Core Viewpoint - Changxin Storage is set to launch its A-share listing, marking a significant milestone in its development and the advancement of China's semiconductor industry, particularly in the DRAM sector [1][3]. Group 1: Company Overview - Changxin Storage, established in 2016, specializes in the research, production, and sales of DRAM memory chips, with a registered capital of approximately 60.193 billion yuan [1]. - The company is the only domestic entity capable of large-scale production of DRAM chips, having developed a complete industrial chain from chip design to wafer manufacturing and packaging testing [1]. - Changxin Storage has achieved significant technological milestones, including mass production of 19nm DDR5 chips and advancements in high bandwidth memory (HBM) products [1][2]. Group 2: Market Position and Growth - The company's average monthly production increased from 100,000 wafers in Q1 2024 to 200,000 in Q1 2025, with an expected total production of 2.73 million wafers for the year, representing a year-on-year growth of 68% [2]. - Market analysis predicts that Changxin Storage's global DRAM market share will rise from 6% in Q1 2025 to 8% by the end of the year, with DDR5 and LPDDR5 products expected to account for 7% and 9% of sales, respectively [2]. Group 3: Strategic Developments - The timing of Changxin Storage's listing coincides with supportive domestic semiconductor policies, including the "1+6" policy measures from the CSRC aimed at facilitating the listing of hard-tech companies [2]. - The company has completed multiple rounds of large-scale financing, with a post-money valuation reaching 150.8 billion yuan after a recent 10.8 billion yuan funding round [3]. - Changxin Storage's competitive pricing strategy, with some products priced at 50% of international brands, is expected to disrupt the mid-to-low-end market dominated by major players like Samsung and SK Hynix [3]. Group 4: Industry Impact - The IDM model adopted by Changxin Storage has created a strong industrial driving effect, collaborating with upstream companies to promote the localization of equipment and materials [4]. - The company's products are integrated into the supply chains of major smartphone manufacturers and contribute to the domestic AI computing ecosystem [4]. - With the mass production of high-end products like HBM, Changxin Storage aims to establish a comprehensive technical standard system across the entire industry chain [4].

如果您希望可以时常见面，欢迎标星收藏哦~ 台积电董事长魏哲家上个月表示，台积电位于熊本的第一家晶圆厂已于去年年底开始量产，而原定 于今年年初开始建设的第二家晶圆厂则因当地交通问题而"略有推迟"，但他并未提供修改后的时间 表。 《华尔街日报》报道称，消息人士称，尽管尚未确定具体的时间表，但建设可能会进一步推迟。 台积电位于亚利桑那州的第一家晶圆厂已于去年投入商业生产。第二家工厂即将竣工，设备安装正 在进行中。第三家工厂已于今年4月破土动工。该公司新承诺的1000亿美元投资将用于建造另外三 家晶圆厂、两家集成电路组装厂和一个研发中心。 来 源： 内容来自 taipeitimes 。 台积电近日表示，其在美国的投资不会影响其在其他地方的现有项目，否认了《华尔街日报》的报 道。《华尔街日报》报道称，在美国总统唐纳德·特朗普的关税威胁下，该公司将推迟在日本建设 第二家制造厂，以专注于美国扩张。 这家全球最大的合约芯片制造商在一份声明中表示，其全球扩张战略基于多种因素，包括客户需 求、商业机会、运营效率、政府支持和总体成本。 台积电表示，因此该公司在美国的投资不会影响其在其他地区的计划。 《华尔街日报》称，台积电正在认真 ...

