Core Insights - The PCB (Printed Circuit Board) industry is experiencing growth driven by advancements in AI, high-speed computing, and new energy applications, leading to a trend towards higher layers, density, performance, and efficient transmission [1][4] Market Overview - The global PCB market is projected to grow steadily, with an estimated compound annual growth rate (CAGR) of 5.2% from 2024 to 2029, reaching a market value of approximately $94.66 billion by 2029 [3] - Rigid boards dominate the market, with multilayer boards expected to account for 38.05% of the global PCB market value in 2024, while single/double-sided boards will represent 10.80% [3] Product Segmentation - PCB can be categorized into rigid boards, flexible boards (FPC), and rigid-flex boards, with each type serving different applications based on their characteristics [2] - High-Density Interconnect (HDI) boards are becoming essential in consumer electronics and high-end computing, driven by the demand for miniaturization and high integration [2][3] Technological Trends - The development of AI is significantly reshaping PCB technology, with a focus on high-layer and high-level HDI as core directions for industry evolution [4] - The complexity of PCB production processes is increasing, particularly in exposure, drilling, plating, and hole formation, necessitating high-precision and efficient equipment [4] Investment Opportunities - Companies related to PCB equipment, such as Dazhong CNC, Chipbond Technology, Dingtai High-tech, Dongwei Technology, and Kaige Precision Machinery, are recommended for investment [5]

Market Performance - As of September 18, the photolithography concept index rose by 0.83%, ranking 6th among concept sectors, with 23 stocks increasing in value [1] - Notable gainers included Yongxin Optical, which hit the daily limit, and other companies like Chipbond Microelectronics and Wavelength Optoelectronics, which rose by 7.59%, 7.24%, and 4.54% respectively [1] Sector Comparison - The top-performing concept sectors included F5G concept (+1.45%), Co-packaged Optics (+1.35%), and Copper Cable High-Speed Connection (+1.27%), while sectors like Lead and Zinc saw declines of -3.94% and -3.88% respectively [2] Capital Flow - The photolithography sector experienced a net outflow of 631 million yuan, with 18 stocks seeing net inflows and 5 stocks exceeding 50 million yuan in net inflows [2] - Chipbond Microelectronics led the net inflow with 63.67 million yuan, followed by Zhangjiang Hi-Tech and Fulede with inflows of 58.05 million yuan each [2] Stock Performance - The stocks with the highest net inflow ratios included Fulede (7.22%), Yongxin Optical (7.11%), and Zhongrun Optics (6.44%) [3] - Chipbond Microelectronics had a daily increase of 7.59% with a turnover rate of 10.06% and a net inflow of 63.67 million yuan [3] Decliners - The stocks with the largest declines included Hongtian Co. (-6.81%), Tongfei Co. (-2.87%), and Xuguang Electronics (-2.77%) [5] - Notably, the photolithography sector saw significant outflows from stocks like Wavelength Optoelectronics, which had a net outflow of 152.25 million yuan despite a daily increase of 7.24% [5]

数据显示，国泰基金旗下1只基金重仓芯碁微装。国泰景气行业灵活配置混合（003593）二季度持有股 数20.55万股，占基金净值比例为4.93%，位居第七大重仓股。根据测算，今日浮盈赚取约154.11万元。 国泰景气行业灵活配置混合（003593）成立日期2017年3月20日，最新规模3.31亿。今年以来收益 48.98%，同类排名1010/8172；近一年收益110.45%，同类排名384/7980；成立以来收益217.25%。 国泰景气行业灵活配置混合（003593）基金经理为杜沛。 截至发稿，杜沛累计任职时间5年136天，现任基金资产总规模3.31亿元，任职期间最佳基金回报 106.71%， 任职期间最差基金回报106.71%。 9月18日，芯碁微装涨5.17%，截至发稿，报152.50元/股，成交7.38亿元，换手率3.79%，总市值200.90 亿元。 资料显示，合肥芯碁微电子装备股份有限公司位于安徽省合肥市高新区长宁大道789号1号楼,香港铜锣 湾希慎道33号利园1期19楼1915室，成立日期2015年6月30日，上市日期2021年4月1日，公司主营业务涉 及主要从事以微纳直写光刻为技术核心的直接成 ...

