证券代码：002156 证券简称：通富微电 公告编号：2025-012 通富微电子股份有限公司 2024 年度利润分配预案的公告 本公司及董事会全体成员保证公告内容的真实、准确和完整，没有虚假记载、 误导性陈述或重大遗漏。 一、审议程序 2025 年 4 月 10 日，通富微电子股份有限公司（以下简称"公司"）召开了 第八届董事会第九次会议和第八届监事会第七次会议，审议通过了《公司 2024 年度利润分配预案》，该议案尚需提交股东大会审议通过。 二、2024 年度利润分配预案基本情况 1、经致同会计师事务所（特殊普通合伙）审计，公司 2023 年期末合并报表 中未分配利润为 2,678,105,680.59 元，加上 2024 年度实现的归属于母公司所有 者 的 净 利 润 677,588,312.75 元，减去 2024 年 度 提 取 法 定 盈 余 公 积 金 4,032,774.38 元，减去 2024 年度支付普通股股利 18,211,154.77 元，公司 2024 年期末合并报表中未分配利润为 3,333,450,064.19 元。母公司报表中，母公司 2024 年期末未分配利润为 1,781, ...

Group 1 - The China Securities 500 Quality Growth Index (930939) has shown a strong increase of 1.02% as of April 11, 2025, with notable gains in constituent stocks such as Tongfu Microelectronics (002156) up 9.31%, and Yangjie Technology (300373) up 9.00% [1] - The 500 Quality Growth ETF (560500) also rose by 1.11%, with the latest price reported at 0.91 yuan [1] - Bohai Securities indicates that external uncertainties are becoming more pronounced, and the market's focus will be on how management counters these external impacts with macro policies [1] Group 2 - The management has stated that macro policies will be more proactive to effectively respond to external uncertainties, which is expected to significantly boost economic policies [1] - The report suggests that the influx of stabilizing funds into A-shares will help the market overcome difficulties and stabilize at the bottom [1] - Short-term investment opportunities are highlighted in sectors such as consumer goods due to tariff policies, the non-ferrous metals industry due to supply chain constraints, and defensive sectors like household appliances and banking due to high dividend yields [1] Group 3 - As of March 31, 2025, the top ten weighted stocks in the China Securities 500 Quality Growth Index account for 24.26% of the index, with Chifeng Gold (600988) and Ninebot Company (689009) being the top two [2] - The index is composed of 100 stocks selected for their high profitability, sustainable earnings, and strong cash flow, providing diverse investment options for investors [2] - The detailed performance of individual stocks within the index shows varied results, with Crystal Optoelectronics (002273) increasing by 3.81% and Dong-E E-Jiao (000423) decreasing by 1.11% [4]

Core Viewpoint - The semiconductor sector experienced a significant rally in the afternoon, with nearly 20 stocks hitting the daily limit up, indicating strong investor interest and positive market sentiment towards the industry [1] Group 1: Stock Performance - Companies such as Weijie Chuangxin, Jinghua Micro, SIRUI, Meixin Sheng, Naxin Micro, Fuman Micro, Jiewate, Huahong Company, Shanghai Beiling, Tongfu Microelectronics, and Yingfang Micro all reached the daily limit up [1] - Other stocks like Jingfeng Mingyuan, Guomin Technology, Aiwei Electronics, and Anlu Technology saw increases of over 10% [1]

GenAI的内存解决方案 第 1 部分：能力的变化 所需能力 GenAI 应用需要高速、高带宽且低延迟的内存，以便实时处理海量数据。在需要实时决策和 预测的推理环节，数据的快速访问就显得尤为关键。 GenAI内存解决方案第 2 部分：HBM的竞争态势 内存设计的挑战与解决方案以及内存技术的最新趋势正在塑造高性能计算的未来及其竞争 格局。 竞争态势 技术革新： 具有传统接口的动态随机存取存储器（DRAM）在带宽和延迟方 面 存在局限，因此像高带宽内存（HBM）这类利用硅通孔（TSV）堆叠 DRAM 的 技术，就成为满足这些性能需求的关键解决方案。与内存设计相关的挑战与应 对办法，以及内存技术的新兴趋势，正塑造着高性能计算的未来与竞争格局。 优化策略： 未来，像3D-IC和（或）CoWoS等封装技术的进步，将在智能手 机、PC 等不同领域得到应用。智能手机受空间和成本限制，人们会尝试多种办 法，在不增加成本与空间占用的前提下，降低延迟、减少能耗。 应变准备 ： 目前仍不清楚到 2030 年哪些类型的GenAI模型和应用会流行，以 及具体数量是多少。因此，支持架构层面的进步并构建生态系统，以便能够应 对任何变化，将 ...