同 时 ， 为 了 保 持 摩 尔 定 律 的 进 展 ， 创 新 的 重 点 已 从 尺 寸 缩 放 转 向 功 能 性 缩 放 。 在 从 FinFET 到 Nanosheet，乃至未来CFET等晶体管架构的艰难跋涉中，业界深刻意识到： 仅依赖硅基材料的三 维堆叠技术，已难以支撑可持续的微缩与能效提升。寻求根本性的材料革新，成为突破瓶颈、开辟 新增长曲线的关键所在。 在这一背景下，从传统硅基三维材料向二维半导体材料的战略过渡，迅速跃升为全球半导体研发与 产业布局的核心焦点，吸引了全球科研人员与产业界的目光。 二维半导体，来势汹汹 IMEC 预测至 2039 年的路线图 如果您希望可以时常见面，欢迎标星收藏哦~ 近日，在 《芯片，最新路线图》 一文中，笔者分享了IMEC对未来14年半导体路线图的预测。 能看到，随着先进制程节点的演进和晶体管架构的革新，二维半导体材料或将成为未来业界关注的 焦点。 实际上，当前摩尔定律日益放缓，随着制程节点向物理极限不断逼近，硅基三维晶体管的制造结构 日趋复杂，所需投入的成本呈现指数级攀升，而技术演进带来的边际效益却显著递减。 众所周知，随着半导体制程向亚-纳米级逼近，硅基器 ...

曾经熙熙攘攘的首尔东大门区辉经工业高中，现已更名为首尔半导体高中，准备迎接一次重大的身 份转变。在李明博政府大力推动职业教育的巅峰时期，这所学校招收了2500名学生。如今，学生 人数只有80人。面临关闭，该校正在重塑自身，成为一所半导体高中，计划明年招收64名新生。 该校新任校长池宇中曾是三星电子高管，负责管理印度和埃及的工厂。但池宇中面临着一条艰巨的 道路。尽管政府正在提供预算支持，但这些资金几乎无法支付人员成本，甚至连二手半导体设备都 买不起。寻找合格的教师是一个更大的障碍。该学校提供的时薪不高，最高可达5万韩元（37美 元），但经验丰富的专业人士是否愿意以这样的薪水授课仍不确定。即使他们愿意，现行教育部规 定禁止他们留下，除非他们持有正式的教师资格证书——而拥有教育背景的半导体专业人士几乎不 存在这种资格证书。 为了吸引学生，学校提供宿舍。然而，由于监管方面的障碍，建造一座 3,300 平方米（35,521 平 方英尺）的宿舍可能需要长达四年的时间。 自 1980 年代以来，半导体一直是韩国经济的基石。然而，韩国只有六所半导体高中，其中大多数 是新建的，仍处于早期发展阶段。与此同时，台湾在人才数量和质量 ...

Core Insights - Light Peak Technology received a letter of appreciation from the Tianjin Municipal Bureau of Commerce for its 3D Mapping light show at the "2025 Summer Davos Multinational Enterprise Leaders Exchange Conference" [1] - The event, held on June 24, attracted over 300 guests, including representatives from Fortune 500 companies and international business associations, focusing on innovation and development [1][2] - The 3D Mapping light show was highlighted as a key attraction, providing a unique visual experience and contributing to the event's success, receiving widespread recognition [1][2] Company Performance - Light Peak Technology showcased its expertise in high-end light and shadow creativity, demonstrating its service capabilities at an international level [1][2] - The company plans to leverage its technological and creative advantages to collaborate with more cities and institutions, aiming to inject vitality into urban economic development [2] Technical Execution - The 3D Mapping light show utilized three T Pro series projectors to transform a 40-meter wide and 9.5-meter high building facade into an immersive giant screen [4] - The T Pro series projectors, with over 30,000 lumens brightness, effectively corrected environmental interference, ensuring vibrant colors and detailed visuals despite the building's reddish hue [4] - The technical team completed the entire process from installation to optimization in just 72 hours, showcasing efficient and precise execution [11]

