芯碁微装公告称，2025年12月10日，控股股东、实控人、董事长程卓通过竞价交易减持19万股，占总股 本0.14%。本次权益变动后，程卓及其一致行动人合计持股由4760.25万股降至4741.25万股，占比由 36.13%降至35.99%，触及1%刻度。此次减持是履行已披露计划，未实施完毕，不会影响公司治理及实 控权，也无需披露权益变动报告书。 ...

截至12月9日收盘，光刻机概念上涨0.77%，位居概念板块涨幅第9，板块内，24股上涨，中瓷电子涨 停，腾景科技、炬光科技、联合化学等涨幅居前，分别上涨10.54%、6.13%、5.34%。跌幅居前的有华 特气体、美埃科技、永新光学等，分别下跌3.09%、2.35%、2.17%。 今日涨跌幅居前的概念板块 | 概念 | 今日涨跌幅（%） | 概念 | 今日涨跌幅（%） | | --- | --- | --- | --- | | 共封装光学(CPO) | 1.64 | 海南自贸区 | -3.33 | | 福建自贸区 | 1.44 | 金属铅 | -3.05 | | PVDF概念 | 1.39 | 金属锌 | -2.82 | | 太赫兹 | 1.14 | 金属铜 | -2.58 | | 乳业 | 1.12 | 天津自贸区 | -2.31 | | 海峡两岸 | 1.04 | 特钢概念 | -2.07 | | 数字水印 | 0.83 | 磷化工 | -2.05 | | 共享单车 | 0.81 | 黄金概念 | -2.02 | | 光刻机 | 0.77 | 金属镍 | -2.01 | | PCB概念 | 0.68 | ...

今日涨跌幅居前的概念板块 截至12月8日收盘，光刻机概念上涨3.00%，位居概念板块涨幅第9，板块内，44股上涨，中瓷电子、泰 晶科技等涨停，赛微电子、芯碁微装、蓝特光学等涨幅居前，分别上涨11.35%、8.95%、8.51%。跌幅 居前的有*ST和科、南京化纤、晶方科技等，分别下跌2.72%、0.14%、0.07%。 | 600353 | 旭光电 | 1.24 | 2.88 | 2691.00 | 7.27 | | --- | --- | --- | --- | --- | --- | | | 子 | | | | | | 603360 | 百傲化 | 4.86 | 2.19 | 2115.60 | 4.17 | | | 学 | | | | | | 600619 | 海立股 | 1.07 | 3.26 | 1838.35 | 3.44 | | | 份 | | | | | | 301095 | 广立微 | 3.72 | 2.17 | 1811.05 | 6.97 | | 301421 | 波长光 电 | 2.89 | 10.27 | 1762.81 | 3.83 | | 300666 | 江丰电 | 1.67 ...

Group 1: Core Insights - The report emphasizes that the AI wave is initiating a new cycle in intelligent manufacturing, shifting the investment focus from cyclical fluctuations to "new hard-core" assets that can define the future and support the AI trend [8][9]. - Human-shaped robots are highlighted as the ultimate embodiment of AI intelligence, expected to revolutionize labor liberation and serve as a universal platform for AI interaction with the physical world [9][10]. - The report identifies solid-state batteries as a key technology that will unlock performance ceilings for human-shaped robots and electric vehicles due to their high energy density and safety [9][10]. Group 2: Human-Shaped Robots - The human-shaped robot industry is transitioning from concept validation to commercialization, with companies that have developed product capabilities in key components likely to experience significant valuation increases [13][17]. - The investment strategy focuses on essential hardware components rather than single manufacturers due to the uncertainty in design solutions, creating unique investment opportunities [25][28]. - Key companies to watch in this sector include Xinjie Electric, Huichuan Technology, and Weichuang Electric, which are positioned to benefit from the growth in human-shaped robots [17][30]. Group 3: AI Equipment and Materials - The demand for AI-related infrastructure is surging, leading to significant growth in high-performance servers, GPUs, and advanced PCB requirements [32][36]. - The PCB specialized equipment market is expected to grow from $3.306 billion in 2020 to $4.111 billion in 2024, with a CAGR of 5.60% in China [32][34]. - Key players in the equipment sector include Dazhu CNC and Chip Quik, which are well-positioned to capitalize on the increasing demand for advanced PCB manufacturing [36][40]. Group 4: Solid-State Batteries - The solid-state battery industry is accelerating towards commercialization, with major manufacturers like CATL and Zhongxin Innovation targeting 2027 for small-scale production [9][10]. - The global solid-state battery equipment market is projected to reach ¥107.94 billion by 2030, indicating a significant capital expenditure cycle ahead [9][10]. - Companies such as Lead Intelligent and Hai Moxing are recommended for their potential to benefit from this new capital expenditure cycle [9][10]. Group 5: Controlled Nuclear Fusion - Controlled nuclear fusion is transitioning from experimental phases to industrialization, with significant advancements in research and increased capital investment driving the industry forward [9][10]. - The report suggests focusing on companies involved in nuclear fusion projects, such as Hangyang Co. and Shanghai Electric, which are positioned to gain from this emerging sector [9][10]. - The demand for energy solutions is expected to grow, making nuclear fusion a critical area for investment as it promises to provide sustainable energy sources [9][10]. Group 6: Engineering Machinery - The domestic engineering machinery market is recovering, with excavator sales showing a positive trend, while overseas demand is also increasing due to factors like housing construction and manufacturing sector recovery [6][9]. - Major projects in China, such as the Yaxi Water Conservancy Project and the Xinjiang-Tibet Railway, are expected to boost domestic machinery demand [6][9]. - Key companies in this sector include Sany Heavy Industry, XCMG, and Zoomlion, which are anticipated to benefit from both domestic recovery and international expansion [6][9].

