来源：内容 编译自 semiengineering 。 半导体封装的下一个重大飞跃将需要一系列新技术、新工艺和新材料，但它们将共同实现性能的数量 级提升，这对于人工智能时代至关重要。 并 非 所 有 这 些 问 题 都 已 得 到 彻 底 解 决 ， 但 最 近 的 电 子 元 件 技 术 大 会 (ECTC) 让 人 们 得 以 一 窥 自 ChatGPT 的推出震惊科技界以来，过去几年中取得的巨大进步。AMD、台积电、三星、英特尔以及 众多设备供应商详细介绍了混合键合、玻璃芯基板、微通道冷却或直接冷却以及背面电源方案散热等 方面的改进。 AMD 高级副总裁兼企业研究员 Sam Naffziger 在一次关于人工智能计算的演讲中表示："人工智能 改变超级计算机/高性能计算领域的方式令人惊叹。" ChatGPT 和 Gemini 吸收了整个互联网数据并 用于训练模型，但高质量的文本数据已被完全消耗。人工智能变得更加智能的方式是通过所谓的训练 后测试时计算（或思维链推理）的方法。在这一过程中，模型相互检验，生成合成数据并迭代响应， 最终产生更周全的结果。尽管每一次智能的提升都具有巨大的价值，但要获得智能的线性回 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 近日，英特尔计划关闭汽车业务并裁员的新闻引发关注，为其近年来的频频调整再添沉重一笔。 这位曾引领行业的半导体巨头，正深陷转型的"至暗时刻"，步履维艰。 与此同时，在科技界的另一端：苹果公司正值自研PC芯片问世五周年之际，宣布macOS 26 Tahoe将 是最后一个支持英特尔芯片的macOS版本。这意味着从明年开始，苹果桌面操作系统的主要新版本将 只能在搭载Apple Silicon芯片的 Mac上运行。 不难判断，这不仅标志着苹果自研芯片的成功，更悄然加速了整个PC处理器行业的变革浪潮。 苹果在PC芯片领域的深耕与突破，正以前所未有的力度冲击着以x86架构为核心的PC处理器市场格 局。 这股力量，也正在不可避免地撼动着英特尔赖以生存的x86 PC处理器业务的根基，为其严峻的 挑战增添了新的强劲变量。 x86 PC霸主的辉煌与困境 回顾历史，在PC处理器芯片行业发展的漫长征途中，悄然上演了一场场跌宕起伏的技术竞赛。 早在1971年，英特尔就推出首款微处理器4004，随后不断进化，到1978年发布了16位处理器8086。 1981年，蓝色巨人IBM选择将8086衍 ...

Supermicro's BigTwin® Multi-Node Server with 5th Gen Intel® Xeon® Scalable Processors is now certified by Intel Server system design supports OCP immersion guidelines that enables industry-wide compatibility SAN JOSE, Calif., June 30, 2025 /PRNewswire/ -- Super Micro Computer, Inc. (SMCI), a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is announcing an industry immersion cooling certification for Supermicro's BigTwin Server with 4th and 5th Gen Intel Xeon Scalable Processors from ...

Supermicro BigTwin System Certified for Immersion Cooling Supermicro BigTwin System Certified for Immersion Cooling "Supermicro's collaboration with Intel is a long-standing, strategic association that combines Intel's cutting-edge processor technologies with Supermicro's high-performance building block solutions, including AI, HPC, intelligent edge/IoT, networking, and storage," said Ray Pang, Senior Vice President of Technology Enablement, Supermicro. "Certifying our BigTwin server for immersion cooling w ...

Key Takeaways INTC is exiting its automotive business and laying off 15-20% of its global workforce to reduce expenses. The job cuts impact over 100 roles at HQ, including senior engineers and tech leads in CPU and GPU design. Intel aims to streamline operations and bolster research and development for its core IDM 2.0 manufacturing.Intel Corporation (INTC) is reportedly winding up its automotive architecture business and laying off a significant number of employees as part of its broader restructuring pr ...

Group 1 - The core concept of hybrid bonding technology is gaining traction among major semiconductor companies like TSMC and Samsung, as it is seen as a key to advancing packaging technology for the next decade [2][4][10] - Hybrid bonding allows for high-density, high-performance interconnections between different chips, significantly improving signal transmission speed and reducing power consumption compared to traditional methods [5][11] - The technology is particularly relevant for high bandwidth memory (HBM) products, with leading manufacturers like SK Hynix, Samsung, and Micron planning to adopt hybrid bonding in their upcoming HBM5 products to meet increasing bandwidth demands [10][12] Group 2 - TSMC's SoIC technology utilizes hybrid bonding, achieving a 15-fold increase in chip connection density compared to traditional methods, which enhances performance and reduces size [14][15] - Intel has also entered the hybrid bonding space with its 3D Foveros technology, which significantly increases the number of interconnections per square millimeter, enhancing integration capabilities [19] - SK Hynix and Samsung are actively testing and planning to implement hybrid bonding in their next-generation HBM products, with Samsung emphasizing the need for this technology to meet height restrictions in memory packaging [20][22] Group 3 - The global hybrid bonding technology market is projected to grow from $123.49 million in 2023 to $618.42 million by 2030, with a compound annual growth rate (CAGR) of 24.7%, particularly strong in the Asia-Pacific region [22]

