Core Viewpoint - The rapid increase in global data traffic driven by technologies such as 5G, artificial intelligence, and cloud computing necessitates the upgrade of data centers to higher speeds like 400G, 800G, and future 1.6T, leading to significant challenges in thermal management due to increased power density and heat generation in optical modules [2]. Group 1: Thermal Management Challenges - The interface thermal resistance is a major bottleneck in the heat dissipation path of optical modules, primarily due to the highly integrated internal structure and minimal distance between heat sources and the casing [3]. - Microscopic surface irregularities and trapped air in gaps create thermal insulation layers, severely affecting heat dissipation and leading to increased chip temperatures, signal degradation, and potential device failure [3]. Group 2: Innovative Solutions by Allied - Allied (stock code: 301419) has introduced the TGEL-SP901, a one-component thermal gel with a thermal conductivity of 9W/(m·K), designed to meet the urgent cooling needs of high-density heat flow applications in optical modules and other high-power electronic devices [5][8]. - The TGEL-SP901 has passed rigorous environmental reliability tests, demonstrating stability in performance after 1000 hours of aging under extreme conditions [7][14]. Group 3: Product Features and Advantages - The TGEL-SP901 offers ultra-high thermal conductivity, effectively addressing heat dissipation challenges for chips exceeding 200W [8]. - It is reliable and durable, showing no oil separation or cracking after extensive aging tests, ensuring long-term reliability throughout the device lifecycle [8]. - The gel's soft and low-stress properties allow it to fill tiny gaps while exerting minimal stress on sensitive components, providing comprehensive protection [8]. - It is compatible with modern automated production lines, featuring excellent dispensing performance without stringing or residue [8][11]. Group 4: Application Scenarios - Typical applications for TGEL-SP901 include high-speed optical modules (400G/800G/1.6T), DSP chip cooling, and laser TOSA cooling [16]. - It also provides overall cooling solutions for 5G front-haul and mid-haul optical modules (25G/50G PAM4) and for co-packaged optics involving silicon photonic chips and driver chips [17][18]. Group 5: Company Background and Expertise - Established in 2004, Allied is a global supplier of communication device components, focusing on R&D, production, and sales, with a commitment to providing advanced thermal management solutions [19]. - The company has successfully applied its thermal materials in various optical module products ranging from 100G to 800G, demonstrating a deep understanding of customer needs and industry pain points [21].

Group 1 - The company has developed various thermal management products such as heat pipes, uniform temperature plates, water cooling plates, and finned heat sinks, leveraging its technological expertise in the thermal conduction and dissipation field [2] - Some of these thermal products are already in mass production and supply [2]

Group 1 - The company Aled has responded to investor inquiries regarding its liquid cooling heat exchanger products, which include heat pipes, temperature equalization plates, water cooling plates, and finned heat exchangers [2] - Some of these products are already in mass production and supply [2]

Group 1 - The company emphasizes the importance of technology research and development as well as intellectual property protection [2] - The company is actively laying out technology patents and has taken the lead in formulating the group standard for "Ultra-thin (VC) Temperature Equalization Plates for Consumer Electronics" [2] - The company's efforts are aimed at optimizing product performance and maintaining technological leadership [2]

证券日报网讯阿莱德9月4日在互动平台回答投资者提问时表示，产品毛利率是应用领域、市场定位、产 品结构、成本控制、规模效应等多种因素综合作用的结果。公司遵循与客户合作共赢的原则，追求并保 持合理且可持续的毛利率水平。 （文章来源：证券日报） ...

Core Viewpoint - The company Alade (301419) has confirmed that its liquid cooling heat exchanger products, including heat pipes, temperature equalization plates, water cooling plates, and finned heat exchangers, are already in mass production and supply [1] Group 1 - The company's product range includes heat pipes, temperature equalization plates, water cooling plates, and finned heat exchangers [1] - Some of the products have already entered mass supply [1]

Group 1 - The company Alede stated that its thermal conductive products have a wide range of application scenarios [2] - The company will provide customized solutions based on customer needs [2]

Core Viewpoint - The company is committed to providing comprehensive thermal management solutions and actively promotes the application of its products across various industries [2]. Group 1 - The company emphasizes strict compliance with legal and regulatory requirements [2]. - The company will share information with investors through announcements or regular reports [2]. - Investors are advised to refer to the official information disclosed by the company in designated media [2].

Group 1 - The company Alede responded to investor inquiries on September 2, indicating that the application scenarios of its existing products can be referenced in the product introduction section of its periodic reports [2]

Group 1 - The company currently does not have any products directly applicable to CPO (Chip-on-Plate) technology [2] - Huagong Technology is a customer of the company, but specific details about the cooperation cannot be disclosed without permission [2]