合肥芯碁微电子装备股份有限公司 2025 年员工持股计划第一次持有人会议决议公告 本公司董事会、全体董事及相关股东保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律 责任。 合肥芯碁微电子装备股份有限公司（以下简称"公司"）2025 年员工持股计划第 一次持有人会议于 2025 年 11 月 24 日以现场结合通讯表决的方式召开。会议由公司 董事会秘书魏永珍女士召集和主持，出席本次会议的持有人 125 人，代表 2025 年员 工持股计划份额 36,133,275.40 份，占公司 2025 年员工持股计划总份额的 100%(鉴 于部分员工放弃认购，最终参与认购员工持股计划的员工人数调整为 125 人，总认 购份额不变)。会议的召集、召开和表决程序符合公司 2025 年员工持股计划的有关 规定。会议以记名投票表决方式，审议通过了以下议案： （一） 审议通过《关于设立公司 2025 年员工持股计划管理委员会的议案》 为保证公司 2025 年员工持股计划的顺利进行，保障持有人的合法权益，根据《合 肥芯碁微电子装备股份有限公司 2025 年员工持股计划》（以下 ...

Core Insights - On November 21, Chipone Microelectronics experienced a decline of 6.16% in stock price, with a trading volume of 470 million yuan [1] - The company reported a net financing outflow of 28.93 million yuan on the same day, with a total financing and securities balance of 887 million yuan [1] Financing Overview - On November 21, Chipone Microelectronics had a financing purchase amount of 51.01 million yuan, with a current financing balance of 886 million yuan, representing 6.35% of its market capitalization [1] - The financing balance is above the 80th percentile of the past year, indicating a high level of financing activity [1] Securities Lending Overview - On November 21, the company repaid 3,747 shares in securities lending, with no shares sold, resulting in a lending balance of 95,000 yuan, which is below the 20th percentile of the past year [1] Company Profile - Chipone Microelectronics, established on June 30, 2015, and listed on April 1, 2021, specializes in the research, manufacturing, and sales of direct imaging equipment and related maintenance services, primarily focusing on micro-nano direct writing lithography technology [2] - The company's main revenue source comes from laser direct imaging equipment, accounting for 99.58% of total revenue, with other services contributing 0.42% [2] Financial Performance - For the period from January to September 2025, Chipone Microelectronics achieved a revenue of 934 million yuan, representing a year-on-year growth of 30.03%, and a net profit attributable to shareholders of 199 million yuan, up 28.20% year-on-year [2] Dividend Distribution - Since its A-share listing, Chipone Microelectronics has distributed a total of 177 million yuan in dividends, with 153 million yuan distributed over the past three years [3] Shareholder Structure - As of September 30, 2025, the number of shareholders increased by 105.75% to 20,600, with an average of 6,406 circulating shares per person, a decrease of 51.40% from the previous period [2][3] - Notable changes in institutional holdings include a reduction in shares held by major funds, with some exiting the top ten shareholders list [3]

