Core Viewpoint - The company has achieved mass production and supply of ultrasonic perception products in the robotics field, although it has not yet had a significant impact on revenue [1]. Group 1 - The company is involved in the robotics sector with a focus on ultrasonic perception products [1]. - Mass production of these products has been realized, indicating progress in the company's technological capabilities [1]. - Current revenue impact from these products is not significant, suggesting that further market penetration or sales growth may be needed [1].

Core Viewpoint - Zejing Electronics has submitted a listing application to the Hong Kong Stock Exchange, with Haitong International and CITIC Securities as joint sponsors, focusing on the development and sales of HUD solutions [1] Company Summary - The company specializes in various HUD products, including W-HUD (Windshield HUD) and AR-HUD (Augmented Reality HUD), aiming to innovate the smart cockpit visual and human-vehicle interaction experience through technological advancements [1] - It has established an integrated self-research technology framework covering optical design, mechanical engineering, electronic design, software algorithms, and human-machine interface (HMI) design [1] - The company's technical capabilities include advanced optical imaging systems, dynamic distortion visualization, stray light simulation, platform mechanical design, electronic device development, ASPICE compliance process development, functional safety, and cybersecurity [1] Industry Summary - The Chinese automotive HUD market is projected to grow from 1 million units in 2020 to 3.9 million units by 2024, with an expected reach of 12.7 million units by 2029, reflecting a compound annual growth rate (CAGR) of 27.9% [1] - In the global market, W-HUD remains the mainstream HUD solution, with sales expected to increase from 10.7 million units in 2024 to 20.9 million units by 2029 [1] - AR-HUD is anticipated to be a future growth driver, with sales projected to rise from 2 million units to 7.6 million units during the same period [1]

Group 1 - Jiangsu Zejing Automotive Electronics Co., Ltd. (referred to as Zejing Electronics) has submitted an application to list on the main board of the Hong Kong Stock Exchange as of November 12 [1] - The company previously submitted its application on May 9, 2025 [1] - Zejing Electronics focuses on the research and development of HUD (Head-Up Display) solutions, primarily offering W-HUD (Windshield HUD) solution CyberLens and AR-HUD (Augmented Reality HUD) solution CyberVision, along with testing solutions and other innovative visual technology solutions [1]

Core Viewpoint - Jiangsu Zejing Automotive Electronics Co., Ltd. (referred to as Zejing Electronics) has submitted an application to list on the Hong Kong Stock Exchange's main board, with Haitong International Capital Limited and CITIC Securities (Hong Kong) Limited acting as joint sponsors [1] Group 1: Company Overview - Zejing Electronics focuses on the research and development of Head-Up Display (HUD) solutions [1] - The company offers a comprehensive range of solutions primarily centered around Windshield HUD (W-HUD) solutions named CyberLens and Augmented Reality HUD (AR-HUD) solutions called CyberVision, along with testing solutions and other innovative visual technology solutions [1] Group 2: Historical Context - The company previously submitted an application to the Hong Kong Stock Exchange on May 9, 2025 [1]

Core Viewpoint - The company has established a special account for raised funds and signed a tripartite supervision agreement to ensure proper management and usage of the funds raised from its public offering [1][3]. Fundraising Overview - The company was approved to publicly issue 40 million shares at a price of 93.50 yuan per share, raising a total of 3.74 billion yuan, with a net amount of approximately 3.53 billion yuan after deducting issuance costs [1]. - The total amount of oversubscribed funds is approximately 522.58 million yuan [1]. Changes in Fund Management - The company has changed the special account for the Harbin Global Automotive Electronics R&D Center project from Shanghai Pudong Development Bank to China Merchants Bank [2]. - A new tripartite supervision agreement was signed with the new bank, and the original account will be closed after transferring the balance [2][3]. Tripartite Supervision Agreement - The agreement involves three parties: the company, China Merchants Bank, and the underwriting institution, CITIC Securities [4]. - The special account is designated solely for the R&D center project and cannot be used for other purposes [5]. - The account balance as of November 10, 2025, is approximately 705.79 million yuan [5]. Responsibilities and Compliance - The underwriting institution is responsible for supervising the use of the raised funds and must conduct at least biannual inspections [6]. - The bank is required to provide monthly account statements to both the company and the underwriting institution [7]. - Any withdrawal exceeding 20% of the net raised funds must be reported to the underwriting institution [7]. Agreement Validity and Termination - The agreement is effective upon signing and will remain in force until all funds are utilized or the agreement is mutually terminated [8]. - Any party violating the agreement will be liable for damages [8].