Group 1: Core Insights - GenAI applications require high-speed, high-bandwidth, and low-latency memory for real-time data processing, making fast data access critical for decision-making and predictions [2] - The competition landscape in memory technology is evolving, with challenges in memory design and emerging trends shaping the future of high-performance computing [4][6] - Custom HBM (High Bandwidth Memory) is becoming essential for AI systems, with significant growth expected as companies like NVIDIA, Amazon, and Microsoft drive its development [26][28] Group 2: Competitive Landscape - Samsung is lagging in HBM due to conservative actions in advanced testing and packaging, focusing too much on cost while failing to meet customer demands for heat dissipation and power consumption [7] - SK Hynix is leading the market by addressing NVIDIA's power and thermal constraints through innovative memory unit designs and backend processing [7][8] - Micron is entering the HBM market later than competitors, planning to launch HBM3e by 2025, while adopting proven bonding equipment and internal voltage conversion technologies [7][8] Group 3: China's Influence - China's influence in the storage market is expected to grow, depending on the new demand environment shaped by GenAI, technological changes, and U.S.-China policies [9] - By 2024, China's DRAM manufacturer CXMT is projected to account for 13% of global capacity, 6% of shipments, and 3.7% of revenue, with potential growth to match Micron's capacity by 2025 [12] - The Chinese semiconductor industry is working towards domestic supply chains for HBM and DRAM, but faces challenges due to U.S. regulations on advanced equipment [12][18] Group 4: Smartphone Integration - The integration of GenAI with smartphones is a significant development, requiring transformative memory solutions and altering the competitive landscape [11] - Samsung plans to improve HBM3e by Q1 2025, potentially increasing its HBM shipment from 8-9 billion gigabits to 11-12 billion gigabits [11] - China aims for domestic production of HBM3 by 2025, with a focus on self-sufficiency in GPU manufacturing and related technologies [11] Group 5: Future Trends and Innovations - The future of memory solutions will focus on balancing bandwidth, capacity, power consumption, and cost, with ARM's recent strategic adjustments influencing configurations [22] - Innovations like Processing In Memory (PIM) and Wide I/O are expected to enhance performance in high-end smartphones and other applications, although their adoption timelines vary [15][22] - The custom HBM market is projected to grow significantly, with estimates suggesting it could account for 30-40% of the overall HBM market by 2030 [29]

Core Viewpoint - The semiconductor packaging and testing industry is undergoing significant changes as traditional OSAT (Outsourced Semiconductor Assembly and Test) companies face intense competition from foundries like TSMC, Samsung, and Intel, which are entering the advanced packaging sector. Traditional OSAT firms are actively expanding their capabilities and investing in advanced packaging technologies to maintain their market positions [1][16][38]. Group 1: Traditional OSAT Companies' Expansion - ASE Group (日月光) is expanding its advanced packaging capacity by investing $200 million in a FOPLP production line in Kaohsiung, Taiwan, aiming for mass production by the end of the year [2][3]. - ASE has also inaugurated its fourth and fifth factories in Penang, Malaysia, with a total investment of $300 million to meet the growing demand for automotive semiconductors and AI applications [3][4]. - ASE is acquiring two packaging factories from Infineon in the Philippines and South Korea for approximately NT$2.1 billion to enhance its capabilities in automotive and industrial automation applications [5][6]. Group 2: Amkor Technology's Developments - Amkor plans to triple the annual production capacity of its factory in Vietnam from 1.2 billion to 3.6 billion units, reflecting strong growth in the region [7][8]. - The company is investing $2 billion to build an advanced semiconductor packaging and testing facility in Arizona, USA, primarily serving TSMC and Apple [8][9]. Group 3: Longsys Technology's Innovations - Longsys Technology is focusing on high-density packaging technologies, including 2.5D/3D packaging, and has launched a high-end manufacturing project in Jiangsu with a total investment of 10 billion yuan [9][24]. - The company has developed a high-density heterogeneous integration technology platform, XDFOI, which has entered stable mass production and is being applied in high-performance computing and AI fields [24][25]. Group 4: Tongfu Microelectronics' Advancements - Tongfu Microelectronics has established a 2.5D/3D packaging platform and is expanding its capabilities in high-performance computing, with new processes developed for chiplet packaging [28][29]. - The company is also focusing on glass substrate packaging technology to meet the demands of various high-performance chip applications [29][30]. Group 5: Huada Semiconductor's Strategic Moves - Huada Semiconductor is investing in advanced packaging technologies, including SiP and 3D packaging, and has launched a new 2.5D packaging technology platform to cater to AI demands [31][32]. - The company is also developing a 3D Matrix packaging platform that integrates TSV and eSiFo technologies for high-density heterogeneous integration [35][36]. Group 6: Powertech Technology's Expansion - Powertech Technology is expanding its testing capabilities in Japan with a new investment of 5 billion yen to enhance its semiconductor testing and mass production capabilities [13][14]. - The company is evaluating a proposal to establish a high-end chip packaging factory in Japan, aiming to leverage the country's advanced testing technology and stable automotive chip market [14][36].

