Core Viewpoint - The company has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Xinpeisen Technology Co., Ltd. to enhance innovation in the new materials sector, particularly focusing on carbon materials for humanoid robots [1] Group 1: Strategic Cooperation - The collaboration aims to integrate the strengths of all parties in the development and market expansion of key components such as electronic muscles, electronic skin, and joints for humanoid robots [1] - The partnership will leverage Nengsida's advancements in electronic skin technology and Xinpeisen's APU computing servers to support material research and development [1] Group 2: Product Development - The strategic cooperation will facilitate the expansion of applications for carbon material products, including graphene powder, carbon nanotube powder, graphene conductive paste, carbon nanotube conductive paste, and composite conductive paste [1] - The focus will be on accelerating the application process of carbon materials in critical components of humanoid robots, enhancing product performance [1]

Core Viewpoint - The company has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Chipenson Technology Co., Ltd. to enhance the development and market expansion of key materials for humanoid robots [1] Group 1: Strategic Cooperation - The collaboration focuses on integrating the strengths of each party in the development of materials needed for humanoid robot components such as electronic muscles, electronic skin, and joints [1] - The partnership aims to leverage the company's technological and production advantages in carbon materials, while Nengsida has launched several electronic skins for humanoid robots [1] - Chipenson's APU computing servers provide high-speed computing support for various material research scenarios, facilitating the joint efforts in material development [1] Group 2: Product Application and Market Expansion - The strategic cooperation will help the company expand the application scenarios of its carbon material products, including graphene powder, carbon nanotube powder, graphene conductive paste, carbon nanotube conductive paste, and composite conductive paste [1] - The initiative is expected to accelerate the application process of carbon materials in key components of humanoid robots, enhancing product performance [1]

Core Viewpoint - The announcement highlights a strategic cooperation agreement between the company, Suzhou Nengsida Electronics Technology, and its affiliate Guangdong Chipenson Technology, focusing on the development and market expansion of key components for humanoid robots, including electronic muscles, electronic skin, and joints [1] Group 1 - The agreement aims to integrate the strengths of the three parties in the research and development of materials required for key components of humanoid robots [1] - The collaboration will involve the application of carbon materials in the formulation of electronic muscles, electronic skin, and joints, enhancing product performance [1] - The agreement is a framework agreement, with specific cooperation matters to be approved and disclosed according to relevant regulations [1]

Group 1 - The company, Dao Shi Technology, has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Chipenson Technology Co., Ltd. to focus on innovation in the new materials sector [1] - Dao Shi Technology has established technical and production advantages in carbon material products, while Nengsida has launched several electronic skins for humanoid robots [1] - The collaboration aims to integrate the strengths of all parties to develop and market key components such as electronic muscles, electronic skin, and joints for humanoid robots, enhancing product performance through the application of carbon materials [1] Group 2 - For the fiscal year 2024, Dao Shi Technology's revenue composition is projected to be 99.97% from manufacturing and 0.03% from other sources [1] - As of the report, Dao Shi Technology has a market capitalization of 13.9 billion yuan [1]

Core Viewpoint - Dao's Technology (300409) has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Chip Peisen Technology Co., Ltd. to enhance innovation in the new materials sector, particularly focusing on carbon materials for humanoid robots [1] Group 1: Strategic Cooperation - The agreement aims to integrate the strengths of the three companies in the development and market expansion of key components such as electronic muscles, electronic skin, and joints for humanoid robots [1] - Dao's Technology has established technical and production advantages in carbon material products, while Nengsida has launched multiple electronic skin products for humanoid robots [1] - Chip Peisen's APU computing servers provide high-speed computing support for various material research scenarios, facilitating the collaboration [1] Group 2: Focus on Carbon Materials - The collaboration will focus on applying carbon materials in the formulation of key components for humanoid robots, enhancing product performance [1]

Group 1 - The core point of the article is the strategic cooperation agreement signed between the company, Suzhou Nengsida Electronic Technology Co., Ltd., and its affiliate Guangdong Chip Peisen Technology Co., Ltd. to enhance the development and market expansion of key components for humanoid robots [1] - The collaboration will focus on integrating strengths in the research and development of materials needed for electronic muscles, electronic skin, and joints of humanoid robots [1] - The agreement serves as a framework for long-term cooperation, guiding future specific collaboration matters that will follow relevant approval procedures and information disclosure obligations [1]

Core Viewpoint - The company, Daoshi Technology, has signed a strategic cooperation agreement with Suzhou Nengsida Electronic Technology Co., Ltd. and its affiliate Guangdong Chiperson Technology Co., Ltd. to enhance the development and market expansion of key components for humanoid robots [1] Group 1 - The collaboration will focus on integrating each party's strengths in the research and development of materials needed for electronic muscles, electronic skin, and joints in humanoid robots [1] - The agreement aims to apply carbon materials in the formulation of key component materials for humanoid robots, thereby improving product performance [1] - This framework agreement serves as a guiding document for the long-term cooperation among the three parties, with specific cooperation matters to follow relevant approval procedures and information disclosure obligations [1]