我是芯片超人花姐，入行20年，有50W+芯片行业粉丝。 有很多不方便公开发公众号的， 关于芯片买卖、关于资 源链接等， 我会分享在朋友圈 。 扫码加我本人微信 一周大事件 行业风向前瞻 1、 紫光展锐启动IPO辅导 2、 英特尔将关停汽车业务 3、 中国台湾封装厂群丰科技宣告破产 4、 受人工智能需求提振 美光科技发布强劲业绩预测 5、 业内称部分显卡租赁价格较年初高点"腰斩" SEMI：AI驱动产业加速扩张 2028年半导体月产能将达到每月1110万片晶圆 SEMI公布了其最新的300mm （12英寸） 晶圆厂展望报告的调查结果，显示全球半导体制造业 预计将保持强劲势头，预计从2024年底到2028年，产能将以 7%的复合年增长率（CAGR）增长 ，达到 每月1110万片晶圆 （wpm）的历史新高。这一增长的关键驱动力是先进制程产能（7nm 及以下）的持续扩大，预计将增长约69%，从2024年的85万wpm增至2028年的历史高点140万 wpm——复合年增长率约为14%，是行业平均水平的两倍。 （ SEMI ） 机构：Q1全球半导体晶圆代工2.0市场收入722.9亿美元 同增13% 市调机构Counter ...

公众号记得加星标⭐️，第一时间看推送不会错过。 AMD 的成功始于其 Zen 架构。由于英特尔在推出 Sapphire Rapids 时遭遇重大延误和问题，AMD 的市场份额迅速从 2020 年的 10% 左右上升至 2021 年和 2022 年的 20%以上 。 IDC 和 Mercury Research 的专家表示，这一趋势将会加速。到 2025 年底，AMD 的收入市场份额 预计将升至 36%，英特尔的份额将进一步降至 55% 左右。基于 ARM 的服务器处理器虽然仍不到 10%，但也开始取得显著进展，逐步抢占市场份额。 展望未来，到2027年，AMD的市场份额可能达到40%，而英特尔预计将跌破象征性的50%门槛。 ARM处理器可能会继续稳步增长，市场份额可能达到10%至12%。分析师预测，到2028年，AMD和 英特尔可能会平起平坐——这将标志着该行业的一个重大转折点。 值得注意的是，这些变化主要反映的是营收，而非处理器的销量。AMD 在高端高端产品的销售方面 尤其成功，而英特尔凭借价格更亲民的服务器 CPU 仍然占据着销量主导地位。 这一趋势短期内似乎不太可能逆转。AMD 强大的产品路线图和持续的 ...

What did We Learn from Our China Industrial Plant Tour? CITI'S TAKE On our industrial tour 24-26 Jun we met not only with UBTECH (9880.HK), but also with humanoid robot supply chain companies Orbbec (688322.SS), Wolong (600580.SS), and Bozhon (688097.SS), which cooperate with leading Chinese humanoid robot maker Zhiyuan Robot, or AgiBot (智元机器人). We also met with Rongtai (603119.SS), Shuanghuan (002472.SZ), and Hengli (601100.SS), which cooperate with the leading US NEV/humanoid robot maker. We summarize our ...

Investment Rating - Industry investment rating: Overweight [1] Core Views - The report highlights the strong momentum in AI development both domestically and internationally, suggesting potential investment opportunities in the sector [4][43] - OpenAI has opened access to its deep research model API, providing developers with powerful tools for tasks requiring advanced reasoning and real-time information [3][46] - The Hong Kong government has introduced a regulatory framework for stablecoins, which may enhance financing options for companies in China [4] Market Review - From June 23 to June 27, 2025, the Shanghai Composite Index rose by 1.91%, the ChiNext Index increased by 5.69%, and the CSI 300 Index saw a 1.95% rise. The Hang Seng Tech Index and Nasdaq Index both experienced gains of 4.06% and 4.25%, respectively [2][23] - The AI index increased by 5.24%, while the computer index rose by 7.7%, indicating strong performance in these sectors [23] AI Developments - OpenAI's deep research model API is now available, which includes features like automated web search and data analysis, enhancing the capabilities for developers [3][43] - Alibaba's Tongyi Qianwen launched a new multimodal model, Qwen VLo, which is designed for precise control in generating long text passages [4][45] - Tencent's Hunyuan-A13B model has been released, boasting 80 billion parameters with a focus on efficiency and cost-effectiveness [4][44] Semiconductor Sector - Micron reported a revenue of $9.301 billion for Q3 of fiscal year 2025, marking a 15.5% quarter-over-quarter increase and a 36.56% year-over-year increase, with DRAM revenue reaching a historical high [7][48] Automotive Sector - Tesla's Model Y has achieved fully autonomous delivery from factory to customer, marking a significant milestone in self-driving technology [8] E-commerce Developments - Amazon plans to expand its same-day and next-day delivery services to over 4,000 small towns and rural communities in the U.S. by the end of 2025, with an investment of approximately $4 billion [9]