以下文章来源于EEPW ，作者EEPW编译 EEPW . 关注EEPW电子产品世界网，获取电子行业资讯和技术解决方案。 我国在发展本土半导体产业方面采取了激进的策略，就现在看来，无疑已经取得了很大成功。 如今，我国拥有相当先进的晶圆厂，能够使用 7 纳米级工艺技术生产逻辑芯片，以及世界级的 3D NAND 和 DRAM 存储设备。 然而，发展到路上总不是一帆风顺，由于投资失误、技术缺陷和不可持续的商业模式，我国也确实 出现了许多的失败案例。 也就是说，全国范围内有许多空置的晶圆厂——僵尸晶圆厂。 据 TrendForce 统计： 截至 2024 年初，我国拥有 44 家晶圆半导体生产设施，包括 25 家 300 毫米晶圆 厂、5 家 200 毫米晶圆厂、4 家 150 毫米晶圆厂和 7 家停产的工厂。当时，我国正在建设 32 个额外的半 导体制造计划，作为"中国制造 2025"计划的一部分，包括 24 家 300 毫米晶圆厂和 9 家 200 毫米晶圆厂。 像中芯国际、华虹、纳芯微、长鑫和士兰等公司计划在 2024 年底前在 10 家新晶圆厂开始生产，包括 9 家 300 毫米晶圆厂和 1 家 200 毫米晶 ...

国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 开盘暴涨210%、市值突破600亿！ 今日，北京屹唐半导体科技股份有限公司正式在科创板挂牌上市，股票代码为 688729.SH。 作为国内半导体设备行业的领军企业，屹唐股份的上市备受市场关注。 屹唐股份此次上市获得7家机构的战略认购，分别为证裕投资、君享 1 号资管计划、中国保险 投资基金（有限合伙）、北京电控产业投资有限公司、深圳安鹏创投基金企业（有限合伙）、 合肥芯屏产业投资基金（有限合伙）、合肥晶合集成电路股份有限公司，一共认购总金额为 6.81亿元。 上市首日，屹唐股份表现惊艳，开盘价为 26.20 元，较发行价 8.45 元上涨 210.06%，总市 值一度超过 770 亿元。这一涨幅不仅远超市场预期，也反映了投资者对公司未来发展的高度 信心。 屹唐股份表示，此次成功登陆科创板，将为公司提供更为广阔的发展空间和资金支持。未来, 公司将继续加大研发投入，提升技术创新能力，巩固和增强在行业内的优势地位，为全球半导 体产业的发展贡献力量。 随着屹唐股份的上市，中国半导体设备行业在资本市场的影响力 ...

，快速完成参会注册 第十三届半导体设备与核心部件及材料展（CSEAC 2025） ， 2025年9月4日至6日 ， 将在无锡太 湖国际博览中心举行。 CSEAC以"专业化、产业化、国际化"为宗旨，是我国半导体设备与核心部件及材料领域最具知名度的年度性 展会，集"技术交流、展览展示、产品发布、经贸洽谈、国际合作及市场拓展"于一体的产业盛宴。今年呈现五 大亮点： 亮点一：规模盛大，映射中国半导体势不可挡 CSEAC 2025 规划晶圆制造设备、封测设备、核心部件、材料等主题展区， 展览面积超60000m 2 ， 1000+企 业参展 ，展商数量同比增长40%以上。展览面积的扩增、展商数量的增长，映射出设备与部件产业在国内半 导体领域的高热度及当下国内半导体产业蓬勃发展的态势。 图源：CSEAC 2024 亮点二：以国际化视野促进全球产业合作 立足国际视野，与全球半导体产业核心区域的机构及企业互联互动。本届展会目前已有 来自欧洲、亚太等22 个国家和地区的150多家海外企业 主动参展 。 "全球半导体产业链合作论坛" 将集结来自全球的半导体产业领 军人物与权威技术专家，通过主题演讲、圆桌对话等方式，聚焦芯片制造、第 ...

编者按：今天，每个人都知道芯片对于国家发展的重要意义，但可能并不清楚，一枚小小的芯片背后，隐藏了多少曲折的发展，凝结了多少跌宕的故事。 2000年之后，中国半导体产业真正走向市场化、国际化、体系化的全新发展轨迹。一个与时代脉搏休戚与共的现代化半导体纪元悄然拉开序幕。 我们希望通过全新系列内容《芯火三十年》，与大家共同回顾千禧年至今的中国半导体发展历程。希望通过这次回顾，能总结经验，梳理因果，共同锚定 未来半导体产业的发展共识。同时，这段故事也对中国科技走向自立自强也有着极强的参考意义。 本系列共分为三篇，以相对粗线条的时间线索作为划分。第一阶段是从2000年开始到2010年左右，这一阶段中国半导体产业步入初创期，关键企业得到建 立，产业链开始成型；第二阶段从2010年至2020年左右，这一阶段中国半导体产业开始推动大规模全球化并购，全球芯片版图迎来了中国力量；第三阶段 从2020年前后至今，伴随着地缘政治的影响，中国半导体被迫走上了加速独立自强的道路。 三个阶段紧密相连，环环相扣，共同演绎了中国芯片如何从一个报国理想，成长为中国式现代化的底座与屏障。 芯片烈火，燎原三十年，为中国科技点燃了一片属于自己的天地。 ...

