中新网四川新闻7月10日电(吴平华 郑栋梁 万洪 )8日至9日，2025中国移动产业投资生态合作大会在成都 举行。作为大会"1+6+7"系列活动之一的成都市青羊区"立园满园"产业招商推介大会于9日在青羊区举 行。 成都青羊"立园满园"产 业招商推介大会现场。郑栋梁 摄 青羊借势赋能、以会招商，邀请参加2025中国移动产业投资生态合作大会的40余家企业嘉宾及青羊近期 在谈的20余家重点企业代表走进青羊。大家一路走、一路看、一路议，在产业园区中沉浸式感受青羊经 济社会日新月异的发展面貌，在参观交流中推动中国移动及生态企业与全区创新链、产业链、资金链、 人才链深度融合。 产业园区活力迸发 与会企业印象深刻 园区兴则产业兴，园区强则经济强。产业园区，是与会企业认识青羊、了解青羊的"第一站"。 位于光华大道南侧，占地面积203亩的航空国创中心产业园， A/E区已于2024年4月交付，其他区域正陆 续交付或加快建设中。该产业园聚焦航空装备研发、卫星互联网、工业软件等领域，目前已吸引未尔科 技等多家龙头企业入驻。 企业家们走进航空国创中心产业园，看宣传片、听情况介绍，详细了解园区规划、入驻、配套等相关内 容。其中，航空国创 ...

联合精密：上半年净利润预增46.61%-57.61% 7月10日，联合精密（001268）发布2025年半年度业绩预告，公司预计上半年实现归属于上市公司股东 的净利润4930万元至5300万元，同比增长46.61%-57.61%；预计扣除非经常性损益后的净利润4910万元 至5280万元，同比增长48.58%-59.78%。 资料显示，联合精密成立于2003年8月，主营业务是精密机械零部件的研发、生产及销售。 所属行业：家用电器–家电零部件Ⅱ–家电零部件Ⅲ 映翰通：股东及董事拟合计减持不超过2.79%公司股份 7月10日，映翰通（688080）发布公告称，公司股东常州德丰杰清洁技术创业投资中心（有限合伙）、 深圳市优尼科投资管理合伙企业（有限合伙）-深圳南山阿斯特创新股权投资基金合伙企业（有限合 伙）以及董事、副总经理、核心技术人员韩传俊计划减持公司股份。其中，德丰杰拟减持不超过162.91 万股，占总股本2.21%；南山阿斯特拟减持不超过37.58万股，占总股本0.51%；韩传俊拟减持不超过50 万股，占总股本0.07%。减持原因均为资金需求。 资料显示，映翰通成立于2001年5月，主营业务是工业物联网技术 ...

通过解构不同基金的业绩图景，或许可为探寻下半年投资策略提供关键线索。 宏观环境：经济温和复苏，结构性矛盾凸显 2025年上半年，国内经济在缓慢回暖显著的结构性分化，核心特征表现为生产强于消费和通缩压力延续。这一环境为基金市场的资产配置奠定了基调，也 催生了权益与固收产品的分化表现。 从生产端与需求端的矛盾来看，一方面，生产端根据《2025年招商基金三季度投资策略报告》（下称"报告"），2025年5月工业增加值同比增长5.8%，制 造业PMI为49.5%，较上月回升0.5%，整体来看制造业景气度出现向好趋势，生产端韧性凸显；另一方面，需求端消费复苏呈现k型分化。报告显示，5月 社零同比增长6.4%，较前值回升1.3个百分点，明显高于市场预期的4.9%。其中，以旧换新政策支持的家电、通讯器材消费增速分别大幅提升14.2、13.1个 百分点至53.0%、33.0%。 不难发现，消费的增长主要得益于以旧换新政策的驱动。而这种"生产强于消费"的现状也反映出了居民在收入预期改善有限情况下的选择性支出倾向。 2025年上半年正式收官。从deepseek掀起国产ai浪潮到创新医药后来者居上，从关税博弈的反复拉锯到贸易摩擦的阶 ...

Core Viewpoint - The major asset restructuring plan of Huada Jiutian has been terminated due to a lack of consensus on key transaction terms among parties involved [2][4]. Group 1: Termination of Restructuring - Huada Jiutian announced the termination of its plan to acquire 100% of Chip and Semiconductor Technology (Shanghai) Co., Ltd. and raise supporting funds [2][4]. - The decision to terminate was made after thorough communication and friendly negotiations with relevant parties, and it is stated that this will not adversely affect the company's current operations and strategic development [4]. Group 2: Financial and Operational Context - The company committed to not planning any major asset restructuring for one month following the termination [4]. - The acquisition plan was first announced on March 17, with a transaction proposal released on March 30, aiming to purchase the entire equity of Chip and Semiconductor from 35 shareholders [4]. - Chip and Semiconductor had initiated an IPO counseling process earlier this year, with CITIC Securities as the counseling agency, but the progress has not been updated since April [4][5]. Group 3: Business and Market Implications - Chip and Semiconductor specializes in Electronic Design Automation (EDA) tools, providing comprehensive solutions from chip design to cloud systems, and has applications in various fields including 5G and AI [5]. - Financial projections for Chip and Semiconductor indicate revenues of 106 million yuan and 265 million yuan for 2023 and 2024, respectively, with net profits of -89.93 million yuan and 48.13 million yuan for the same years [5]. - Despite the termination of this acquisition, Huada Jiutian remains committed to mergers and acquisitions as a strategy for growth in the EDA sector, planning to combine self-development, cooperative development, and mergers to enhance its capabilities [6].

