Core Insights - Aeluma, Inc. has appointed Bouchaib Nessar as Senior Vice President of Business Development and Product to enhance its commercialization strategy in communication, sensing, and quantum markets [1][4] Company Overview - Aeluma, Inc. is a semiconductor company focused on high-performance, scalable technologies applicable in mobile, AI, defense and aerospace, robotics, automotive, AR/VR, and quantum sectors [6] - The company is headquartered in Goleta, California, and possesses advanced R&D and manufacturing capabilities for semiconductor wafer production, quick-turn chip fabrication, and rapid prototyping [6] Leadership Background - Bouchaib Nessar has over 30 years of experience in commercializing semiconductor photonics solutions, having held significant roles at JDS Uniphase and SCD.USA, where he transformed the company into a leading supplier of infrared sensors [2][3] - His previous leadership at Princeton Lightwave involved launching lasers, quantum sensors, and biomedical detectors [3] Strategic Focus - In his new role, Nessar will focus on data center interconnects for AI infrastructure, imaging sensors for mobile and consumer electronics, and high-performance semiconductor photonics for defense and aerospace [4] - The company has recently experienced an increase in requests for pricing and quotations, indicating a positive trend towards initial sales orders [5]

南财智讯2月10日电，江波龙在投资者关系活动中表示，公司mSSD采用Wafer级系统级封装(SiP)，将主 控、NAND、PMIC等元件整合进单一封装体内，实现了从Wafer到产品化的一次性封装，省去了PCB贴 片、回流焊等多道SMT环节；产品具备明显的制造成本优势，通过集成封装实现轻薄化、紧凑化，在 满足存储协议低功耗要求、大幅降低空间占用的同时，保持了与传统SSD相当的性能水平，并具备更优 异的物理特性。 ...

南财智讯2月10日电，江波龙在投资者关系活动中表示，包括公司在内，全球目前仅少数企业具备在芯 片层面开发UFS4.1产品的能力；搭载公司自研主控的UFS4.1产品在制程、读写速度以及稳定性上优于 市场可比产品；UFS4.1作为消费级存储的高端产品，是Tier1大客户的旗舰智能终端机型的首选存储配 置；公司已与多家晶圆原厂及头部智能终端设备厂商构建深度合作关系，以UFS4.1为代表的旗舰存储 产品正在批量出货前夕。 ...

事件 公司发布业绩预告，预计2025 年实现营业收入约为81.90 亿元，同比增长约25.83%，归母净利润约-5.77 亿元，同比减亏约3.85 亿元。 投资要点 四大产品线齐发力，构建多元增长格局。在市场需求升级、国产替代提速与政策红利加持的多重利好 下，公司产能利用率持续保持高位；依托技术的持续创新迭代，叠加客户版图的稳步拓展与合作深度的 不断深化，公司市场竞争力实现稳步提升，四大核心应用领域收入实现快速增长，成功构筑起车载领域 收入领航增长、工业控制与高端消费领域收入稳健发力、AI 应用领域持续深度渗透的多元增长格局。 同时，公司业务布局从传统晶圆代工向系统解决方案延伸，一站式系统代工平台的商业模式价值效能正 逐步释放，预计2025 年实现营业收入约为81.90 亿元，同比增长约25.83%。 市场复苏不及预期；竞争格局加剧风险；客户导入不及预期。 投资建议： 我们预计公司2025/2026/2027 年营收分别为81.9/102.5/128.3亿元，归母净利润分别为-5.8/0.6/6.3 亿元， 维持"买入"评级。 风险提示： 规模效应显现，毛利率保持增长态势。随着整体营收规模扩大，规模效应显现， ...