Core Insights - The direct write lithography market is expected to recover in 2024, with a projected growth of 12% year-on-year, reaching a market size of $1.57 billion due to a significant rebound in downstream industries [1][5][7] - The market is driven by the advantages of direct write lithography technology and its expanding application boundaries, particularly in PCB manufacturing, which is the largest application area [1][7] Industry Overview - Direct write lithography, also known as maskless lithography, utilizes a computer-controlled high-precision beam to project patterns directly onto a substrate coated with photosensitive material without the need for a mask [2][5] - The technology integrates various systems, including graphic processing, high-precision displacement platforms, optical systems, and control systems, making it a key device in micro-nano manufacturing [2][5] Market Dynamics - The global direct write lithography equipment market has shown volatility in recent years due to a slowdown in economic growth and pressure on downstream industries [5][6] - The PCB sector is the largest application area for direct write lithography, accounting for 41.1% of the market in 2024, followed by the mask plate sector at 36.6% [7][8] Competitive Landscape - Major players in the PCB direct imaging equipment sector include Israel's Orbotech, Japan's ORC, ADTEC, SCREEN, and domestic companies such as Chipbond and Jiangsu Yingsu [1][5][6] - In the broader semiconductor direct write lithography market, foreign companies dominate, with competitors including Sweden's Mycronic, Germany's Heidelberg, and Japan's SCREEN [1][5][6] Technological Trends - The direct write lithography technology is evolving to achieve finer line widths and higher resolution, driven by the increasing integration and performance demands of downstream electronic products [14][16] - The industry is focusing on improving production yield and balancing the cost of equipment upgrades with production efficiency [17][18] Application Insights - The PCB manufacturing process is complex and requires various specialized equipment, with direct imaging technology becoming the mainstream method due to its advantages over traditional exposure techniques [8][9] - The global PCB market is projected to reach $73.6 billion in 2024, with a growth rate of 5.8%, driven by demand from AI servers and data center equipment [7][8] Future Outlook - The demand for direct write lithography equipment in advanced packaging is expected to grow significantly, with a projected market size of $30 million by 2030 as the technology matures [13][14]

Group 1 - In the first half of the year, 186 A-share listed companies in Anhui achieved a total operating income of 722.08 billion yuan and a total profit of 55.54 billion yuan, with 152 companies making profits, accounting for 81.72% [1][3] - 96 companies reported a year-on-year increase in operating profit, representing over 50% of the total [1][3] - As of September 15, 154 companies in the Anhui sector saw their stock prices rise since the beginning of the year, with 15 companies doubling their market value [3] Group 2 - The "2025 Anhui Listed Companies Investor Online Reception Day" was held, where 77 companies presented their performance and business layout for the first half of the year, responding to nearly a thousand investor inquiries [2][4] - Companies like Anhui Huabei Group are focusing on digital transformation in retail and standardization in agricultural product circulation, aiming to enhance core competitiveness [4] Group 3 - There is a strong investor interest in enhancing market value management, with many companies expressing a desire to improve their market value [5] - Several companies, including Yangguang Electric and Conch Cement, announced mid-term dividends, with Conch Cement planning a dividend payout of 1.266 billion yuan, representing a 29% payout ratio [5] Group 4 - Chip Microelectronics is progressing with its H-share listing application, indicating a significant step in its dual financing strategy [6][7] - The company has been experiencing strong production and sales growth, driven by the demand in AI computing and the electronicization of new energy vehicles [7]