分析师：王骅 登记编号：S0890522090001 分析师：宋逸菲 登记编号：S0890524080003 投资要点 权益市场回顾： 上周（2025.06.30-2025.07.04）A股震荡上涨，全周累计看，沪深300上涨1.54%，中证1000上 涨0.56%。"反内卷"为上周市场博弈的焦点，钢铁、煤炭和建筑材料等传统周期类行业领涨 A 股。 权益市场观察： "反内卷"： 中央财经委员会第六次会议提出治理"内卷式"竞争、推动落后产能有序退出。政策导向正从总量刺 激转向压减无效供给、遏制低效内卷、推动产业升级。一方面，行业层面落地政策尚未全面出台，另一方 面，"反内卷"是为科技和产业升级提供宏观环境，短期相关板块上涨属于交易预期，后续可能面临反复。 深海科技： 深海科技是一个多学科交叉融合的产业，后续随着政策的不断释放，板块可能迎来反复催化。 半导体限制暂缓： 提升国内 EDA 工具国产替代率，除了攻克技术瓶颈，建设完备的产业链协同体系同样重 要。在半导体自主可控领域，制造设备和材料环节的核心设备突破仍然是市场博弈的焦点。 公募基金市场动态： 6月30日，北证专精特新指数正式发布，成为继北证50指数之后， ...

Core Viewpoint - Wolfspeed, a pioneer in the semiconductor industry, has filed for bankruptcy due to overwhelming debt and inability to adapt to market changes, particularly the rise of Chinese competitors [3][22]. Group 1: Company Background - Wolfspeed was once the largest manufacturer of silicon carbide (SiC) substrates, with a peak market value of $16.5 billion (approximately 120 billion RMB) [3]. - The company originated from Cree Research, founded in 1987, and became a leader in the LED market before transitioning to SiC technology [8][12]. - Wolfspeed's market share in SiC substrates was as high as 80% in the past, but it has significantly declined to 33.7% by 2024 due to increased competition from Chinese firms [16]. Group 2: Financial Struggles - As of March, Wolfspeed had approximately $1.33 billion in cash reserves but faced $6.5 billion in debt, leading to severe liquidity issues [20]. - The company has reported net losses for ten consecutive years, with losses escalating from $280 million in FY 2018 to $864 million in FY 2024 [21]. - In May 2025, Wolfspeed's stock plummeted by 57%, resulting in a market value loss exceeding $1 billion [21]. Group 3: Market Dynamics - The demand for SiC semiconductors surged in sectors like electric vehicles and renewable energy, with over 60% of the demand coming from the EV market [20]. - Despite the high demand, Wolfspeed's expansion efforts did not yield the expected orders, particularly as the EV market faced a slowdown [20]. - The company's strategy of aggressive capacity expansion did not align with market realities, leading to underutilization of its new facilities [22][23]. Group 4: Competitive Landscape - Chinese competitors have leveraged their mature manufacturing capabilities to challenge Wolfspeed, which failed to adequately address the Chinese market's dynamics [3][24]. - Other global players, such as STMicroelectronics and Infineon, have pursued vertical integration and partnerships with Chinese firms, further intensifying competition [17].

5月外贸数据公布，从主要出口产品来看，集成电路对出口拉动作用较为明显，且连续两月呈现量价同 升的情况。在当前全球产业链重构的背景下，集成电路出口需求仍然旺盛。（资料参考：兴业证券《宏 观市场 | 集成电路出口连续量价双增——评2025年5月进、出口数据》，2025.6.11） 5月外贸数据整体出现回落迹象，其中出口同比录得4.8%，较前值下降3.3个百分点。但集成电路却成为 出口产品中的一大亮点—— 集成电路进出口持续增长，自主可控之路加速前行 从出口规模来看，5月集成电路出口增速达到33.4%，拉动整体出口增长1.4个百分点，较4月进一步提高 0.4个百分点； 从此前公布的目的地出口数据来看，在我国集成电路的主要出口目的地中，增速靠前的经济体为日本、 中国台湾地区、印度、新加坡和越南，出口增速分别为85.5%、53.2%、47.8%、45.1%、26.7%。（资料 参考：兴业证券，《宏观市场 | 集成电路出口连续量价双增——评2025年5月进、出口数据》， 2025.06.11） 有业内分析认为，随着国内企业加大投资和研发力度，中国在半导体制造设备等关键环节依赖进口的局 面有望逐步改善，中国集成电路产业的自 ...