Core Viewpoint - The overall situation of the automotive market and macroeconomic factors may impact customer production plans and procurement demands, subsequently affecting the timeline for project conversion into orders [1] Group 1 - The company has secured multiple automotive projects that are expected to start releasing orders gradually from 2026 [1] - The lifecycle of these projects is primarily between 5 to 8 years, which will provide sustained growth momentum for the company's automotive electronics business [1]

Market Performance - The main board led the gains with notable increases in stocks such as Tianxiaxiu (+10.06%), Dagang Co. (+10.01%), and Zhongankey (+10.00%) [1] - The ChiNext board saw significant growth with Kexiang Co. (+19.98%), Aerospace Zhizhuang (+16.57%), and Aoni Electronics (+12.70%) [1] - The Sci-Tech Innovation board was also strong, highlighted by Dekeli (+11.93%), Ruikeda (+11.00%), and Yingfang Software (+8.61%) [1] - Active sub-industries included SW Communication Network Equipment and Devices (+1.51%) and SW Other Electronics III (+1.23%) [1] Domestic News - Hezhima Intelligent announced that its flagship product, the Huashan A1000 automotive-grade high-performance auxiliary driving chip, has been successfully integrated into Desay SV's new low-speed unmanned vehicle brand "Chuanxing Zhiyuan" S6 series, establishing a dual-brain redundancy architecture for enhanced safety in logistics automation [1] - CINNO reported that TCL Huaxing's Vietnam base has officially commenced mass production of IT products, with an annual capacity of 4.8 million for both display and notebook computer modules, marking a significant step in TCL Huaxing's global supply chain and Vietnam market strategy [1] - Lanke Technology launched a new generation DDR5 clock driver (CKD) chip, supporting data transfer rates of up to 9200 MT/s, which optimizes client memory subsystem performance for next-generation high-performance PCs, laptops, and workstations [1] - According to reports from South Korean media, Sunic System has received a letter of intent from BOE worth approximately $300 million (about 2.135 billion yuan) for subsequent orders related to OLED evaporation equipment [1] Company Announcements - Dahua Technology announced the repurchase of 33,300,901 shares, accounting for 1.01% of the total share capital, meeting the disclosure standard [3] - Dazhu CNC announced an increase in the expected amount of related party transactions for 2025 by 26 million yuan with Dazhu Laser and its controlling entity [3] - Yidao Information reported its first share repurchase of 22,400 shares, representing 0.02% of total share capital, with a transaction amount of 1,029,221 yuan (excluding transaction fees) [3] - Mingpu Optical Magnetic announced the acquisition of a patent for a vehicle-mounted cold-press integrated inductor and its preparation method, which enhances production efficiency through improved granule uniformity and flowability [3] International News - An international research team successfully developed the world's smallest organic light-emitting diode (OLED) pixel, measuring only 300 nm × 300 nm, achieving 1% external quantum efficiency and a maximum brightness of 3000 cd/m², paving the way for next-generation ultra-high-resolution AR/VR displays [4] - AMD's CTO emphasized that the Zen 6 architecture will cover both standard and high-density core versions, benefiting from significant IPC improvements, enabling generational performance leaps and enriching AI capabilities in Ryzen and EPYC processors [4] - SK Keyfoundry announced the acceleration of research on silicon carbide (SiC) based power semiconductor technology to strengthen its position in the global power semiconductor market, following the acquisition of SK Powertech [4] - GlobalFoundries announced a technology licensing agreement with TSMC for GaN technology, aiming to expedite mass production of next-generation power devices, with production expected to begin in late 2026 [4]

Core Viewpoint - The global smart automotive industry is undergoing unprecedented transformation, driven by software-defined vehicles and AI advancements, leading to a shift in competitive logic within the industry [2][14]. Group 1: Industry Transformation - The transition from distributed architecture to centralized computing platforms signifies a comprehensive change in the automotive sector, with a focus on system integration and cross-domain collaboration [2][3]. - Chinese companies, particularly Desay SV, are showcasing remarkable innovation and are evolving from traditional component suppliers to system solution providers [2][14]. Group 2: Full-Stack Integration - Full-stack integration involves a systematic transformation across multiple technical layers, including hardware-software decoupling, faster OTA upgrades, and enhanced safety and stability requirements [3][4]. - Desay SV is actively implementing full-stack integration in smart cockpits, intelligent driving, and connected services, exemplified by their integrated product ICP S01E [3][9]. Group 3: Growth Strategy - The company's growth strategy is encapsulated in the "growth flywheel" concept, emphasizing comprehensive product solutions, open communication with OEMs, rapid market introduction of new products, and leveraging experience for future innovations [5][6][14]. - Desay SV's R&D investment has seen a compound annual growth rate of 34% over the past five years, focusing on building a complete technology chain from perception to interaction [7][10]. Group 4: Key Technological Focus - The key areas of focus include artificial intelligence and machine learning, intelligent computing platforms, multi-sensor fusion technology, and 5G V2X technology, which together form a complete technology chain for smart vehicles [7][10]. Group 5: Global and Local Integration - Desay SV is expanding its vision from vehicle-centric products to include infrastructure, addressing the limitations of single-vehicle intelligence through vehicle-road collaboration [11][12]. - The company emphasizes the importance of localizing its innovations to fit different markets, advocating for a collaborative approach to global integration [12][14].