Group 1 - The company has responded to an investor inquiry regarding the progress of its collaboration with top domestic and international hardware manufacturers for a home AI host, indicating that the product has not yet been launched [1] - The company provides the DeepEdge 10 Max chip for its home host products aimed at customers [1]

Investment Rating - The investment rating for the company is "Buy" and is maintained [2][7] Core Insights - The company is expected to achieve a revenue of approximately 81.90 billion yuan in 2025, representing a year-on-year growth of about 25.83%. The net profit attributable to the parent company is projected to be around -5.77 billion yuan, indicating a reduction in losses by approximately 3.85 billion yuan [5][6] - The company has established a diversified growth pattern with four major product lines, driven by market demand upgrades, accelerated domestic substitution, and policy benefits. The utilization rate of production capacity remains high, and the company is enhancing its market competitiveness through continuous technological innovation and deepening customer relationships [6] - The gross profit margin is expected to reach 5.92% in 2025, an increase of approximately 4.89 percentage points year-on-year, supported by scale effects and operational efficiency improvements [6] Financial Projections - Revenue projections for 2025, 2026, and 2027 are 81.90 billion yuan, 102.50 billion yuan, and 128.30 billion yuan, respectively. The net profit attributable to the parent company is expected to be -5.8 billion yuan, 0.6 billion yuan, and 6.3 billion yuan for the same years [7][9] - The company is expected to show significant improvement in profitability, with a projected net profit margin turning positive by 2026 [9][12] Relative Valuation - The company operates in the semiconductor industry, focusing on MEMS, IGBT, MOSFET, and other integrated circuits, providing one-stop chip system foundry solutions for various sectors including automotive and industrial control. It is recognized as a leading domestic foundry for automotive-grade IGBT/SiC chips and modules [10][11] - The average price-to-book (P/B) ratio for comparable companies is 4.83x, while the company's projected P/B ratio for 2026 is 3.51x, indicating potential undervaluation [11]

盘面上，两市窄幅震荡，芯片设计概念上涨。相关ETF方面，科创芯片设计ETF天弘（589070）标 的指数盘中涨2.52%，成交额达2985.97万元。成分股中，芯原股份、盛科通信-U、海光信息、灿芯股份 涨超5%，翱捷科技-U、寒武纪-U、东芯股份等多股跟涨。 每日经济新闻 （责任编辑：张晓波 ） 【免责声明】本文仅代表作者本人观点，与和讯网无关。和讯网站对文中陈述、观点判断保持中立，不对所包含内容 的准确性、可靠性或完整性提供任何明示或暗示的保证。请读者仅作参考，并请自行承担全部责任。邮箱： news_center@staff.hexun.com 科创芯片设计ETF天弘（589070）近5日获资金净流入4384万元。截至2026年02月09日，该基金最 新规模为6.54亿元，再创上市以来新高。 科创芯片设计ETF天弘(589070)跟踪的是上证科创板芯片设计主题指数，成分股聚焦科创板芯片设 计领域上市公司。据wind统计，指数在数字芯片设计、模拟芯片设计行业的权重占比超过95%，高度聚 焦半导体产业链的核心设计环节。 消息面上，据Counterpoint Research最新报告显示，内存市场已步入"超级牛 ...

Core Insights - The emergence of SuperPods as a new AI computing infrastructure has become a focal point in the industry since 2025, with Huawei's Ascend 384 SuperPod leading the way in performance metrics compared to foreign competitors [1][3] - The demand for computing power is far from being met, with token consumption expected to exceed trillions daily in China, highlighting the inadequacy of simply stacking servers to address the computing gap [3][4] Group 1: SuperPod Characteristics - SuperPods are not merely about stacking chips; they represent a fundamental restructuring of traditional computing architectures, enabling equal interconnectivity among CPUs, NPUs, and memory units [4][6] - Key features of a true SuperPod include high bandwidth to eliminate communication delays, low latency, and the ability to form a logically unified system through unified memory addressing [6][7] Group 2: Efficiency and Performance - SuperPods can significantly enhance computing efficiency, with potential model utilization rates increasing from 30% to 45%, effectively a 50% improvement, which can help mitigate the limitations of chip manufacturing processes [7][8] - The architecture of SuperPods differs from traditional systems, as Huawei employs optical communication technology, allowing for greater scalability and interconnectivity compared to NVIDIA's copper-based systems [8][9] Group 3: Innovation and Ecosystem - Huawei's systematic innovation in chip design, optical components, and foundational protocols has positioned it uniquely in the market, leveraging over 20 years of experience in optical technology [9][12] - The company is also developing general computing SuperPods, with the TaiShan 950 SuperPod set to launch in Q1 2026, aimed at replacing various server applications [11][12] Group 4: Software and Community Engagement - The success of SuperPods relies not only on hardware but also on a robust software ecosystem, including open-source initiatives like CANN and openEuler, which are crucial for fostering industry collaboration [14] - Huawei has engaged a large developer community, with 3.8 million registered developers for Kunpeng and nearly 4 million for Ascend, emphasizing the importance of open-source collaboration in the AI era [14]