峰岹科技的最终发售价为120.5港元，所得款项总额为2,258.70百万港元，扣除基于最终发售价的估计应付上市开支122.38百万港元， 所得款项净额为2,136.32百万港元。 | 所得 款項 | | | --- | --- | | 所得款項總額(附註) | 2,258.70百萬港元 | | 減:基於最終發售價的估計應付上市開支 | (122.38) 百 萬 港元 | | 所得款項淨額 | 2,136.32 百萬港元 | 中国经济网北京7月9日讯 峰岹科技(深圳)股份有限公司（简称：峰岹科技，01304.HK）今日在港交所上市，开盘报130.8港元，涨幅 8.55%。截至今日收盘，峰岹科技报139.8港元，涨幅16.02%。 最终发售价及分配结果公告显示，峰岹科技发售股份数目18,744,400股，其中，公开发售的最终发售股份数目（重新分配后） 8,149,800股，国际发售的最终发售股份数目（重新分配后）10,594,600股。 | 發售股份及股本 | | | --- | --- | | 發售股份數目 | 18.744.400 | | 公開發售的最終發售股份數目(於重新分配後) | 8.149,800 | ...

中国国际金融股份有限公司 关于 希荻微电子集团股份有限公司 发行股份及支付现金购买资产并募集配套资金 之 独立财务顾问报告 （修订稿） 独立财务顾问 二〇二五年七月 中国国际金融股份有限公司 独立财务顾问报告 独立财务顾问声明和承诺 中国国际金融股份有限公司（以下简称"中金公司"、"本独立财务顾问"）接受 希荻微电子集团股份有限公司（以下简称"希荻微"、"上市公司"或"公司"）委托， 担任本次发行股份及支付现金购买资产并募集配套资金（以下简称"本次交易"）的独 立财务顾问，就该事项向上市公司全体股东提供独立意见，并制作本独立财务顾问报告。 本独立财务顾问核查意见是依据《中华人民共和国公司法》《中华人民共和国证券 法》《上市公司重大资产重组管理办法》《上市公司并购重组财务顾问业务管理办法》 《公开发行证券的公司信息披露内容与格式准则第 26 号——上市公司重大资产重组》 《上市公司监管指引第 9 号——上市公司筹划和实施重大资产重组的监管要求》和《上 海证券交易所上市公司重大资产重组审核规则》等法律法规及文件的规定和要求，以及 证券行业公认的业务标准、道德规范，经过审慎调查，本着诚实信用和勤勉尽责的态度， 就本 ...

股票代码：688173.SH 股票简称：希荻微 上市地点：上海证券交易所 希荻微电子集团股份有限公司 发行股份及支付现金购买资产 并募集配套资金报告书（草案）摘要 （修订稿） 交易类型 交易对方 曹建林、曹松林、深圳市链智创芯管理咨询合伙企 发行股份及支付现金购买资产 业（有限合伙）、深圳市汇智创芯管理咨询合伙企 业（有限合伙） 募集配套资金 不超过35名符合条件的特定投资者 独立财务顾问 二〇二五年七月 希荻微发行股份及支付现金购买资产并募集配套资金报告书（草案）（摘要）（修订稿） 上市公司声明 本公司及本公司全体董事、监事及高级管理人员保证重组报告书及本报告书摘要 内容的真实、准确、完整，对重组报告书及本报告书摘要的虚假记载、误导性陈述或 重大遗漏负相应的法律责任。 本公司实际控制人及其一致行动人、董事、监事、高级管理人员承诺，如本次交 易因涉嫌所提供或者披露的信息存在虚假记载、误导性陈述或者重大遗漏而被司法机 关立案侦查或者被中国证券监督管理委员会立案调查的，在案件调查结论明确之前， 将暂停转让所持有的上市公司股份（如有），并于收到立案稽查通知的两个交易日内 将暂停转让的书面申请和股票账户提交上市公司董 ...