Core Insights - Black Sesame Intelligence announced the successful integration of its flagship Huashan A1000 automotive-grade chip into Desay SV's new low-speed unmanned vehicle brand "Chuanxing Zhiyuan" S6 series, establishing a collaborative innovation model in the automotive electronics and chip industry [2] - The Huashan A1000 chip features a dual-brain redundancy architecture, enhancing safety for unmanned logistics operations by monitoring the main control system and taking over in case of anomalies [2] - Desay SV's focus on low-speed unmanned delivery aims to address urban last-mile logistics efficiency challenges, with safety redundancy being a core support for scalable operations [2] Company Performance - Desay SV reported a revenue of 7.692 billion yuan for Q3 2025, a year-on-year increase of 5.63%, and a total revenue of 22.337 billion yuan for the year-to-date, reflecting a 17.72% growth [4] - The net profit attributable to shareholders reached 1.788 billion yuan, up 27.08% year-on-year, with total assets growing by 26.81% to 27.242 billion yuan as of September 30 [4] - The company’s cash flow from operating activities surged by 169.3% to 2.26 billion yuan, supported by a successful fundraising of 4.393 billion yuan for expansion in facilities, production lines, and R&D [4] Technological Advancements - The Huashan A1000 chip has achieved ISO 26262 ASIL-B functional safety certification and AEC-Q100 Grade 2 automotive reliability certification, featuring a dual-core lockstep safety processor [3] - It offers 58 TOPS of high-performance computing power while maintaining low power consumption, capable of efficiently processing various sensor data and ensuring real-time responses in critical scenarios [3] - The chip operates within a wide temperature range of -40°C to 105°C, making it suitable for diverse outdoor and low-temperature storage applications [3] Strategic Developments - Black Sesame Intelligence is expanding its dual-line strategy in the smart automotive and robotics sectors, with the Huashan series focusing on driver assistance and the upcoming Huashan A2000 family embracing large models [5] - The Wudang series targets cross-domain computing, with the C1200 family innovating in electronic and electrical architecture, already receiving positive feedback in multiple scenarios [5] - The company plans to launch a robotics product line, leveraging its automotive technology to reduce development barriers and accelerate product deployment [5] Industry Collaboration - The partnership between Black Sesame Intelligence and Desay SV highlights the importance of upstream and downstream collaboration in the industry, with potential for further expansion in smart logistics and robotics [6] - As Desay SV deepens its focus on unmanned delivery and Black Sesame continues to iterate its chip technology, both companies are positioned to drive new momentum in the smart industry [6]

Core Viewpoint - Hubei Kaiter Automotive Electronics and Electrical Systems Co., Ltd. (Kaiter) has established a partnership with Shanghai Turing Intelligent Manufacturing Co., Ltd. and completed product sampling, although it has not yet generated revenue from this collaboration [1] Group 1: Company Overview - Kaiter was founded in 1996 and specializes in the research, production, and sales of automotive electronic and electrical system products, including sensors, controllers, and actuators [1] - The company is recognized as a national-level specialized and innovative "little giant" enterprise [1] Group 2: Clientele and Market Position - Kaiter's clients include major automotive manufacturers such as SAIC Motor Corporation, GAC Group, and Great Wall Motors, as well as new energy vehicle companies like WM Motor, Xpeng, and HiPhi [1] - The company also supplies products to BYD [1] Group 3: Robotics Application Development - In addition to the ongoing collaboration with Turing Intelligent Manufacturing, Kaiter has formed a joint venture with Xi'an Xutong Electronic Technology Co., Ltd. to focus on developing electronic mechanical brake (EMB) force sensors, encoders, and six-dimensional force sensors for the robotics sector, achieving some progress [1] Group 4: Financial Information - As of November 11, 2025, Kaiter's stock price is 38.25 yuan, with a slight increase of 0.05%, and the total market capitalization is approximately 6.886 billion yuan [2]