股票代码：002156 股票简称：通富微电 公告编号：2025-007 深圳至正高分子材料股份有限公司（股票简称：至正股份，股票代码： 603991，以下简称"至正股份"）拟收购AAMI控制权，至正股份将向公司发行股 份收购公司持有的滁州广泰和嘉兴景曜出资额（以下简称"本次交易"）。至正 股份收购AAMI交易涉及向上海证券交易所（以下简称"上交所"）、中国证券监 督管理委员会（以下简称"中国证监会"）等相关监管机构的申请审核注册工作， 公司本次与至正股份的交易作为至正股份收购AAMI交易的一部分，存在可能被暂 停、中止或者取消的风险。 通富微电子股份有限公司 关于受让嘉兴景曜合伙份额 暨与专业投资机构共同投资合伙企业的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 重要内容提示： 通富微电子股份有限公司（以下简称"公司"或"通富微电"）出资2亿 元受让深圳市领先半导体发展有限公司（以下简称"领先半导体"）持有的滁州 广泰半导体产业发展基金（有限合伙）（以下简称"滁州广泰"）146,722,355.58 元出资额（占滁州广泰合伙份额的31.90%），以 ...

证券代码：002156 证券简称：通富微电 公告编号：2025-006 通富微电子股份有限公司 关于收购京隆科技（苏州）有限公司 26%股权 通富微电子股份有限公司（以下简称"公司"或"通富微电"）分别于 2024 年 4 月 26 日和 2024 年 5 月 13 日召开第八届董事会第三次会议及 2023 年度股 东大会，审议通过了《关于收购京隆科技（苏州）有限公司 26%股权的议案》，同 意公司以现金 13.78 亿元（含税金额）收购京元电子股份有限公司（以下简称"京 元 电 子 "） 通 过 KYEC Microelectronics Co.,Ltd. （以下简称" KYEC Microelectronics"或"KYEC"）持有的京隆科技（苏州）有限公司（以下简称 "京隆科技"、"目标公司"）26%的股权。公司与京元电子、KYEC Microelectronics、 苏州工业园区产业投资基金（有限合伙）、苏州欣睿股权投资合伙企业（有限合 伙）、上海国资国企综改试验私募基金合伙企业（有限合伙）、京隆科技签订《京 隆科技（苏州）有限公司股权买卖协议》。本次交易资金来源为自筹资金。本次 交易完成后，公司将持 ...

证券代码：002156 证券简称：通富微电 公告编号：2025-005 通富微电子股份有限公司 一、 减持计划的实施结果 关于持股 5%以上股东减持计划时间届满暨减持结果公告 公司股东国家集成电路产业投资基金股份有限公司保证向本公司提供的信息内容真实、准确、完 整，没有虚假记载、误导性陈述或重大遗漏。 本公司及董事会全体成员保证公告内容与信息披露义务人提供的信息一致。 通富微电子股份有限公司（以下简称"公司"）于 2024 年 10 月 12 日在指定信息披露媒体《证券 时报》和巨潮资讯网（http://www.cninfo.com.cn）披露了《大股东减持股份预披露公告》（公告编 号：2024-061），公司股东国家集成电路产业投资基金股份有限公司（以下简称"产业基金"）计划 自披露减持计划公告日起 15 个交易日后的 3 个月内（即 2024 年 11 月 4 日至 2025 年 2 月 3 日），以 集中竞价或大宗交易方式减持持有的公司股份不超过 45,527,907 股（即不超过公司股份总数的 3%）。 1、股份来源：非公开发行股票方式取得的股份，公司于 2018 年 1 月 22 日披露了《通富微电 ...

证券时报网讯，通富微电（002156）1月24日发布2024年业绩预增公告，预计实现净利润为6.20亿元 ~7.50亿元，净利润同比增长265.91%~342.64%。 通过对2024年业绩预增50%以上的个股走势进行统计发现，预告发布后当日股价上涨的占比66.10%，股 价发布当日股价涨停的有25家。 预告发布后5日股价上涨的占比73.58%。 证券时报•数据宝统计显示，通富微电今日收于28.87元，上涨2.41%，日换手率为4.00%，成交额为 17.39亿元，近5日上涨0.52%。 ...