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第二波嘉宾剧透!iTherM2025热管理产业大会(12月3-5日 深圳)
DT新材料· 2025-09-18 16:14
Core Viewpoint - The 6th Thermal Management Industry Conference and Exposition (iTherM 2025) will focus on the integration and innovation within the thermal management industry, highlighting the importance of collaboration across various sectors such as electronics, new materials, and green technology [1][2]. Group 1: Conference Information - The conference will take place from December 3 to 5, 2025, at the Shenzhen International Convention and Exhibition Center, with an expected attendance of over 2000 participants and more than 350 exhibitors [1][2]. - The theme of the conference is "Fusion · Innovation | Delivering a Little More," emphasizing the need for synergy in addressing industry challenges and opportunities [1][2]. Group 2: Key Activities and Focus Areas - iTherM 2025 will feature over 20 activities, including keynote speeches, roundtable discussions, and case studies, aimed at fostering communication and collaboration in the thermal management field [2][4]. - The conference will particularly emphasize intellectual property, entrepreneurial projects, and innovative technologies that can transition from laboratories to market applications [4]. Group 3: Featured Companies and Innovations - Notable participants include Henkel, which specializes in thermal interface materials and has applications in electric vehicles and power electronics [5]. - Shenzhen Hongfu Cheng New Materials Co., Ltd. focuses on carbon-based thermal materials for high-speed optical communication and intelligent driving chips [6]. - Shanghai Aled Group Co., Ltd. is expanding its high-performance thermal interface materials for data centers and AI applications [7]. - Other companies like tesa, Chengdu Silica Technology Co., Ltd., and Indium Corporation are also showcasing their advancements in thermal management materials and technologies [8][9][13]. Group 4: Conference Agenda - The agenda includes various specialized forums covering topics such as thermal science, functional materials, technology applications, and engineering solutions [19]. - Specific sessions will address challenges and advancements in data center thermal management, electric vehicle thermal management, and cooling technologies [19]. Group 5: Registration and Participation - Registration fees are set at ¥2200 for regular attendees and ¥1200 for students if paid before October 31, 2025 [21]. - Payment options include bank transfer, Alipay, and WeChat Pay, with specific instructions for invoicing provided [22].
iPhone 17 Pro“弃钛从铝”:散热革命背后的VC均热管崛起(附投资逻辑)
材料汇· 2025-09-18 13:20
Core Viewpoint - The decision by Apple to switch from titanium alloy to aluminum alloy for the iPhone 17 Pro highlights a significant shift in the consumer electronics industry, emphasizing the importance of heat dissipation performance in high-end device design [3][4]. Group 1: Analysis of iPhone 17 Pro's Material Change - The core contradiction of "abandoning titanium for aluminum" lies in the trade-off between heat dissipation performance and high-end feel [5]. - Titanium alloy, while known for its strength-to-weight ratio and premium feel, has a thermal conductivity that is only 1/30th that of aluminum alloy, which has become a bottleneck for device performance as chip power increases [7]. - The new iPhone 17 Pro, utilizing 6061 aerospace aluminum and a 0.3mm ultra-thin laser-welded VC heat spreader, maintains a body temperature of 41.3°C after 30 minutes of 4K video recording, a reduction of 7.4°C compared to the previous titanium model [8][9]. - In high-performance gaming scenarios, frame rate fluctuations decreased from 15 frames to just 2 frames, significantly enhancing user experience [9]. - The aluminum and VC heat spreader combination improves heat conduction efficiency by 20 times compared to the titanium model, indicating that heat dissipation performance is now a critical metric for flagship devices [9]. Group 2: Heat Dissipation Performance Comparison - A comparative analysis of heat dissipation performance between iPhone 17 Pro and iPhone 16 Pro shows significant improvements across various metrics: - 4K recording temperature: 41.3°C (iPhone 17 Pro) vs. 48.7°C (iPhone 16 Pro), a difference of -15.2% [10]. - Frame rate fluctuation during gaming: 2 frames (iPhone 17 Pro) vs. 15 frames (iPhone 16 Pro), a difference of -86.7% [10]. - Continuous performance under full load: 40 minutes without throttling (iPhone 17 Pro) vs. 22 minutes with a 30% throttle (iPhone 16 Pro), an improvement of +81.8% [10]. - Maximum charging temperature: 38.5°C (iPhone 17 Pro) vs. 44.2°C (iPhone 16 Pro), a difference of -12.9% [10]. Group 3: Overview of the Heat Dissipation Materials Market - The global thermal interface materials (TIM) market is expected to grow at a compound annual growth rate (CAGR) of over 10%, potentially reaching approximately $7.5 billion by 2036 [15]. - The VC heat spreader is rapidly penetrating the high-end consumer electronics market, with its penetration rate in high-end smartphones projected to increase from 35% in 2023 to 62% by 2025 [17]. - The cost of thermal modules in smartphones has risen from 3.5% of the bill of materials (BOM) in 2020 to an expected 5.8% by 2025, indicating that heat dissipation systems are becoming a significant component of smartphone production costs [17]. Group 4: Evolution of Heat Dissipation Materials - The development of heat dissipation materials can be categorized into three main stages: passive heat dissipation, active heat dissipation, and smart heat dissipation [25]. - Traditional heat dissipation materials include metals like aluminum and copper, which are widely used due to their excellent thermal conductivity [26]. - Emerging materials such as graphite and phase change materials (PCM) are gaining traction due to their high thermal conductivity and efficiency in heat management applications [29][30]. - Advanced technologies like microchannel cooling and immersion cooling are being explored for high-power applications, showcasing the ongoing evolution in heat management solutions [31][32].
