Group 1 - The Integrated Circuit ETF (159546) opened with a gain of 0.29%, priced at 2.063 yuan [1] - Major holdings in the ETF include: Cambrian (up 0.79%), SMIC (up 1.02%), Haiguang Information (up 0.75%), and others with varying performance [1] - The ETF's performance benchmark is the CSI All-Share Integrated Circuit Index return, managed by Guotai Fund Management Co., Ltd., with a return of 105.49% since its establishment on October 11, 2023, and a one-month return of -4.74% [1]

2月24日，上交所官网显示，盛合晶微半导体有限公司（以下简称"盛合晶微"）科创板IPO已成功通过上 交所上市审核委员会审议。 现场问询中，上交所上市委要求盛合晶微结合其2.5D业务的技术来源，三种技术路线的应用领域、发展 趋势、市场空间，以及新客户开拓情况，说明与主要客户的业务稳定性及业绩可持续性。 21世纪经济报道记者 孙燕 招股书显示，盛合晶微目前的客户集中度较高：2022年、2023年、2024年、2025年上半年，该公司对前 五大客户的合计销售收入占比分别为72.83%、87.97%、89.48%和90.87%，其中，对第一大客户的销售 收入占比分别为40.56%、68.91%、73.45%和74.40%。 此次登陆科创板，盛合晶微拟募资48亿元，将投资于三维多芯片集成封装项目、超高密度互联三维多芯 片集成封装项目。财通证券研究指出，项目达产后将形成多个芯粒多芯片集成封装技术平台的规模产 能，并配套凸块制造及3DIC技术平台产能，进一步匹配中国大陆芯粒多芯片集成封装领域的高增长需 求。 根据Gartner的统计，2024年度，盛合晶微是全球第十大、境内第四大封测企业，且2022年度至2024年 度营业 ...

盛合晶微前身为中芯长电半导体（江阴）有限公司，由中芯国际（688981.SH）与长电科技（600584.SH）合资创立。自成立之 初，盛合晶微即将芯粒多芯片集成封装作为该公司发展方向和目标，并聚焦在更加前沿的晶圆级技术方案领域。 在摩尔定律逐步逼近极限的情况下，通过芯粒多芯片集成封装技术持续优化芯片系统的性能已经成为行业共识。在这一领域， 台积电、英特尔、三星电子等全球领先半导体制造企业已经布局多年且正在持续扩充产能，日月光、安靠科技等全球领先封测 企业，以及长电科技、通富微电（002156.SZ）、华天科技（002185.SZ）等中国大陆领先封测企业也正在持续布局中。 从价值量上看，芯粒多芯片集成封装及配套的测试环节也已进入高算力芯片制造产业的价值链高端，一定程度上重构了集成电 路制造产业链的价值分布。目前最主流的高算力芯片的成本结构中，CoWoS及配套测试环节的合计价值量已经接近先进制程芯 片制造环节。 此次登陆科创板，盛合晶微拟募资48亿元，将投资于三维多芯片集成封装项目、超高密度互联三维多芯片集成封装项目。财通 证券研究指出，项目达产后将形成多个芯粒多芯片集成封装技术平台的规模产能，并配套凸块制造及3 ...

媒体报道称，Meta与AMD达成了一项为期五年、总规模高达千亿美元的重磅人工智能芯片及设备采购 协议。这一史无前例的合作标志着全球科技巨头在AI基础设施领域的投资竞赛进一步升级。 根据最新披露的协议内容，Meta将在未来五年内采购高达6吉瓦算力的AMD处理器及数据中心设备。据 路透和华尔街日报报道，这笔交易的总价值预计在600亿美元至逾1000亿美元之间。首批搭载AMD新一 代MI450图形处理器（GPU）的设备将于今年下半年开始部署。 和林微纳：公司主营半导体探针，AMD为公司重要客户之一。 *免责声明：文章内容仅供参考，不构成投资建议 *风险提示：股市有风险，入市需谨慎 公司方面，据上市公司互动平台表示， 通富微电：公司为AMD的核心封测厂商。 作为交易的创新财务安排，Meta将获得以每股1美分价格购买高达1.6亿股AMD股票的认股权证。如果 双方合作达成特定的技术与商业里程碑，且AMD股价在未来触及600美元的目标位，Meta最终可能获得 AMD约10%的股份，成为其核心股东之一。 分析认为，此前AMD还与OpenAI达成合作，AMD作为后发者，其新产品获得了大额的订单，成为算力 芯片的重要玩家。同时， ...