Group 1 - Yihau New Materials plans to reduce its shareholding by up to 1% of the company's total shares, amounting to 165,500 shares, due to personal funding needs [1] - Fuxing Pharmaceutical's subsidiary has received approval for a new indication for its drug, which is used in the treatment of certain types of breast cancer [1][2] - Shantui Co. has submitted its H-share issuance application to the China Securities Regulatory Commission, which has been accepted [3] Group 2 - Sierte's chairman plans to increase his shareholding by an amount between 3 million to 6 million yuan [4] - Borui Pharmaceutical's BGM0504 tablet has received approval for clinical trials in overweight and obese adults [5] - Ganyue Expressway reported vehicle toll service revenue of 349 million yuan for August [6] Group 3 - Chip Microelectronics has submitted its H-share issuance application to the China Securities Regulatory Commission, which has been accepted [7] - Lingrui Pharmaceutical's director plans to reduce his shareholding by up to 200,000 shares, representing 0.0353% of the total shares [8] - Jiahu Energy has adjusted its share repurchase price limit to 11.63 yuan per share [10] Group 4 - Spring Airlines reported a year-on-year increase of 12.23% in passenger turnover for August [11] - Kaida has received an invention patent for a self-calibrating sensor technology [12] - Chuanheng Co. has obtained a new utility model patent aimed at improving industrial waste utilization [14] Group 5 - Huashi Technology received a government subsidy of 2.21 million yuan, accounting for 22.71% of its latest audited net profit [15] - Shanghai Pharmaceuticals' controlling shareholder plans to increase its H-share holdings by up to 74 million shares [16] - Hongrun Construction has won a bid for a significant segment of the Shanghai Metro Line 21 project, valued at 126 million yuan [18] Group 6 - Sanfangxiang plans to invest 100 million yuan to establish a wholly-owned subsidiary focused on green technology [19] - Lao Fengxiang's subsidiaries plan to jointly invest in luxury goods sales and gold refining companies [20][21] - China Eastern Airlines reported an 8.72% year-on-year increase in passenger turnover for August [22] Group 7 - Inner Mongolia First Machinery has signed a railway freight car procurement contract worth 186 million yuan [22] - Jiuqiang Bio has received five invention patents related to diagnostic reagents [24] - Longmag Technology plans to invest 210 million yuan in its second phase project in Vietnam [25] Group 8 - Galaxy Magnetics plans to acquire 100% equity of Kyoto Longtai, with its stock suspended for trading [26] - Jinlong Co.'s controlling shareholder will have 30 million shares auctioned [27] - Haishi Co.'s controlling shareholder has released the pledge on 29.97 million shares [28] Group 9 - Qiu Tianwei plans to reduce its shareholding by up to 1.17% of the total shares [29] - Xiaocheng Technology's directors plan to reduce their shareholding by a total of 0.08% [30] - Victory Co. reported that Sunshine Life Insurance has reduced its shareholding by 4.4 million shares [31] Group 10 - Xindong Technology plans to distribute a cash dividend of 0.156 yuan per share [32] - Huaqin Technology plans to distribute a cash dividend of 0.13 yuan per share [33] - Kexing Pharmaceutical's controlling shareholder intends to transfer 5% of the company's shares [35] Group 11 - Guojin Securities has completed the repayment of its second short-term financing bond for 1.0205 billion yuan [38] - Chunhui Intelligent Control's application for asset acquisition has been accepted by the Shenzhen Stock Exchange [39] - Chaohongji has submitted its H-share issuance application to the Hong Kong Stock Exchange [40] Group 12 - Tianyue Advanced has fully exercised its over-allotment option, involving 716,180 H-shares [40] - Chengfeng Technology's vice president has resigned due to internal adjustments [41] - Yingpais plans to establish a 100 million yuan technology sports industry investment fund [43]

Core Viewpoint - The company, Chipbond Technology, has submitted its application materials for the issuance of overseas listed shares (H-shares) to the China Securities Regulatory Commission (CSRC) [1] Group 1 - The application for H-share issuance indicates the company's intention to expand its capital base and enhance its market presence [1] - This move is part of a broader trend among companies seeking to access international capital markets for growth opportunities [1]

证券代码：688630 证券简称：芯碁微装 公告编号：2025-042 合肥芯碁微电子装备股份有限公司 关于发行境外上市股份（H 股）备案申请材料 获中国证监会接收的公告 公司根据相关规定已向中国证券监督管理委员会（以下简称"中 国证监会"）报送了本次发行上市的备案申请材料，并于近日获中国 证监会接收。 公司本次发行上市尚需取得中国证监会、香港证券及期货事务监 察委员会和香港联交所等相关监管机构、证券交易所的批准、核准或 备案，该事项仍存在不确定性。公司将根据该事项的进展情况依法及 时履行信息披露义务，敬请广大投资者注意投资风险。 特此公告。 合肥芯碁微电子装备股份有限公司董事会 2025 年 9 月 16 日 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依 法承担法律责任。 合肥芯碁微电子装备股份有限公司（以下简称"公司"）已于 2025 年 8 月 31 日向香港联合交易所有限公司（以下简称"香港联交所"） 递交了发行 H 股股票并在香港联交所主板挂牌上市（以下简称"本次 发行上市"）的申请，并于同日在香港联交所网站刊登了本次发行上 ...

Core Viewpoint - The company, Chipbond Technology Co., Ltd. (688630.SH), has submitted its application materials for the issuance of overseas listed shares (H-shares) to the China Securities Regulatory Commission (CSRC), which has recently accepted the application [1] Group 1 - The company is in the process of expanding its capital-raising efforts by seeking to issue H-shares [1] - The application submission is in accordance with relevant regulations [1] - The acceptance of the application by the CSRC marks a significant step in the company's plans for overseas listing [1]

Group 1 - The company, Chipone Microelectronics (688630.SH), has submitted its application materials for the issuance of overseas listed shares (H shares) to the China Securities Regulatory Commission (CSRC) [1] - The application has recently been accepted by the CSRC [1]