Core Viewpoint - Unisoc (紫光展锐) has successfully positioned itself as the fourth largest smartphone chip manufacturer globally, achieving significant growth in market share and revenue through strategic partnerships and product development in the mid-range and low-end markets [3][4][12]. Group 1: Company Background and Development - In March 2023, Unisoc completed its transformation into a joint-stock company, changing its name to 紫光展锐（上海）科技股份有限公司 [2]. - The company has received substantial financial backing, including a credit line of 3.2 billion yuan from a consortium of five major banks and multiple rounds of equity financing totaling 60 billion yuan [2]. - Unisoc was formed through the merger of 展讯通信 and 锐迪科, which were pioneers in GSM and RF chip technology, respectively [5][6]. Group 2: Market Performance and Positioning - In Q1 2025, Unisoc held a 10% share of the global smartphone AP-SoC market, ranking fourth behind MediaTek, Qualcomm, and Apple [2]. - The company achieved a remarkable 14% market share in smartphone chip shipments in 2024, with over 1.6 billion chips shipped, indicating a strong presence in the mid-range and low-end markets [3]. - Unisoc's 5G chip sales surged by 82% year-on-year in 2024, contributing significantly to its overall market share growth [6]. Group 3: Product Innovations and Future Strategies - Unisoc has focused on developing cost-effective 5G solutions, launching its first 5G chip, the Tiger T7510, in 2020, which has been well-received in the market [6]. - The company is diversifying its product offerings by entering new markets such as smart automotive, IoT, and satellite communication, with products like the A7870 automotive chip and V517 5G RedCap chip [7][8][9]. - Unisoc is also making strides in the mid-range market with the introduction of the T9100 processor, aiming to enhance its competitive position against leading chip manufacturers [11].

Core Viewpoint - The bankruptcy of Xinfeng Kuantai Technology (Beijing) Co., Ltd. highlights the challenges faced by domestic semiconductor companies in China, emphasizing that advanced technology alone is insufficient for success in the competitive semiconductor industry [1][8]. Company Overview - Xinfeng Kuantai was founded in October 2011 in Beijing, led by a team of experienced ADC technology experts from Silicon Valley, aiming to break the monopoly of American companies like ADI and TI in the high-performance ADC and AFE chip market, which exceeds $10 billion in size [2][3]. - The company achieved a significant breakthrough in November 2012 with the launch of its first high-speed ADC chip, VAT1002, marking a milestone in China's high-performance ADC industry [3][4]. Business Strategy - Xinfeng Kuantai had a clear commercialization path, targeting sales of 80 million yuan in 2013-2014, 200 million yuan in 2015-2016, and a cumulative sales goal of 1 billion yuan post-2017, indicating a strategic plan for growth [4]. Challenges Faced - Despite its strong technical team, Xinfeng Kuantai struggled to meet its revenue targets, with actual revenues remaining in the millions instead of the expected billions, due to operational issues and an immature local technical team [5][6]. - The high costs associated with developing high-end ADC chips, which can exceed 100 million yuan and take over five years to bring to market, compounded the company's difficulties, especially after its last public financing round in 2013 [6]. Bankruptcy Proceedings - On March 28, 2025, the Beijing First Intermediate People's Court accepted the bankruptcy liquidation case of Xinfeng Kuantai, marking the end of its operations amid intense competition from established international giants [7]. Industry Reflection - The downfall of Xinfeng Kuantai serves as a cautionary tale for the domestic semiconductor industry, underscoring the need for a comprehensive approach that includes technology development, market strategy, and sustainable funding to build resilience against competition [8].

公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容来自 eetimes.eu，谢谢 。 一个新的篇章正在展开，其中构建本地芯片生态系统不仅是一项政策目标，也是对未来的赌注。 过去几年，地缘政治紧张局势、全球供应链中断以及争夺技术主导地位的竞争，凸显了半导体供应链 的重要性和脆弱性，使半导体行业备受关注。如今，世界各国政府不仅将半导体视为商业机遇，更将 其视为关乎经济独立和国家安全的重要议题。 对中东国家来说，这一警钟引发了更大的变革。一个新的篇章正在展开，构建本地芯片生态系统不仅 仅是一项政策目标，更是一场对未来的押注。 在沙特阿拉伯和阿曼，打造本土半导体产业是其宏伟计划的一部分，旨在减少经济对石油收入的依 赖，并打造能够推动未来增长的高科技产业。这些国家着眼长远，投资于人才、基础设施和合作伙伴 关系，以发展本土芯片设计和制造能力。 埃及并非从零开始。该国在微电子和半导体设计领域有着悠久的历史，拥有强大的工程师队伍、研究 中心和活跃于该领域的初创企业。目前，埃及正寻求通过吸引投资、扩大生态系统和巩固其作为区域 设计中心的地位来扩大规模。 本文将深入探讨埃及、沙特阿拉伯和阿曼如何成为半导体领域的焦点。文 ...