Core Insights - The development journey of Tongfu Microelectronics reflects the rise of China's semiconductor industry, transitioning from near bankruptcy to becoming the fourth-largest semiconductor packaging and testing leader globally [2] - The company emphasizes continuous innovation and collaboration to achieve significant growth in revenue and profit by the end of the 14th Five-Year Plan [2][9] Group 1: Historical Development - In 1990, the company faced severe financial difficulties but turned profitable in 1994 after launching an integrated circuit packaging production line [3] - Key milestones include a joint venture with Fujitsu in 1997, undertaking national R&D projects in 2009, and acquiring 85% of AMD's packaging plants in 2016, which propelled the company into the semiconductor packaging sector [3] - The company has transformed from a supporting role in the semiconductor supply chain to a key player, significantly enhancing the performance of products like the Loongson CPU [3] Group 2: Investment in Innovation - Since 2009, the company has invested over 10 billion yuan in technological innovation, leading to recognition with a national science and technology progress award in 2021 [4] - The focus on innovation is crucial as the domestic semiconductor industry accelerates its development, with the company aiming to strengthen local production capacity and supply chain resilience [4] Group 3: Embracing AI Trends - The company recognizes the ongoing AI wave as a significant opportunity and plans to increase investments in emerging applications such as storage chips and automotive technologies [6] - A recent announcement indicated plans to raise up to 4.4 billion yuan to enhance packaging capacity and support operational needs, reflecting a commitment to strengthening competitiveness in the semiconductor packaging industry [6] Group 4: Strategic Partnerships - The strategic partnership with AMD, established through the acquisition of packaging plants, has been pivotal, with over 80% of AMD's products being packaged by Tongfu Microelectronics [7] - The company is also diversifying its customer base, with half of the orders from its Suzhou plant now coming from clients outside AMD, aiming for a balanced growth engine [7] Group 5: Future Development Goals - The company outlines three main objectives for future growth: maintaining its core business in integrated circuit packaging, innovating in advanced packaging solutions for the AI era, and fostering international cooperation [9] - The 2025 performance forecast anticipates a net profit of 1.1 billion to 1.35 billion yuan, representing a year-on-year growth of 62.34% to 99.24% [9]

Core Insights - The article highlights the transformation of Tongfu Microelectronics from a struggling transistor factory to a leading semiconductor packaging and testing company, reflecting the rise of China's semiconductor industry [3][4] - The company aims to continue its growth trajectory by focusing on innovation, collaboration, and maintaining its core business, with a target for significant revenue and profit growth by the end of the 14th Five-Year Plan [3][9] Group 1: Company Development - Tongfu Microelectronics was established from the South Jiangsu Transistor Factory, which faced severe financial difficulties, but through technological innovation, it turned profitable in 1994 [4] - Key milestones include a joint venture with Fujitsu in 1997, undertaking national R&D projects in 2009, and acquiring 85% stakes in AMD's packaging plants in 2016, which positioned the company as a significant player in the semiconductor packaging sector [4][5] - The company has invested over 10 billion yuan in technological innovation since 2009, leading to significant advancements in packaging technology [5] Group 2: Future Outlook - The company is committed to embracing the AI wave, planning to increase investments in emerging applications such as storage chips and automotive technologies, with a fundraising target of up to 4.4 billion yuan [6][7] - The strategic partnership with AMD has strengthened, with over 80% of AMD's products being packaged by Tongfu Microelectronics, enhancing both companies' competitive positions in the market [7] - The company anticipates a net profit of 1.1 billion to 1.35 billion yuan for 2025, representing a year-on-year growth of 62.34% to 99.24%, indicating a strong growth trajectory [9]

通富微电（002156）(002156.SZ)公告，公司近日收到深圳证券交易所出具的《关于受理通富微电子股 份有限公司向特定对象发行股票申请文件的通知》。深交所根据相关规定对公司报送的向特定对象发行 股票的申请文件进行了核对，认为申请文件齐备，决定予以受理。 ...