Group 1 - The article emphasizes that the advanced packaging equipment industry is entering a golden era driven by the AI wave and domestic substitution, with significant growth opportunities arising from the demand for advanced packaging technologies [1][8]. - The global advanced packaging market is projected to grow from $46 billion in 2024 to $79.4 billion by 2030, with a compound annual growth rate (CAGR) of 37% for 2.5D/3D packaging technologies from 2023 to 2029 [7][8]. - The Chinese semiconductor packaging equipment market is expected to reach a sales revenue of 28.27 billion yuan in 2024, reflecting an 18.93% year-on-year growth [12]. Group 2 - The article discusses the rapid development of domestic semiconductor packaging equipment manufacturers in China, such as North Huachuang and Shengmei Shanghai, amidst a competitive landscape dominated by international giants [8][9]. - The demand for advanced packaging technologies is driven by the need for high-density integration and improved chip performance, particularly in AI models, data centers, and high-end consumer electronics [7][8]. - The article highlights the evolution of bonding technologies, with a significant shift towards advanced techniques that enhance integration density and performance, such as hybrid bonding and laser debonding [13][16]. Group 3 - The article outlines the critical role of various semiconductor equipment types, including thinning machines, dicing machines, and die bonders, in the advanced packaging process, emphasizing the need for precision and efficiency [27][28]. - It notes that the laser cutting technology is gaining traction due to its advantages in energy efficiency and adaptability to complex packaging requirements, with the global wafer cutting equipment market expected to grow significantly [26]. - The article also mentions the importance of surface functionalization technologies in enhancing the performance of advanced packaging, particularly in applications like chip-on-wafer and fan-out packaging [35][39].

Investment Rating - The investment rating for the company is "Buy" and is maintained [7]. Core Views - The company reported a revenue of 934 million yuan for the first three quarters of 2025, representing a year-on-year increase of 30.03%. The net profit attributable to the parent company was 199 million yuan, up 28.20% year-on-year. The net profit after deducting non-recurring items was 193 million yuan, reflecting a year-on-year increase of 30.45% [2][5]. - In Q3 2025, the revenue was 279 million yuan, showing a year-on-year growth of 3.98%, while the net profit attributable to the parent company was 57 million yuan, up 4.41% year-on-year. The net profit after deducting non-recurring items was also 57 million yuan, with a year-on-year increase of 15.38% [2][5]. - The company is positioned as a leader in PCB exposure equipment, benefiting from the acceleration of AI expansion and new technology driving growth in both volume and price [2][10]. Summary by Sections Financial Performance - For Q3 2025, the gross margin was 42.15%, an increase of 2.64 percentage points year-on-year, while the net profit margin was 20.34%, showing a slight increase of 0.1 percentage points year-on-year [10]. - The company’s operating cash flow for Q3 was 70 million yuan, a significant improvement compared to the previous year [10]. Market Position and Growth Potential - The company is enhancing its delivery capacity with the commencement of its second-phase production base, which is expected to alleviate previous capacity constraints and support order fulfillment in 2026 [10]. - The advanced packaging business is set to become a second growth curve, with a focus on high-performance direct-write lithography equipment suitable for AI chip manufacturing and advanced packaging [10]. Future Projections - The company is expected to achieve net profits of 290 million yuan, 490 million yuan, and 720 million yuan for the years 2025, 2026, and 2027, respectively, with corresponding price-to-earnings ratios of 52, 31, and 21 times [10].

重要内容提示： 证券代码：688630 证券简称：芯碁微装 公告编号：2025-053 合肥芯碁微电子装备股份有限公司 2025年第三次临时股东会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 本次会议由公司董事会召集，董事、总经理方林先生主持会议。采用现场投 票与网络投票相结合的方式召开。会议的召集和召开程序、出席会议人员的资格、 会议的表决方式与程序均符合《公司法》《上市公司股东大会规则》《上海证券交 易所上市公司股东大会网络投票实施细则》及《公司章程》的有关规定。 （五） 公司董事和董事会秘书的出席情况 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （一） 股东会召开的时间：2025 年 11 月 14 日 （二） 股东会召开的地点：合肥市高新区长宁大道 789 号 1 号楼会议室 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 98 | | --- | --- | | 普通股股东人数 | 98 | | 2、出 ...

北京德恒（合肥）律师事务所 关于 合肥芯基微电子装备股份有限公司 2025 年第三次临时股东会 致:合肥芯碁微电子装备股份有限公司 北京德恒(合肥)律师事务所(以下简称"本所")接受合肥芯碁微电子装 备股份有限公司(以下简称"公司"或"芯碁微装")的委托,本所指派钱方律 师、沙皓然律师(以下合称"本所承办律师")列席了公司于 2025年 11 月 14 日在安徽省合肥市高新区长宁大道 789 号 1 号楼会议室召开的 2025 年第三次临 时股东会(以下简称"本次股东会"),就本次股东会召开的合法性进行见证并 出具本法律意见。 本所承办律师依据本法律意见出具日前已经发生或存在的事实和《中华人民 共和国公司法》(以下简称"《公司法》")、《中华人民共和国证券法》(以 下简称"《证券法》")、《上市公司股东会规则》(以下简称"《股东会规则》") 等现行有效的法律、法规和规范性文件以及《合肥芯碁微电子装备股份有限公司 章程》（以下简称"《公司章程》"）的有关规定出具本法律意见。 见证法律意见 北京德恒(合肥)律师事务所 关于 合肥芯基微电子装备股份有限公司 2025 年第三次临时股东会 见证法律意见。 德合律意字 ...