1、康美特拟北交所IPO 已完成上市辅导 近日，证监会披露了关于北京康美特科技股份有限公司（简称：康美特）向不特定合格投资者公开发行股票并在北京证券交易所上市辅导工作完成报告，上 市辅导机构为广发证券。 经辅导，广发证券认为，康美特具备成为上市公司应有的公司治理结构、会计基础工作、内部控制制度，充分了解多层次资本市场各板块的特点和属性;康 美特及其董事、监事、高级管理人员、持有百分之五以上股份的股东和实际控制人(或其法定代表人、执行事务合伙人)已全面掌握发行上市、规范运作等方 面的法律法规和规则、知悉信息披露和履行承诺等方面的责任和义务，树立了进入证券市场的诚信意识、自律意识和法治意识。 料显示，康美特是一家专业从事电子封装材料及高性能改性塑料等高分子新材料产品研发、生产、销售的国家级专精特新重点"小巨人"企业。自设立以来， 公司坚持以研发驱动业务发展，围绕有机硅封装材料、环氧封装材料及改性可发性聚苯乙烯材料三大技术平台持续进行技术突破和产业化发展。 其中，公司电子封装材料的主要产品形态为 LED 芯片封装用电子胶粘剂，产品广泛应用于新型显示、半导体通用照明、半导体专用照明、半导体器件封装 及航空航天等领域； ...

一、光刻胶为何如此之难？ 点击 最 下方 " 推荐"、"赞 "及" 分享 "，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 备注：文末附录更多关于光刻胶的报告 正文 在半导体制造领域，光刻胶是一个极为关键的材料，它如同芯片制造的"画笔"，决定着芯片上微观结构 的精度和质量。然而，光刻胶却是一个让无数国内企业望而却步的领域，其难度之大，堪称半导体材料 领域的"珠穆朗玛峰"。本文将深入探讨光刻胶到底难在哪里，以及在当前的产业环境下，是否有机会投 资，又该如何布局。 来源：新材料在线 （一）技术门槛：高不可攀的"护城河" 1、复杂的化学配方 光刻胶是一种高度复杂的化学混合物，其配方涉及多种化学成分的精确配比。它由光引发剂、光刻胶树 脂、单体、溶剂和其他助剂组成。这些成分在特定波长的光照下会发生光化学反应，从而改变光刻胶在 显影液中的溶解度，实现图形化的目的。 然而，不同类型的光刻胶（如g线、i线、KrF、ArF、EUV光刻胶）对配方的要求各不相同。以EUV光 刻胶为例，其需要在极紫外光（波长仅13.5纳米）下工作，这就要求光刻胶具有极高的光敏感度和分辨 率，同时还要具备良好的抗刻蚀性能和低线宽粗糙度。这种 ...

Core Viewpoint - The company, ChipSource Micro (芯源微), is a leading player in the semiconductor equipment sector, focusing on R&D, production, and sales of specialized equipment, and has shown growth in various business segments despite challenges in smaller product sizes [2][3][5]. Financial Performance - In 2024, the company achieved revenue of 1.754 billion yuan, a year-on-year increase of 2.13%, with growth in front-end track, cleaning, and advanced packaging segments, while revenue from small-sized products declined due to market conditions [3]. - R&D expenses for 2024 were 297 million yuan, up 49.9% from the previous year, with an R&D expense ratio of 17%, reflecting a significant increase in investment in materials and services [3]. - In Q1 2025, the company reported revenue of 275 million yuan, a 13% year-on-year increase, but net profit attributable to shareholders dropped 70% to 4.66 million yuan [4]. Business Segments - The company has established four main business segments: front-end coating and developing, front-end cleaning, advanced packaging, and core components, with over 2,000 units shipped, solidifying its position as a domestic leader [2]. - The front-end cleaning machines have captured the domestic market with a leading market share, while the front-end chemical cleaning machines have successfully broken foreign monopolies [2][4]. Market Trends - The semiconductor equipment market in mainland China has seen significant growth, with a market size increase from $6.46 billion in 2016 to $36.6 billion in 2023, and a projected record of $49.5 billion in 2024, reflecting a compound annual growth rate of 28.11% [5]. - The company is benefiting from favorable government policies aimed at supporting the semiconductor industry, which is expected to enhance innovation and competitiveness [5]. Strategic Developments - The company has signed new orders worth 2.4 billion yuan in 2024, a 10% increase year-on-year, with strong growth in front-end chemical cleaning and bonding equipment [4]. - North Huachuang (北方华创) is in the process of acquiring shares in ChipSource Micro, which could enhance synergies between the two companies due to their complementary product offerings in the semiconductor equipment sector [6].