Core Viewpoint - Chongda Technology (002815.SZ) has announced that its subsidiary, Sandeguan, supplies flexible printed circuit board (FPC) products for the Mate series and foldable smartphones [1] Company Summary - Chongda Technology is involved in the production of flexible printed circuit boards, which are essential components for modern smartphones, including high-end models like the Mate series and foldable devices [1]

Core Viewpoint - Chongda Technology (002815) is currently in the sample testing phase for its 800G optical module PCB, which requires multiple rounds of testing and certification, indicating a lengthy verification process [1] Company Summary - The company has stated that specific customer and project progress cannot be disclosed due to adherence to commercial confidentiality agreements [1]

Group 1 - The company is currently in the customer sample testing phase for its 800G optical module PCB, which requires multiple rigorous testing certifications, leading to a lengthy verification cycle [1] - Due to confidentiality agreements, the company cannot disclose specific customers or project progress, but it is actively advancing related preparations [1]

Group 1 - The company, Chongda Technology, has demonstrated strong capabilities in high-layer PCB technology for AI servers and maintains good cooperation with international clients such as Amphenol [1][3] - The company focuses on the high-end market to enhance its core competitiveness [1] - Chongda Technology's AI server PCBs have passed NVIDIA's GB300 architecture certification, with flagship products like 70-layer high multilayer boards and 800G optical module PCBs breaking overseas monopolies, achieving a single board value 5-8 times that of traditional products [3] Group 2 - The company does not supply NVIDIA directly but instead supplies communication backplane PCBs indirectly through secondary suppliers like Amphenol, marking an important step towards becoming a leader in the PCB industry [3]

Core Viewpoint - 崇达技术 has shown significant stock price movements and financial performance, indicating both growth potential and recent volatility in the market [1][2]. Financial Performance - As of August 29, 2025, 崇达技术 achieved a revenue of 35.33 billion yuan, representing a year-on-year growth of 20.73%. However, the net profit attributable to shareholders decreased by 6.19% to 2.22 billion yuan [2]. - The company has distributed a total of 21.12 billion yuan in dividends since its A-share listing, with 6.65 billion yuan distributed over the past three years [3]. Stock Market Activity - On September 4, 崇达技术's stock price increased by 2.08% to 15.72 yuan per share, with a trading volume of 82.53 million yuan and a turnover rate of 0.72%. The total market capitalization reached 183.89 billion yuan [1]. - The stock has experienced a year-to-date increase of 55.95%, but has seen a decline of 8.55% over the last five trading days [1]. Shareholder Information - As of August 29, 2025, the number of shareholders for 崇达技术 increased by 12.50% to 64,600, with an average of 11,291 circulating shares per shareholder, up by 1.17% [2]. - Among the top ten circulating shareholders, Hong Kong Central Clearing Limited holds 6.96 million shares, an increase of 439,100 shares compared to the previous period [3]. Business Overview - 崇达技术 specializes in the design, research and development, production, and sales of printed circuit boards (PCBs), with its main business revenue composition being 82.83% from PCBs, 10.52% from waste materials and others, and 6.64% from IC substrates [1]. - The company operates within the electronic components sector, specifically in the PCB industry, and is involved in various concept sectors including consumer electronics, specialized new technologies, 5G, and robotics [2].

Core Viewpoint - The company is undergoing a strategic relocation of its Shenzhen factory and personnel, which is progressing smoothly and has not significantly impacted overall production capacity [1] Group 1 - The relocation and personnel transfer are part of a long-term strategy for capacity optimization [1] - The Shenzhen base continues to maintain normal production levels during the transition [1] - The adjustment aims to better align with high-end market demands through the Zhuhai base [1]

Core Viewpoint - The company has decided to exercise its right for early redemption of the convertible bond "崇达转 2" based on current market conditions and its own situation, following the approval from the board of directors [2][5]. Group 1: Convertible Bond Basic Information - The company issued 14 million convertible bonds on September 7, 2020, with a total amount of 1.4 billion yuan [2]. - The bond's conversion period is from March 11, 2021, to September 4, 2026 [2]. - The bond's conversion price has been adjusted multiple times, with the latest adjustment setting it at 10.25 yuan per share [4][5]. Group 2: Early Redemption Details - The early redemption was triggered as the stock price met the condition of being at least 130% of the conversion price for 15 trading days [5]. - The redemption price is set at 100.049 yuan per bond, which includes accrued interest [7]. - The redemption date is scheduled for September 17, 2025, with the last trading day for the bond being September 16, 2025 [7][8]. Group 3: Redemption Procedures - Holders of "崇达转 2" must process their conversion requests through the securities company that holds their bonds [10]. - The minimum unit for conversion is one bond, and any fractional amounts will be settled in cash [10]. - The company will publish the results of the redemption and the delisting announcement following the completion of the redemption [8].

| 证券代码：002815 | 证券简称：崇达技术 | 公告编号：2025-055 | | --- | --- | --- | | 债券代码：128131 | 债券简称：崇达转2 | | 崇达技术股份有限公司 关于提前赎回"崇达转 2"的第八次提示性公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 重要内容提示： 证券代码：002815 证券简称：崇达技术 债券代码：128131 债券简称：崇达转 2 转股价格：人民币 10.25 元/股 1、"崇达转 2"赎回价格：100.049 元/张（含当期应计利息，当期年利率为 2%，且当期利息含税），扣税后的赎回价格以中国证券登记结算有限责任公司深 圳分公司（以下简称"中登公司"）核准的价格为准。 2、赎回条件满足日：2025 年 8 月 22 日 3、"崇达转 2"停止交易日：2025 年 9 月 12 日 4、"崇达转 2"赎回登记日：2025 年 9 月 16 日 5、"崇达转 2"停止转股日：2025 年 9 月 17 日 6、"崇达转 2"赎回日：2025 年 9 月 17 日 7、赎回资金到账日（到达 ...

Group 1 - The company is currently relocating its Shenzhen factory and transferring personnel, with the process proceeding in an orderly manner [2] - The Shenzhen base is still maintaining normal production and has not had a substantial impact on the company's overall capacity [2] - This adjustment is part of the company's long-term strategic capacity optimization, aimed at better aligning with high-end market demand through the Zhuhai base [2]

Group 1 - The core point of the announcement is that "Chongda Convertible Bond 2" will be forcibly redeemed if not converted by the close of trading on September 16, 2025 [1] - After the redemption, "Chongda Convertible Bond 2" will be delisted from the Shenzhen Stock Exchange [1] - Bondholders are advised to release any pledges or freezes on their "Chongda Convertible Bond 2" holdings before the conversion deadline to avoid being redeemed without conversion [1]