iTherM2025直击终端热管理挑战——AI服务器、电池、AR眼镜、人形机器人......
DT新材料· 2025-09-17 16:05
Core Insights - The iTherM2025 event will take place from December 3-5, 2025, at the Shenzhen International Convention and Exhibition Center, aiming to create a one-stop value connection service platform for the thermal management industry [2] - The event will feature six major exhibition areas, covering the entire thermal management value chain from materials to systems, and will introduce four application-specific display areas to showcase practical advancements in thermal management [2] Group 1: Four Key Application Areas - **Data Center Thermal Management Display Area**: This area will showcase cutting-edge solutions such as single/double-phase immersion cooling, cold plate systems, and cooling fluid development, addressing the cooling bottlenecks faced by high-performance servers driven by AI and large models [4] - **New Energy Thermal Management Display Area**: Focused on the growing electric vehicle market, this area will highlight thermal management solutions for battery packs, drive motors, and power modules, emphasizing thermal design and safety redundancy [6][7] - **Energy Storage Thermal Management Display Area**: This area will present technologies for temperature control in energy storage systems, including phase change material integration and thermal management design for outdoor conditions [9] - **Consumer Electronics Thermal Management Display Area**: This area will address the challenges posed by 5G, drones, and wearable devices, showcasing innovations like micro VC heat spreaders and flexible graphite sheets [11] Group 2: Two Major Theme Areas - **Materials Theme Display Area**: This area will focus on the continuous breakthroughs in material performance essential for thermal management technologies, featuring high thermal conductivity ceramics, graphite, and phase change materials [13] - **Automation Equipment and Testing Instruments Display Area**: Highlighting the importance of standardized and intelligent manufacturing, this area will exhibit high-precision coating and testing equipment, bridging the gap between research, testing, and large-scale production [15]
电子行业周报:苹果发布iPhone17系列手机-20250916
Investment Rating - The report rates the electronic industry as "Outperform" compared to the market [1]. Core Insights - The electronic industry index increased by 6.15%, outperforming the CSI 300 index which rose by 1.38% [2]. - The report highlights the launch of Apple's iPhone 17 series, showcasing significant technological innovations and ecosystem strategies [5][6]. - The introduction of the VC vapor chamber as a key innovation in the iPhone 17 Pro Max addresses the challenges of high performance and heat dissipation [10][14]. Summary by Sections iPhone 17 Series Performance - The iPhone 17 series features a tiered pricing strategy ranging from 5999 to 9999 yuan, with various models including standard, Air, Pro, and Pro Max [6][8]. - The Pro Max model includes the A19 Pro chip built on a 3nm process, enhancing performance and thermal management with a VC liquid cooling system that reduces chip temperature by 8-12°C [7][9]. VC Vapor Chamber - The VC vapor chamber is central to the iPhone 17's thermal management, providing efficient heat dissipation and supporting high-end smartphone performance [10][14]. - The global market for VC vapor chambers is projected to grow from 920 million USD in 2023 to 1.78 billion USD by 2028 [15]. Potential Suppliers for VC Vapor Chamber - Key companies benefiting from the VC vapor chamber trend include Suzhou Tianmai, Linyi Zhizao, and AAC Technologies, all of which have established production capabilities and partnerships with major smartphone brands [19][21][23]. Market Performance - The report notes that the PCB sector leads the electronic industry with a weekly increase of 13.07%, followed by digital chip design at 11.75% [2][37]. - The top-performing stocks in the electronic sector include Xiangnan Chip Creation (+71.74%) and Xinxing Micro (+34.85%) [40].