Core Viewpoint - The emergence of SuperPod as a new AI computing infrastructure has become a focal point in the industry since 2025, with Huawei's Ascend 384 SuperPod leading the way in performance metrics compared to foreign competitors [1][3]. Group 1: SuperPod Concept and Advantages - SuperPod is not merely about stacking chips; it represents a fundamental restructuring of traditional computing architecture, enhancing communication efficiency among CPU, NPU, and memory units [4][6]. - The key advantages of SuperPod over traditional clusters include significantly improved computational efficiency, with potential model computing utilization rates increasing from 30% to 45%, equating to a 50% performance boost [7][8]. Group 2: Technical Challenges and Innovations - Building a true SuperPod is complex; Huawei's Ascend 384 SuperPod consists of 12 computing cabinets and 4 bus cabinets, while NVIDIA's NVL72 system is confined to a single cabinet due to architectural differences [8]. - Huawei employs optical communication technology for interconnection, allowing for greater scalability beyond single cabinet limitations, while traditional systems face constraints with electrical signal transmission [8][9]. Group 3: Systematic Innovation and Ecosystem Development - Huawei's systematic innovation includes proprietary chip development, optical device capabilities, and foundational protocols, enabling the creation of SuperPods that leverage full optical interconnectivity [9][12]. - The company is also developing general computing SuperPods, such as the TaiShan 950, which aims to replace various server applications by 2026 [9][11]. - A robust software ecosystem, including open-source initiatives like CANN and openEuler, is essential for the operation of SuperPods, with a focus on collaborative development within the industry [14].

Summary of Conference Call Notes Company and Industry Involved - The notes focus on **Zhongtai Electronics** and **Changdian Technology**, which are key players in the semiconductor packaging and testing industry, particularly in the context of AI advancements and market recovery in the semiconductor sector [1][2]. Core Points and Arguments - **High Capacity Utilization**: The company has maintained high capacity utilization rates in Q1, indicating strong demand despite seasonal trends. This is attributed to the global AI boom and the ongoing recovery in the semiconductor market [1]. - **Price Increases**: Major global competitor, ASE Technology, has initiated price increases ranging from 5% to 20%. Zhongtai Electronics is expected to follow suit, which could lead to profit margins exceeding those seen in 2021 during the current cycle [1]. - **Revenue Projections**: According to Wind consensus estimates, the company's revenue is projected to reach **40.4 billion yuan** by 2025, representing a **30% increase** compared to 2021. Significant growth is anticipated in 2026, which will enhance profit elasticity [1]. - **Demand for Advanced Packaging**: The demand for advanced packaging solutions, essential for AI chips, is expected to surge. As manufacturing capacity ramps up in 2026, the testing and packaging segment is likely to experience a demand explosion [1]. - **High Revenue Potential from Advanced Packaging**: The unit price for 2.5D/3D packaging is projected to reach **$10,000 per piece**. Assuming a production of **10,000 pieces per month**, this could generate an annual revenue of **$1.2 billion**, highlighting the high profit margins and potential for significant revenue growth [1]. Other Important but Possibly Overlooked Content - **Long-term Industry Positioning**: The company has been strategically positioning itself in the advanced packaging sector for several years, which places it in a favorable position to benefit from the anticipated industry growth [1]. - **Market Dynamics**: The semiconductor testing and packaging industry is experiencing a revaluation of assets due to the high capital intensity of various segments, as indicated by the "smile curve" analysis [2].