T-布真的缺的不行，行业从未有这么多终端大客户来布厂抢货。 1月14日英伟达CEO黄仁勋赴日本亲自拜访日东纺（Nittobo），罕见合影下足以证明终端客户对于布的重视。 理论上布的厂商和终端还隔着PCB/CCL，难以直接接触，商业的供给紧缺是出现这一罕见现象的原因。 【宏和科技】业绩预告：业绩持续高增，景气兑现起点——【国联民生军工】 # 公司公告2025年业绩预告，全年预计实现归母净利润1.93-2.26亿元，同比高增745%-889%，扣非归母净利润 1.87-2.19亿元，同比高增3377%-3969%，其中单Q4预计实现归母净利润5389-8669万元，同比增长258%-475%，环 比增长4.7%-68.6%。 # T-glass严重缺货的稀缺卡 【宏和科技】业绩预告：业绩持续高增，景气兑现起点——【国联民生军工】 # 公司公告2025年业绩预告，全年预计实现归母净利润1.93-2.26亿元，同比高增745%-889%，扣非归母净利润 1.87-2.19亿元，同比高增3377%-3969%，其中单Q4预计实现归母净利润5389-8669万元，同比增长258%-475%，环 比增长4.7%-68.6% ...

随着AI快速普及，x86生态系统作为全球广泛部署的高性能计算架构的重要性日益凸显，核心市场的基本面需求保 持稳健。 交易完成后，Zinsner直接持有247，392股英特尔股票。 尽管面临行业供应短缺的挑战，英特尔2025年第四季度财报营收、毛利率和每股收益均超出预期，2025全面营收 529亿美元，与去年持平，2026年第一季度营收预计达到117亿美元至127亿美元。 ✔ #英特尔CFO增持近25万美元股票、AI驱动市场需求保持强劲、CPU价格计划上调10-15%【国海计算机·0128】 ✔#英特尔CFO回购249，985美元股票，是2024年以来首次内部人士购买 英特尔CFO Zinsner于2026年1月26日以每股42.50美元的价格购入5，882股普通股，交易总额为249，985美元。 交易完成后，Zinsner直接持有247，392股英特尔股票。 #英特尔CFO增持近25万美元股票、AI驱动市场需求保持强劲、CPU价格计划上调10-15%【国海计算机·0128】 ✔#英特尔CFO回购249，985美元股票，是2024年以来首次内部人士购买 英特尔CFO Zinsner于2026年1月26日以每股4 ...

Core Insights - The semiconductor industry is shifting focus from process technology to advanced packaging as AI chip demand surges and high bandwidth memory (HBM) becomes more prevalent [2][4] - Gartner predicts a 21% growth in the global semiconductor market by 2025, reaching approximately $793.45 billion, with advanced packaging technology becoming a key growth driver [2] - Major players like TSMC, Intel, and Samsung are intensifying their R&D and investments in advanced packaging, leading to heightened competition [2][4] TSMC's Innovations - TSMC's WMCM (Wafer-Level Multi-Chip Module) technology is set to revolutionize packaging for Apple's A20 chip, with mass production expected by the end of 2026 [3] - WMCM integrates memory with CPU, GPU, and NPU on a single wafer, significantly improving signal transmission and thermal performance while reducing costs [3][4] Intel's Strategy - Intel is showcasing its glass substrate technology combined with EMIB (Embedded Multi-Die Interconnect Bridge), aiming to redefine multi-chip interconnect rules [5][9] - The new packaging sample features a large size and advanced stacking architecture, addressing bandwidth limitations for AI accelerators and high-performance computing [5][8] Samsung's Approach - Samsung is focusing on thermal management innovations with its Heat Pass Block (HPB) technology, enhancing heat dissipation in mobile SoCs [10][12] - HPB technology reduces thermal resistance by 16% and lowers chip operating temperatures by 30%, addressing performance throttling in high-load scenarios [12][13] Advanced Packaging Market Trends - The advanced packaging market is characterized by multiple competing technologies, with 2.5D/3D packaging expected to see a compound annual growth rate of 23% from 2023 to 2029 [15] - TSMC's CoWoS capacity is projected to double by 2026, primarily serving major clients like NVIDIA [15][17] Future Directions - Material innovation is crucial for advanced packaging, with glass substrates emerging as a viable alternative to organic substrates due to their superior thermal stability and wiring density [29][30] - Heterogeneous integration is becoming mainstream, allowing for the combination of different chip types within a single package, enhancing performance and efficiency [31][32] - Thermal management is evolving to address the increasing power density of chips, with solutions like HPB setting new benchmarks for packaging-level heat management [33] - Photonic-electronic integration (CPO) is anticipated to revolutionize data transmission, addressing bandwidth and power consumption challenges in data centers [34]

Intel (NASDAQ: INTC) stock recently got hit with a major pullback. The company posted its fourth-quarter results on Jan. 22 and delivered sales and earnings that came in ahead of the market's expectations. The semiconductor player posted non-GAAP (generally accepted accounting principles) adjusted earnings of $0.15 per share on sales of $13.7 billion, beating the average analyst forecast for per-share earnings of $0.08 on sales of $13.4 billion. On the other hand, the company's forward guidance came in be ...