高澜股份(300499):特高压纯水冷却设备龙头,数据中心液冷打造第二成长曲线
Guoxin Securities· 2025-09-16 06:44
Investment Rating - The report assigns an "Outperform" rating to the company for the first time [4][7]. Core Viewpoints - The company is a leader in ultra-high voltage pure water cooling equipment and is expected to benefit from the long-term prosperity of the domestic power grid and continuous breakthroughs in overseas business, particularly in the data center liquid cooling sector, which is anticipated to open up greater growth potential [4][14]. - The company has a strong order backlog, with orders expected to grow significantly due to the increasing demand for power management solutions in both domestic and international markets [2][50]. Summary by Relevant Sections Company Overview - The company has been focused on thermal management technology for over 20 years and has established itself as a leading provider of industrial thermal management solutions, with products that are recognized as domestically leading or internationally advanced [14][15]. - The company has a diverse client base, including major players in various sectors such as State Grid, Alibaba, Tencent, and GE, which reflects its strong market position [15][20]. Financial Analysis - The company experienced revenue fluctuations due to acquisitions and divestitures but has returned to a growth phase, with a revenue of 4.18 billion yuan in the first half of 2024, representing a year-on-year increase of 47.81% [24][31]. - The company's net profit for the same period was 23 million yuan, showing a remarkable year-on-year growth of 1438.57% [24][31]. Power Electronics Thermal Management - The company is benefiting from the recovery of the domestic power grid investment, with its power electronics thermal management business experiencing a significant revenue increase of 239.39% year-on-year in the first half of 2025 [31][45]. - The company’s focus on high-power density thermal management products, particularly in data centers and energy storage, has led to rapid growth, with revenues expected to reach 3.28 billion yuan in 2024, a 74.66% increase [31][36]. Data Center Liquid Cooling - The global data center liquid cooling market is projected to grow significantly, with a compound annual growth rate (CAGR) of 33.21% from 2025 to 2030, driven by the increasing demand for AI infrastructure and high-density computing [3][57]. - The company has established stable partnerships with leading clients in the data center sector, including ByteDance and Alibaba, which positions it well to capitalize on the growing demand for liquid cooling solutions [62][64]. Overseas Expansion - The establishment of subsidiaries in Singapore and the United States is aimed at enhancing the company's ability to serve overseas markets, particularly in Southeast Asia and North America, thereby opening up new growth opportunities [20][64].
中鼎股份:公司在人形机器人领域拥有核心技术 并已与多家企业签署战略合作协议
Xin Lang Cai Jing· 2025-09-15 10:13
Group 1 - The company has developed proprietary patent technologies in the field of humanoid robots, including harmonic reducers [1] - Strategic cooperation agreements have been signed with Shenzhen Zhongqing Robot Technology Co., Ltd. and Efort Intelligent Equipment Co., Ltd. [1] - A project intention cooperation agreement has been established with Shenzhen Zhujidongli Technology Co., Ltd. to jointly set up a joint venture for in-depth collaboration in robot body manufacturing [1] Group 2 - The company has also made advancements in thermal management and energy storage thermal management, launching a series of liquid cooling units and immersion liquid cooling units [1]
中鼎股份(000887) - 中鼎股份调研活动信息
2025-09-15 10:08
Group 1: R&D and Technological Capabilities - The company has been in the air suspension system business since the 1990s, continuously enhancing its product assembly technology and holding core technologies in niche markets [2] - As of mid-2025, the company holds 1,304 domestic invention patents and 206 foreign patents, showcasing its strong R&D capabilities [2] - The company has established partnerships with top universities and research institutions, including Tsinghua University, to strengthen innovation and solve key technological challenges [2] Group 2: Order Status and Market Demand - As of mid-2025, the company has received domestic air suspension orders valued at approximately ¥158 billion, with assembly product orders worth about ¥17 billion [3] - The company’s electronic air suspension orders are in high demand, with production schedules extending to 2027, particularly for international orders [3] Group 3: Business Development in Robotics - The company is actively involved in the humanoid robot sector, having already supplied rubber components to Chery's robot and harmonic reducers to Efort Industrial Robots, generating initial revenue [4] - The company has signed strategic cooperation agreements with several leading robotics firms to enhance its core advantages in humanoid robot component assembly [9] - A joint venture with Shenzhen Zhijidong Technology Co., Ltd. is planned to focus on the manufacturing of humanoid robots, leveraging combined resources for improved R&D and manufacturing capabilities [10] Group 4: Financial Performance and Market Position - Despite a significant order backlog, the company reported minimal revenue growth in the first half of the year due to the time lag between order acquisition and product delivery [6] - The company aims to enhance its market valuation through focused management and high-quality development, addressing concerns about its perceived low valuation compared to peers [5] Group 5: Future Prospects and Strategic Goals - The company plans to continue expanding its business in intelligent chassis systems and humanoid robotics, with a focus on new fields such as low-altitude economy and AI [8] - The company has accumulated approximately ¥71 billion in orders for its thermal management systems by mid-2025, indicating strong growth potential in this area [9]
常州腾龙汽车零部件股份有限公司 第五届董事会第二十二次会议决议公告
Group 1 - The board of directors of Changzhou Tenglong Automotive Parts Co., Ltd. held its 22nd meeting of the 5th session on September 12, 2025, with all 7 attending directors present, complying with relevant laws and regulations [2][3]. - The board approved the establishment of a wholly-owned subsidiary with an investment of 50 million yuan in Changzhou, focusing on the research, production, and sales of liquid cooling components and products for energy storage and servers, aiming to extend the business from the automotive sector to non-automotive sectors [3][4]. - The board also approved the transfer of 22.5% equity in the controlling subsidiary Zhejiang Lichi Leao Environmental Technology Co., Ltd. from shareholder Zhong Yafeng to his wife Wang Shuwen for 0 yuan, with no significant impact on the company's financial and operational status [5][6]. Group 2 - The board's decisions were unanimously approved with 7 votes in favor, and no votes against or abstentions [4][6]. - The announcement was made by the board of directors on September 13, 2025 [7][8].
