Group 1 - The company, Hefei Chip Quasar Microelectronics Equipment Co., Ltd. (Chip Quasar), forecasts a net profit attributable to shareholders of 275 million to 295 million yuan for 2025, representing a year-on-year increase of 71.13% to 83.58% [1] - The expected net profit after deducting non-recurring gains and losses is projected to be between 264 million and 284 million yuan, an increase of 115 million to 135 million yuan compared to the previous year, reflecting a growth of 77.70% to 91.16% [1] - The growth in performance is driven by the explosive growth of global AI computing power and the wave of automotive electronics, which accelerates the PCB industry towards high-layer and high-density technology iterations, leading to sustained demand for high-end lithography equipment [1] Group 2 - The company has achieved multiple monthly deliveries of over 100 units of high-end LDI (Laser Direct Imaging) equipment in the first half of 2025, maintaining a high capacity utilization rate [1] - The expansion of the semiconductor business has become a second growth curve for the company, focusing on advanced packaging, with its WLP2000 wafer-level direct writing lithography equipment and PLP3000 board-level direct writing lithography equipment entering leading packaging and testing companies [1] - The company plans to list on the Hong Kong Stock Exchange to raise funds primarily for R&D upgrades, capacity expansion, overseas sales network construction, and strategic investments, aiming to strengthen R&D and capacity, optimize key component localization, and promote digital upgrades and AI technology integration [2]

Core Viewpoint - Chipbond Microelectronics (芯碁微装) expects a significant increase in net profit for 2025, driven by advancements in high-end PCB and semiconductor sectors [1][2] Financial Performance - The company forecasts a net profit of 275 million to 295 million yuan for 2025, representing a year-on-year growth of 71.13% to 83.58% [1] - The non-recurring net profit is expected to be between 264 million and 284 million yuan, with a growth rate of 77.7% to 91.16% [1] - In Q4 2025, the single-quarter net profit is projected to be between 76.19 million and 96.19 million yuan, showing a year-on-year increase of 12.56 to 16.12 times [1] Market Performance - Since the beginning of 2025, Chipbond Microelectronics' stock price has risen over 190%, closing at 167.62 yuan per share, with a market capitalization of 22.1 billion yuan [2] Business Growth Drivers - The growth is attributed to the company's breakthroughs in high-end PCB and semiconductor fields, with strong demand for high-layer and high-density technology [2] - The company has seen high capacity utilization rates and has received significant orders for its high-precision CO2 laser drilling equipment from leading clients [2] - In the semiconductor sector, the company has secured repeat orders for advanced packaging and board-level packaging equipment, contributing to new growth momentum [2] Product Development - Chipbond Microelectronics has launched its WLP series products, which have helped leading advanced packaging manufacturers achieve mass production of CoWoS-L products, with orders exceeding 100 million yuan [2] Industry Position - As a leader in direct imaging equipment, the company’s products cover various lithography processes from microns to nanometers [3] - The surge in global AI computing demand has accelerated the upgrade and production increase in high-layer PCBs and high-end HDI industries, leading to a significant increase in orders [3] - The company has initiated the construction of a second-phase facility to enhance delivery capacity for high-end direct imaging equipment, addressing the growing demand in AI servers, smart driving, and Mini/Micro-LED sectors [3] Global Strategy - Chipbond Microelectronics is advancing its globalization strategy, exporting equipment to regions including Thailand, Vietnam, Japan, South Korea, and Australia [3] - A subsidiary has been established in Thailand to serve as an operational hub for Southeast Asia, capitalizing on the local PCB industry's growth [3] Future Plans - The company is planning to issue H-shares and list on the Hong Kong Stock Exchange, with the process currently underway [4] - Future business plans focus on upgrading high-end equipment, penetrating multiple application scenarios, and enhancing international competitiveness through localized service networks [4]

证券日报网讯 1月20日，芯碁微装发布公告称，公司预计2025 年年度实现归属于母公司所有者的净利润 为 27，500 万元至 29，500 万元，与上年同期相比，将增加 11，430.47万元至 13，430.47 万元，同比 增长 71.13%至 83.58%。 （文章来源：证券日报） ...

Core Viewpoint - The company, Chipbond Technology, forecasts significant growth in its 2025 annual performance, with net profit expected to reach between 275 million to 295 million yuan, representing a year-on-year increase of 71.13% to 83.58% [2] Group 1: Performance Forecast - The company's net profit attributable to shareholders is projected to be between 275 million to 295 million yuan, indicating a substantial year-on-year growth [2] - The forecasted net profit after deducting non-recurring items is expected to be between 264 million to 284 million yuan, reflecting a year-on-year increase of 77.7% to 91.16% [2] Group 2: Business Focus and Drivers - Chipbond Technology focuses on high-end PCB and semiconductor-related equipment research, production, and sales, with core products including high-end LDI equipment and high-precision CO₂ laser drilling equipment [2] - The growth in performance is attributed to the global explosion of AI computing power and the electronicization of automobiles, which are driving the iteration of the PCB industry [2] - The company has seen strong orders for high-end equipment and high capacity utilization, while the semiconductor equipment segment has received repeat orders and is gradually ramping up business [2] - The commissioning of the second-phase production base further enhances delivery capabilities, and the product matrix and market space continue to expand [2]

证券代码：688630 证券简称：芯碁微装 公告编号：2026-004 合肥芯碁微电子装备股份有限公司 2025 年年度业绩预告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依 法承担法律责任。 一、本期业绩预告情况 （一）业绩预告期间 2025 年 1 月 1 日至 2025 年 12 月 31 日。 （二）业绩预告情况 业绩预计：同步上升 1、经财务部门初步测算，预计合肥芯碁微电子装备股份有限公 司（以下简称"公司"）2025 年年度实现归属于母公司所有者的净利 润为 27,500 万元至 29,500 万元，与上年同期相比，将增加 11,430.47 万元至 13,430.47 万元，同比增长 71.13%至 83.58%。 2、预计 2025 年年度实现归属于母公司所有者的扣除非经常性损 益的净利润为 26,400 万元至 28,400 万元，与上年同期相比，将增加 11,543.22 万元至 13,543.22 万元，同比增长 77.70%至 91.16%。 （三）本次业绩预告未经注册会计师审计 1 二、上年同期业绩情况 （1） ...