关于签订战略合作框架协议的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有 虚假记载、误导性陈述或重大遗漏。 特别提示： 证券代码：300409 证券简称：道氏技术 公告编号：2025-082 广东道氏技术股份有限公司 1.广东道氏技术股份有限公司（以下简称"道氏技术"或"公司"）本次签订 《战略合作协议》，不会对公司本年度财务状况及经营业绩构成重大影响，如 后续具体合作对公司当年度业绩有重大影响将另行公告。 2.公司最近三年内签署的框架性协议或意向性协议均在正常履行中。 3.根据相关法律法规，本次签署《战略合作协议》无需提交公司董事会或 股东大会审议，也不构成《上市公司重大资产重组管理办法》规定的重大资产 重组事项。 一、协议签署概况 近日，公司与苏州能斯达电子科技有限公司（以下简称"能斯达"）及关联 方广东芯培森技术有限公司（以下简称"芯培森"）签署了《战略合作协议》。 公司聚焦新材料领域创新，已在碳材料产品上具备技术和生产优势，能斯达已 推出多款电子皮肤并应用于人形机器人，芯培森研发的APU算力服务器为多个 材料研发场景提供高速算力支撑，三方将整合各自优势，围绕人形机器人电子 肌肉、 ...

Summary of the Conference Call for Dow's Technology and New Bessen Company and Industry Overview - **Company**: Dow's Technology - **Industry**: Advanced Materials and Computing Technology Key Points and Arguments Production and Financial Performance - Dow's Technology expects significant growth in cathode copper shipments, increasing from 40,000 tons in 2023 to nearly 70,000 tons by the end of 2024 [2][3] - The net profit attributable to shareholders for the first half of 2025 is projected to be between 220 million to 240 million, representing approximately 100% year-on-year growth, primarily driven by the strategic resources department and the expansion of cathode copper production [3] Collaboration with New Bessen - Dow's Technology and New Bessen established the Guangdong Heqi Atomic Computing Center to leverage New Bessen's APU computing power for accelerating the R&D of key materials such as single-walled tubes, silicon-carbon anodes, and solid-state electrolytes [2][4] - The center aims to enhance R&D efficiency, significantly reducing the development cycle from years to months and lowering labor costs [4] APU Technology and Market Potential - New Bessen's APU chips, based on a non-Von Neumann architecture, overcome traditional storage wall bottlenecks, significantly improving computational speed and reducing power consumption [6] - The APU is expected to capture a substantial share of the supercomputing service market, estimated to reach 46.6 billion yuan in 2025, with a compound annual growth rate of about 20% [9][20] - The potential market for digital twin applications in materials R&D could reach hundreds of billions, driven by the APU's ability to enhance computational capabilities [9][21] Applications and Advantages of APU - The APU is designed for atomic-level scientific calculations, providing significant speed improvements over traditional CPUs and GPUs, thus enhancing research efficiency in various fields, including biochemistry and drug development [12][13] - The APU's lightweight design allows for high-performance computing with lower hardware resource consumption, creating a strong technological barrier and intellectual property protection [22] Transition and User Experience - Transitioning from traditional CPU/GPU to APU is designed to be seamless, requiring minimal changes in existing scripts, thus lowering the barrier for users [15][16] - The APU can be integrated into existing systems without the need for a complete ecosystem overhaul, facilitating easier adoption by research institutions and companies [16] Future Developments and Impact - The second-generation APU, expected to launch in 2026, will further enhance performance, potentially transforming the materials R&D paradigm by reducing reliance on expensive experimental methods [20][21] - The introduction of quantum computing in carbon nanotube research has significantly improved quality parameters and reduced development costs, showcasing the APU's impact on efficiency [23] Energy Efficiency and Sustainability - The new computing center aims to address speed and energy consumption issues, achieving significant energy efficiency improvements through an integrated storage-computation chip architecture [27] Strategic Vision - The joint venture, Guangdong Heqi, is structured with Dow's Technology holding 80% and New Bessen 20%, with plans for potential nationwide expansion based on market conditions [17] Additional Important Insights - The APU's application in various fields, including environmental science and geology, highlights its versatility and potential for broad industry impact [12][13] - The focus on physical AI and its integration with atomic-level simulations aims to revolutionize material design and optimization processes [25][26]

参会董事经认真审议，依照《公司章程》及相关法律法规通过以下决议： 证券代码：300409 证券简称：道氏技术 公告编号：2025-079 广东道氏技术股份有限公司 第六届董事会2025年第10次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 一、董事会会议召开情况 广东道氏技术股份有限公司（以下简称"公司"）第六届董事会 2025 年第 10 次会议的通知于 2025 年 7 月 25 日以电子邮件、电话的方式向全体董事发出，全 体董事一致同意豁免通知期限，会议于同日以通讯的方式召开。本次会议应出席 董事 8 人，实际出席董事 8 人，全体董事以通讯方式参加会议。本次会议由董事 长荣继华先生主持，公司监事余祖灯先生、葛秀丽女士、徐伟红女士，副总经理 刘鑫炉先生，财务总监彭小内先生及董事会秘书潘昀希女士列席了本次会议。本 次会议的召开及表决符合《中华人民共和国公司法》及《公司章程》等的有关规 定，会议合法有效。 二、董事会会议审议情况 1、第六届董事会 2025 年第 10 次会议决议； 2、独立董事专门会议决议； 3、保荐机构的核查意见。 （一） ...