Core Viewpoint - The article highlights the significant advancements made by domestic semiconductor equipment manufacturers, particularly in the field of thin film deposition equipment, which has reached international leading levels, while acknowledging the existing gap in lithography technology compared to global leaders like ASML [1][4]. Group 1: Breakthrough Direction and Market Dynamics - In 2010, the domestic semiconductor equipment market was dominated by international giants, with over 90% market share, prompting companies like拓荆科技 to focus on PECVD equipment as a breakthrough point due to its large market scale [3][4]. - The push for domestic substitution policies has led to unprecedented support for local semiconductor equipment suppliers, with expectations for domestic wafer production capacity to double by 2027 [4][5]. - The ongoing geopolitical tensions have accelerated the push for domestic semiconductor equipment localization, benefiting the equipment sector in the medium to long term [5][6]. Group 2: Technological Advancements and Milestones - In 2011,拓荆科技 produced its first 12-inch PECVD equipment, marking a significant milestone in China's semiconductor equipment development [6][8]. - By 2015, the PF-300T PECVD equipment had achieved over 10,000 wafers processed at中芯国际, validating the reliability of domestic equipment for large-scale production [8][9]. - The company has successfully developed a comprehensive technology system covering PECVD, ALD, and SACVD, with a strong focus on R&D, resulting in over 1,200 patents filed [12][13]. Group 3: Industry Ecosystem and Collaboration - The collaboration between various entities, including national research institutions and leading semiconductor manufacturers, has been crucial for the success of domestic equipment suppliers like拓荆科技 [27][28]. - The domestic semiconductor equipment industry has seen a significant increase in localization rates, projected to reach 50% by 2025-2026, compared to less than 5% in 2010 [28][29]. - The competitive landscape among domestic manufacturers is robust, with companies like北方华创 and中微公司 also making strides in different technology routes [29][30]. Group 4: Market Trends and Future Outlook - The global semiconductor equipment market is expected to grow significantly, with the thin film deposition equipment market projected to reach $34 billion by 2025, driven by advancements in storage chips and packaging technologies [30][31]. - The rise of three-dimensional integration technologies is anticipated to create new revenue streams for companies like拓荆科技, with a projected market size of nearly 30 billion yuan in the next five years [31].

，快速完成参会注册 第十三届半导体设备与核心部件及材料展（CSEAC 2025） ， 2025年9月4日至6日 ， 将在无锡太 湖国际博览中心举行。 CSEAC以"专业化、产业化、国际化"为宗旨，是我国半导体设备与核心部件及材料领域最具知名度的年度性 展会，集"技术交流、展览展示、产品发布、经贸洽谈、国际合作及市场拓展"于一体的产业盛宴。今年呈现五 大亮点： 亮点一：规模盛大，映射中国半导体势不可挡 CSEAC 2025 规划晶圆制造设备、封测设备、核心部件、材料等主题展区， 展览面积超60000m 2 ， 1000+企 业参展 ，展商数量同比增长40%以上。展览面积的扩增、展商数量的增长，映射出设备与部件产业在国内半 导体领域的高热度及当下国内半导体产业蓬勃发展的态势。 图源：CSEAC 2024 亮点二：以国际化视野促进全球产业合作 立足国际视野，与全球半导体产业核心区域的机构及企业互联互动。本届展会目前已有 来自欧洲、亚太等22 个国家和地区的150多家海外企业 主动参展 。 "全球半导体产业链合作论坛" 将集结来自全球的半导体产业领 军人物与权威技术专家，通过主题演讲、圆桌对话等方式，聚焦芯片制造、第 ...