equipment Sector - Jinying Co. (600232) closed at 7.33, down 9.62%, with a trading volume of 499,100 and a transaction value of 369 million [2] - Sudar Co. (001277) closed at 44.27, down 5.75%, with a trading volume of 45,100 and a transaction value of 202 million [2] - Zhuozhao Point Glue (873726) closed at 44.10, down 4.71%, with a trading volume of 59,800 and a transaction value of 26.89 million [2] Capital Flow Analysis - The specialized equipment sector experienced a net outflow of 1.172 billion from institutional investors and a net outflow of 184 million from retail investors, while retail investors saw a net inflow of 1.356 billion [2] - The capital flow for specific stocks shows varied trends, with some stocks like Dazhu CNC (301200) seeing a net inflow of 81.04 million from institutional investors [3]

Group 1 - The lithography equipment sector is experiencing a strong performance, with significant gains in stock prices [1] - Asuka Electronics has reached its daily limit up, indicating strong investor interest and confidence [1] - Other companies in the sector, including China Shipbuilding Gas, Juguang Technology, Chip Microelectronics, Maolai Optics, and Kema Technology, are also seeing stock price increases [1]

Group 1 - The stock price of Chipbond Technology is reported at 128.90 yuan, down by 6.10 yuan from the previous trading day [1] - The opening price for the day was 135.33 yuan, with a high of 137.33 yuan and a low of 126.40 yuan, resulting in a trading volume of 97,436 lots and a transaction amount of 1.265 billion yuan [1] - Chipbond Technology specializes in the research, production, and sales of semiconductor equipment, with its products primarily used in integrated circuits, advanced packaging, and new display fields [1] Group 2 - The company announced that its wafer-level and panel-level direct-write lithography equipment series has received purchase orders from several leading domestic packaging and testing companies [1] - The products will be applied in large-size chip packaging fields such as SoW, CIS, and CoWoS-L [1] - The first batch of equipment is expected to be put into customer production lines by the end of the year [1]

转自：证券时报 人民财讯8月19日电，芯碁微装今日宣布，其面向中道领域的晶圆级及板级直写光刻设备系列已获得重 大市场突破。公司已与多家国内头部封测企业签订采购订单，产品主要应用于SoW、CIS、类CoWoS-L 等大尺寸芯片封装方向。此次获得多家国内头部封测企业的认可，标志着芯碁微装的产品性能与可靠性 已达到业界领先水平。基于此，并结合目前的市场反馈和业务规划，公司预计从今年年底到明年，订单 量将呈现持续批量增长趋势，其规模有望再上一个新台阶。首批设备预计于今年底开始，陆续投入客户 的量产线。这将有力支持国内封测产业链应对日益增长的高性能大尺寸AI芯片封装需求，加速高端封 装技术的国产化进程。 ...

Market Overview - A-shares opened high and closed at a ten-year high, with the Shanghai Composite Index rising by 0.85% and trading volume reaching 2.81 trillion yuan, the highest since October 2024[3][16] - The Hang Seng Index fell by 0.37%, while the Hang Seng Technology Index increased by 0.65%[12] - U.S. stocks showed mixed performance, with the Dow Jones down 0.1% and the S&P 500 virtually unchanged, as investors awaited key earnings reports and the Jackson Hole meeting[10] Monetary Policy Insights - The People's Bank of China emphasized a moderately loose monetary policy, with potential for further reserve requirement ratio (RRR) and interest rate cuts if domestic demand does not recover sufficiently[5] - The report highlighted a focus on improving the efficiency of capital allocation and supporting high-quality consumption finance to sustain domestic demand expansion[5] Commodity and Forex Movements - International oil prices rose by approximately 1%, with WTI crude oil closing at $63.42 per barrel, driven by geopolitical developments[27] - The U.S. dollar index increased by 0.3%, while the euro appreciated by 12.6% year-to-date against the dollar[26] Stock Performance Highlights - Notable stock movements included NetEase, which is expected to see stable growth in its gaming segment, with a target price of $143, up from $130.30[8] - Mobileye's stock is projected to rise as it expands its advanced driver-assistance systems (ADAS) business, with a target price of $17.6[8] Sector Performance - In the A-share market, sectors such as information technology and healthcare saw gains of 2.2% and 1.0%, respectively, while real estate and energy sectors faced declines[17] - In Hong Kong, the healthcare and consumer goods sectors both rose by 1.9%, while the energy sector fell by 1.7%[12] Global Economic Indicators - The U.S. 10-year Treasury yield rose to 4.33%, reflecting market expectations ahead of the Federal Reserve's upcoming announcements[30] - The report noted that inflationary pressures and fiscal risks are key concerns for the UK, with the 30-year government bond yield reaching its highest level since 1998[30]