来源：新浪基金∞工作室 中证500成长ETF银华（562340）业绩比较基准为中证500质量成长指数收益率×100%，管理人为银华基 金管理股份有限公司，基金经理为张亦驰，成立（2024-04-25）以来回报为39.20%，近一个月回报为 3.00%。 声明：市场有风险，投资需谨慎。本文基于第三方数据库自动发布，不代表新浪财经观点，任何在本文 出现的信息均只作为参考，不构成个人投资建议。如有出入请以实际公告为准。如有疑问，请联系 biz@staff.sina.com.cn。 2月24日，截止午间收盘，中证500成长ETF银华（562340）涨1.73%，报1.415元，成交额45.79万元。中 证500成长ETF银华（562340）重仓股方面，巨人网络截止午盘跌4.69%，西部矿业涨2.60%，天山铝业 涨1.05%，厦门钨业涨0.82%，通富微电涨2.12%，宏发股份涨2.38%，杰瑞股份涨5.15%，睿创微纳涨 0.17%，豪迈科技涨0.16%，金诚信涨2.94%。 ...

21世纪经济报道新质生产力研究院综合报道 早上好，新的一天又开始了。在过去的24小时内，科技行业发生了哪些有意思的事情？来跟21tech一起看看吧。 【巨头风向标】 2月23日，问界汽车官微发布《关于广东省惠州市车辆起火的说明》。其中称，2026年2月21日，一辆问界M9在广东省惠州市附 近起火，事件未造成人员伤亡。经初步调查，车辆三电系统状态正常，且未见车辆其它自身异常，判断事件非车辆自身原因导 致。说明称，将密切配合有关部门完成后续调查并积极协助用户处理后续事宜。请大家不信谣，不传谣。 问界通报"广东惠州车辆起火事件" 2月22日，智谱发布技术报告，全面解读GLM-5的技术细节。据称，GLM-5是一款旨在推动编程范式从"Vibe Coding"（氛围编 程）转向"Agentic Engineering"（智能体工程）的下一代基础模型。GLM-5 在前代模型 GLM-4.5 的智能体、推理与编程 （Agentic, Reasoning and Coding, ARC）能力基础上，采用稀疏注意力（DeepSeek Sparse Attention，DSA）以大幅降低推理成 本，同时保持长上下文能力无损。为了让 ...

晶圆级封测产能提升项目：计划投资74,330.26万元提升晶圆级封测等产能，新增晶圆级封测产能31.20万片，同时亦提升该厂区高可靠性车载品封测产能 15.732亿块。本项目实施将有助于发行人扩大晶圆级封装等先进封装实力，促进公司向下游客户提供完整解决方案，优化产品结构，进一步增强公司在行业 中的竞争力及影响力。 | | | | 单位:万元 | | --- | --- | --- | --- | | 序号 | 项目 | 项目投资总额 | 拟使用募集资金 | | | | | 投入 | | 1 | 存储芯片封测产能提升项目 | 88,837.47 | 80,000.00 | | 2 | 汽车等新兴应用领域封测产能提升项目 | 109,955.80 | 105.500.00 | | 3 | 晶圆级封测产能提升项目 | 74,330.26 | 69.500.00 | | 4 | 高性能计算及通信领域封测产能提升项目 | 72,430.77 | 62.000.00 | | રે | 补充流动资金及偿还银行贷款 | 123,000.00 | 123.000.00 | | | 合计 | 468,554.30 | 440.0 ...