Core Viewpoint - The 62nd DAC showcased numerous new exhibitors for 2025, particularly emerging EDA startups that are addressing the complexities of modern chip design through innovative methods, with a strong emphasis on artificial intelligence to enhance design and verification efficiency [1][2]. Group 1: AI in Design Verification - Bronco AI focuses on AI for design verification regression analysis, automating repetitive tasks and generating detailed scripts for debugging processes, which helps reduce organizational friction and improves onboarding for new team members [3]. - ChipAgents claims that their AI-driven chip design environment can enhance RTL design, debugging, and verification efficiency by tenfold, allowing designers to convert concepts into precise specifications using simple language prompts [4][5]. Group 2: Project Management and Collaboration - DSM Pro Engineering is developing a comprehensive RTL-to-GDSII chip design project management system that centralizes project metadata in a programmable SQL database, facilitating collaboration between project managers and engineers [6]. - ITDA Semiconductor offers a drag-and-drop visual designer for SoC systems, enabling users to create and optimize designs quickly, with a focus on power control and clock management [7]. Group 3: Accelerating Verification and Design - MooresLabAI is creating a proxy AI framework to accelerate verification processes, significantly reducing verification time and overall time-to-market [8][9]. - Rise Design Automation aims to enhance RTL design and verification, providing a multi-language toolset that allows users to start from high-level designs and optimize them into RTL, improving simulation speed and design iteration [9][10].

Core Viewpoint - The recent capital activities of Yu Renrong, known as the "Chip King," include the successful IPO of his investment, New Henghui Electronics, and the renaming of his company, Weier Co., to "Haowei Group" [1][2]. Company Overview - Haowei Group, founded in 1995, specializes in image sensor solutions and has expanded through the acquisition of Haowei Technology in 2019. Yu Renrong serves as the chairman and executive director [2]. - The company operates under a Fabless model, focusing on the design, research, and sales of semiconductor products, ranking among the top ten Fabless semiconductor companies globally by 2024 revenue [2]. Business Segments - Haowei Group's primary product lines include: - Image Sensor Solutions: Comprising CIS, CameraCubeChip, LCOS, and ASIC products [3]. - Display Solutions: Including LCD-TDDI, OLED DDIC, and integrated display driver chips [4]. - Analog Solutions: Encompassing PMIC, TVS, and MOSFET [5]. Market Position - By 2024, Haowei Group is projected to be the third-largest supplier of smartphone CIS with a market share of 10.5% and the largest supplier of automotive CIS with a market share of 32.9% [8]. Financial Performance - Revenue for Haowei Group was 20 billion RMB in 2022, increasing to 21 billion RMB in 2023, and projected to reach 25.7 billion RMB in 2024. Net profit decreased from 951 million RMB in 2022 to 544 million RMB in 2023, with a recovery expected to 3.28 billion RMB in 2024 [9][10]. - The gross margin for the years 2022, 2023, and 2024 was 23.7%, 19.9%, and 28.2%, respectively, indicating a decline in 2023 due to inventory management challenges [9][10]. Inventory and Supply Chain - The company has faced high inventory levels, with balances of 12.4 billion RMB, 6.3 billion RMB, and 7 billion RMB for the respective years [11]. - Approximately 85% of revenue in 2024 is expected to come from regions outside mainland China, highlighting potential exposure to international trade dynamics [10]. Research and Development - Haowei Group has invested around 9.4 billion RMB in R&D over the past three years, with R&D expenses accounting for 12.6%, 10.7%, and 10.4% of revenue in the respective years [13]. Future Outlook - The semiconductor industry is characterized by rapid technological advancements, necessitating continuous product and service updates from the company [12]. - The ability to manage inventory effectively and navigate market fluctuations will be critical for the company's future performance [13].

（以上内容为金融界基于公开消息，由程序或算法智能生成，不作为投资建议或交易依据。） 本文源自：金融界 作者：港股君 截至7月9日收盘，晨讯科技（02000.HK）报0.295港元，较上个交易日下跌3.28%，当日盘中最低价触 及0.260港元，创近一年新低。 资金流向方面，当日主力流入0.000万港元，流出0.000万港元，净流出3.39万港元。 晨讯科技集团有限公司是一家领先的移动通讯和物联网企业,2005年在香港主板上市(股票代 码:02000.HK),上市后连续多年市值位居手机设计行业第一位。集团产品覆盖全球130多个国家和地区。 公司的技术能力和品质管控水平在行业里得到广泛认可。集团运营总部位于上海,在上海市长宁区拥有 三万多平方米的研发大楼,在北京、沈阳、合肥、深圳、东莞等地亦建立了研发中心,一千余名工程师组 成的研发团队掌握了无线通讯、智能终端、物联网、AR视觉、人工智能等领域的核心技术,擅长高门 槛、新技术的高端项目。生产基地位于上海青浦、沈阳、东莞等地。集团在供应链管理、生产制造、质 量控制等方面拥有近30年经验,通过了全球顶级通讯运营商、无线通讯客户及汽车行业的严苛认证,能为 各行业客户提供 ...