第一波大咖剧透!第六届热管理产业大会暨博览会(iTherM2025)
DT新材料· 2025-09-12 16:07
01 大会信息 大会时间: 2025年12月3-5日 大会地点: 中国 · 深圳国际会展中心(深圳市宝安区福海街道展城路1号) 大会主题: 融合 · 创新 | 传递多一点 特色活动: 热管理展(350+展商,20000 m 2 展区) 详细信息点击查看~ iTherM(i nsight T hermal M anagement )洞见热管理 ,定位于热管理产业链一站式、高效率价值服务平台。 在新质生产力发展背景下, 2 02 5第六届 热管理产业大会暨博览会( iTherM 2025)将 紧密依托电子信息、新材料、新能源、 半导体、 数字经济、 汽车、 智慧网联 、低空经济、 绿色低碳等 诸多 产业集群,以热管理价值优势 及应用 场景 为导向, 洞见 和把握 热管理行业政策、科学、材料、技术、标准和工程等前沿动态与发展趋势 。 iTherM 2025将 吸收顶尖研究机构和公司的行业远见 , 内容涵盖热管理 行业 的科学前沿、功能材料、技术应用和工程方案等多个领域, 诚挚 邀请国内外知 名学者、技术专家、领军企业高管、 政府园区、 科研院所和投资机构 等嘉宾走上大会舞台, 共同探讨热管理产业新动态、新技术、新发 ...
行业聚焦:全球导热界面材料用填料市场头部企业份额调研(附Top10 厂商名单)
QYResearch· 2025-09-11 03:43
Core Insights - The global thermal interface materials (TIM) filler market is projected to reach $610 million by 2031, with a compound annual growth rate (CAGR) of 7.5% over the coming years [1]. Market Overview - The leading manufacturers in the global TIM filler market include Tokuyama, Baidu High-tech, Admatechs, Denka, Kingo New Materials, Resonac, 3M, Nippon Steel, Jinyi New Materials, and Toyo Aluminium. The top ten manufacturers are expected to hold approximately 52.0% market share in 2024 [5]. - Spherical alumina is currently the most significant product type, accounting for about 43.8% of the market share [8]. - In terms of application, consumer electronics represent the largest demand source, holding approximately 28.9% of the market share [10]. Key Drivers - The ongoing electrification of vehicles, including electric vehicles (EVs), hybrid electric vehicles (HEVs), and plug-in hybrid electric vehicles (PHEVs), is a primary driver for the demand for thermal fillers. Efficient thermal management is crucial for battery packs, onboard chargers, inverters, and electronic control units [13]. - The expansion of global data infrastructure, including data centers, AI accelerators, high-performance computing (HPC), and edge computing, is another significant factor driving market growth. These environments require high-performance TIMs to manage intense heat loads [13]. Challenges - The high cost of quality thermal fillers, particularly aluminum nitride, hexagonal boron nitride, and surface-treated spherical alumina, limits their application in high-end sectors like EV power modules and data centers [15]. - The lack of global standardization and performance benchmarking for filler materials poses challenges for product consistency and supplier evaluation [15]. - Environmental and regulatory constraints in the filler supply chain are becoming increasingly prominent, necessitating investments in cleaner processes and stricter waste control, which may raise production costs [15]. Industry Opportunities - The rapid development of high-power electronic devices and miniaturized components is reshaping the TIM filler market. The demand for fillers that not only provide high thermal conductivity but also possess processability, electrical insulation, and mechanical compliance is on the rise [16]. - Spherical alumina remains the dominant filler type due to its balance of thermal conductivity, flowability, and cost, widely used in consumer electronics, automotive electronics, and LED modules [17].