明星科技股分化，英伟达涨1.59%，谷歌涨0.38%，微软涨0.22%，特斯拉跌0.10%，Meta，亚马逊和苹果跌 逾0.6%，苹果跌0.7%，甲骨文跌1.20%。 纳斯达克中国金龙指数涨0.32%，阿里巴巴涨1.70%，网易涨1.46%，百度涨0.02%，京东跌0.92%，拼多多 跌3.84%。 2026.01. 29 本文字数：1315，阅读时长大约2分钟 作者 | 第一财经 樊志菁 周三美股涨跌互现，投资者消化最新美联储利率决议，并等待多家科技巨头盘后公布业绩。截至收盘，道指 涨12.19点，涨幅为0.02%，报49015.60点，纳指涨0.17%，报23857.45点；标普500指数微跌0.01%，报 6978.03点，盘中历史首次突破7000点大关。 半导体设备巨头阿斯麦高开低走跌2.1%，公司2025年第四季度净销售额达97亿欧元，创纪录新高，超出市 场预期。受人工智能芯片制造产能投资扩大推动，公司2025年第四季度的订单额达132亿欧元，是分析师平 均预期的2倍。阿斯麦还上调了业绩展望，预计2026年全年销售额将在340亿欧元至390亿欧元之间，而分析 师的预期为350亿欧元。 北京时间周四凌 ...

Intel (NASDAQ:INTC), designs and manufactures microprocessors and related technologies, closed Wednesday at $48.78, up 11.04%. The stock moved higher after reports of prospective Nvidia and Apple foundry deals and insider buying. Investors are watching whether these partnerships can offset earlier concerns about Intel’s 2026 outlook.Trading volume reached 200 million shares, about 107% above its three-month average of 96 million shares. Intel IPO'd in 1980 and has grown 14,885% since going public. How the ...

Core Insights - Intel's stock surged by 11% on Wednesday, reflecting a broader rally in chip and AI-related stocks, with shares gaining nearly a third of their value in 2026 so far [1][1][1] - Reports suggest that Nvidia and Apple are considering shifting some of their 2028 chip production to Intel, which could signify new client acquisitions for Intel's manufacturing business [1][1][1] Intel's Position - The potential deals with Nvidia and Apple would mark a significant advancement for Intel, which has faced challenges in attracting new customers for its manufacturing services [1][1] - Intel's CEO mentioned ongoing engagement with prospective customers evaluating its manufacturing processes, although it remains unclear if these include Nvidia and Apple [1][1] Market Context - The report from DigiTimes indicates that U.S. manufacturing mandates and tariff pressures may favor Intel in securing these contracts [1][1] - TSMC, the world's largest chip manufacturer, may view the anticipated order diversions to Intel as more of an opportunity than a threat, potentially easing regulatory scrutiny and U.S. political pressure [1][1]

周三美股成交额第1名英伟达收高1.58%，成交278.73亿美元。周三美股芯片板块普涨。据媒体报道，英 伟达和亚马逊可能参与了OpenAI的融资轮。 第2名特斯拉收跌0.10%，成交214.2亿美元。周三美股收盘后，特斯拉报告第四季度每股收益0.24美 元，上年同期0.66美元；第四季度调整后每股收益0.50美元，上年同期0.73美元，预估0.45美元；第四季 度营收249.0亿美元，同比减少3.1%，预估251.1亿美元；第四季度经营利润14.1亿美元，同比减少 11%，预估13.2亿美元；第四季度自由现金流14.2亿美元，同比减少30%，预估15.9亿美元；第四季度毛 利率20.1%，预估17.1%。特斯拉盘后涨近4%。 第3名美光收高6.10%，成交177.15亿美元。周三美股存储概念股普涨。据1月28日声明，新加坡胜科工 业与美光科技将扩大双方2023年签订的18年期购电协议，为后者新增供应150兆瓦电力，协议期限维持 不变。根据原有协议，胜科为美光新加坡生产设施供应450兆瓦电力。 第6名苹果收跌0.71%，成交101.76亿美元。据消费者智能研究伙伴公司（CIRP）的最新市场调研数据 显示，在截至 ...

Intel, Micron and These Other Chip Stocks Are Rallying. Thank Texas Instruments and ASML. - Barron'sSkip to Main ContentThis copy is for your personal, non-commercial use only. Distribution and use of this material are governed by our Subscriber Agreement and by copyright law. For non-personal use or to order multiple copies, please contact Dow Jones Reprints at 1-800-843-0008 or visit www.djreprints.com.# Intel, Micron, These Other Chip Stocks Are Rallying. Thank Texas Instruments and ASML.By [George Glove ...

Ever since the Trump administration took a 10% stake in Intel (NASDAQ: INTC) in August 2025, shares of the chipmaker have skyrocketed by more than 70% -- from $24 per share to about $43 at this writing. This year alone, Intel stock has climbed 15% year to date. It's not just the investment by the U.S. government that has fueled Intel, as it also got a $5 billion investment from Nvidia (NASDAQ: NVDA) to partner on making chips for data centers and PCs. Where to invest $1,000 right now? Our analyst team ju ...