Core Viewpoint - Chipbond Microelectronics (688630.SH) forecasts a net profit attributable to shareholders of 275 million to 295 million yuan for the year 2025, representing a year-on-year growth of 71.13% to 83.58% [2] Group 1: Financial Performance - The company expects significant net profit growth driven by continuous breakthroughs and deepening layout in high-end PCB and semiconductor fields [2] - The demand for high-end LDI equipment remains strong, contributing to the overall profit increase [2] - The adoption of high-precision CO laser drilling equipment by leading customers supports the company's growth trajectory [2] Group 2: Operational Developments - The ramp-up of advanced packaging and other semiconductor businesses is expected to enhance revenue streams [2] - The commissioning of the second-phase production base ensures delivery capacity, further supporting operational efficiency [2]

Core Viewpoint - The company, Chipbond Technology, forecasts a significant increase in net profit for the year 2025, driven by advancements in high-end PCB and semiconductor sectors, alongside strong market demand for its products [1] Financial Performance - The projected net profit for 2025 is estimated to be between 275 million to 295 million yuan, representing a year-on-year growth of 71.13% to 83.58% [1] Industry Trends - The rapid growth in global artificial intelligence computing power and the trend towards automotive electronics are driving the PCB industry towards high-layer and high-density technology upgrades [1] - As a leading manufacturer of direct-write lithography (LDI) equipment, the company is well-positioned to meet the evolving market demands, resulting in strong order demand and high capacity utilization [1] Product Development - The company's high-precision CO₂ laser drilling equipment has been adopted by major clients, significantly expanding its product matrix and market reach [1] - In the semiconductor business, equipment for advanced packaging and board-level packaging has received repeat orders and is being delivered, contributing to the growth of this segment [1] Operational Capacity - The successful commissioning of the company's second-phase production base ensures timely delivery of high-end equipment, further supporting the company's performance growth [1]

Group 1 - The core viewpoint of the news is that Chip Quasar Microelectronics has seen a significant increase in stock price, with a rise of 6.17% to 179.88 yuan per share, and a total market capitalization of 23.698 billion yuan [1] - Chip Quasar Microelectronics, established on June 30, 2015, specializes in the research, manufacturing, and sales of direct imaging equipment and related maintenance services, focusing on micro-nano direct writing lithography technology [1] - The company's main revenue source comes from laser direct imaging equipment, accounting for 99.58% of total revenue, with other supplementary services making up 0.42% [1] Group 2 - Hengyue Fund has a significant position in Chip Quasar Microelectronics, with its Hengyue Growth Selected Mixed A Fund holding 240,300 shares, representing 4.67% of the fund's net value, making it the second-largest holding [2] - The Hengyue Growth Selected Mixed A Fund has achieved a year-to-date return of 16.26% and a one-year return of 97.21%, ranking 245 out of 9009 and 230 out of 8164 respectively in its category [2] - The fund manager, Liao Mingbing, has a tenure of 5 years and 192 days, with the best fund return during this period being 95.04% and the worst being -41.96% [3]

Group 1 - The core point of the announcement is that the controlling shareholder and actual controller of the company, Cheng Zhuo, has reduced her shareholding by 510,000 shares, which is 0.38% of the total share capital, triggering a 1% threshold change in equity [3][4]. - After the reduction, the total shares held by Cheng Zhuo and her concerted actors decreased from 46,113,821 shares to 45,603,821 shares, resulting in a change in ownership percentage from 35.00% to 34.62% [3][4]. - This equity change is part of a previously disclosed share reduction plan and does not involve a takeover offer or changes in the source of funds [3][4]. Group 2 - The company emphasizes that this equity change will not significantly impact its governance structure or ongoing operations, nor will it lead to changes in the controlling shareholder or actual controller [3][4]. - The company will ensure compliance with relevant regulations regarding the share reduction and will keep investors informed about any updates [3][4].

证券代码：688630 证券简称：芯碁微装 公告编号：2026-003 合肥芯碁微电子装备股份有限公司 关于控股股东、实际控制人及其一致行动人权益变动 触及 1%刻度的提示性公告 合肥芯碁微电子装备股份有限公司控股股东、实际控制人程卓女士及其一致行动 人保证向本公司提供的信息真实、准确、完整，没有虚假记载、误导性陈述或重大遗漏。 本公司董事会及全体董事保证公告内容与信息披露义务人提供的信息一致。 一、 信息披露义务人及其一致行动人的基本信息 1.身份类别 | | ☑控股股东/实际控制人及其一致行动人 | | --- | --- | | | □其他 5%以上大股东及其一致行动人 | | 投资者及其一致行动人的身份 | □合并口径第一大股东及其一致行动人（仅适用 | | | 于无控股股东、实际控制人） | | | □其他______________（请注明） | 二、 权益变动触及 1%刻度的基本情况 重要内容提示： 权益变动方向 比例增加□ 比例减少☑ 权益变动前合计比例 35.00% 权益变动后合计比例 34.62% 本次变动是否违反已作出的承诺、意向、计划 是□ 否☑ 是否触发强制要约收购义务 是□ 否☑ ...