Core Insights - The price increase of copper-clad laminates reflects the rising demand in the PCB industry, driven by the growth in AI computing servers [2][3] - Major copper-clad laminate manufacturers, including Weilibang, Jiantao Laminates, and Hongruixing, have announced price hikes due to high raw material costs and increased bargaining power from strong demand [2][3] Industry Overview - The global server sales reached $95.2 billion in Q1 2025, a year-on-year increase of 134.1%, with expectations for the global server market to reach $366 billion in 2025, a 44.6% increase [3] - The PCB market is projected to grow from $73.57 billion in 2024 to $78.56 billion in 2025, with a year-on-year growth of 6.8% [3] - The demand for high-layer multi-layer boards and HDI boards is significantly outpacing the overall PCB industry growth, with multi-layer boards expected to grow by 40.2% and HDI boards by 18.8% in 2024 [3] Production Insights - Key production processes in PCB manufacturing include drilling, exposure, and testing, with drilling equipment accounting for approximately 20% of the total industry value [4] - The increasing complexity of HDI boards necessitates advancements in drilling, exposure, and plating processes, leading to higher demand for precision equipment [4] - Domestic production rates are high for mechanical drilling, while opportunities for domestic substitution exist in laser drilling and imaging processes [4] Investment Recommendations - Focus on core production processes: for drilling, consider Dazhu CNC (301200.SZ) and consumables from Dingtai High-Tech (301377.SZ) and Zhongtung High-Tech (000657.SZ); for exposure, look at Chipbond Technology (688630.SH) and Tianzhun Technology (688003.SH); for plating, Eastway Technology (688700.SH) is recommended; for solder paste printing, Keg Precision (301338.SZ) is suggested [5]

Group 1 - The stock price of Chipbond Microelectronics is reported at 135.95 yuan, an increase of 4.65 yuan, or 3.54% from the previous trading day. The intraday high reached 138.30 yuan, while the low was 128.15 yuan, with a trading volume of 933 million yuan and a turnover rate of 5.28% [1] - Chipbond Microelectronics operates in the specialized equipment sector, focusing on micro-nano direct writing lithography technology. The company's products are applied in AI chip manufacturing, advanced packaging, and new energy vehicle electronics, and it is accelerating its expansion in domestic and international markets [1] - For 2024, the company expects revenue of 954 million yuan, representing a year-on-year growth of 15.09%. In the first quarter of 2025, the net profit is projected to be 51.87 million yuan, reflecting a year-on-year increase of 30.45% [1] Group 2 - On August 13, Chipbond Microelectronics announced plans to issue H-shares and list on the main board of the Hong Kong Stock Exchange to deepen its global strategic layout. The company has appointed Ernst & Young Hong Kong as the auditing firm, and related work is in progress, but specific details are yet to be determined, and the success of the listing remains uncertain [1] - On August 15, the main funds of Chipbond Microelectronics experienced a net outflow of 50.10 million yuan, accounting for 0.28% of the circulating market value. Over the past five days, the cumulative net outflow of main funds reached 141 million yuan, representing 0.79% of the circulating market value [1]