重要内容提示： ● 本次会议是否有否决议案：无 一、会议召开和出席情况 证券代码：603061 证券简称：金海通 公告编号：2026-016 天津金海通半导体设备股份有限公司2026年第一次临时股东会决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性承担法律责任。 (一)股东会召开的时间：2026年2月5日 本次会议由公司董事会召集，采用现场投票与网络投票相结合的方式召开。公司董事长崔学峰先生主持 会议，符合《公司法》等法律、法规及《公司章程》的有关规定，会议各项决议合法有效。 (五)公司董事和董事会秘书的列席情况 1、公司在任董事9人，列席9人； 2、公司董事会秘书刘海龙先生及其他高级管理人员均列席了本次会议。 二、议案审议情况 (一)非累积投票议案 1、议案名称：《关于使用部分闲置自有资金进行现金管理的议案》 (二)股东会召开的地点：上海市青浦区嘉松中路2188号天津金海通半导体设备股份有限公司上海分公司 M层会议室 (三)出席会议的普通股股东和恢复表决权的优先股股东及其持有股份情况： ■ 注：有表决权股份总数指公司总股本剔除截至 ...

Group 1 - The core viewpoint of the article is that Hengyun Chang (688785.SH) is accelerating its overseas business expansion, focusing on markets outside mainland China [1] - The company plans to prioritize the establishment of sales networks in Taiwan and Europe to reach relevant regional customers [1] - The goal is to shift the sales of semiconductor equipment core components from "importing" to "exporting" [1]

Core Viewpoint - Hengyun Chang (688785.SH) has been actively collaborating with Tuojing Technology since 2018 to develop and validate domestic plasma radio frequency power systems, with products starting to be delivered in the second half of 2020 [1] Group 1: Collaboration and Product Development - The collaboration with Tuojing Technology has expanded to include PEALD equipment, HDPCVD equipment, and advanced packaging bonding equipment, with ongoing validation work for plasma radio frequency power systems [1] - The company has achieved bulk deliveries of its products to semiconductor equipment manufacturers such as Zhongwei Company, Northern Huachuang, Weidao Nano, and Shengmei Shanghai [1] - The company is developing multiple plasma radio frequency power supplies and matching devices for various models of Zhongwei Company, Weidao Nano, Northern Huachuang, and Shengmei Shanghai [1] Group 2: Revenue Growth and Client Diversification - By the first half of 2025, the company expects to achieve sales revenue breakthroughs with leading clients in niche markets such as Yitang Co., SIRUI Intelligent, and Wuxi Yiwen [1] - The company is also developing several in-situ replacement plasma radio frequency power supplies and matching devices for multiple domestic wafer fabs, indicating a continued diversification of its client base [1]

Core Viewpoint - The company has successfully developed and delivered plasma radio frequency power systems in collaboration with TuoJing Technology, expanding its product offerings to various semiconductor equipment manufacturers and diversifying its customer base [1] Group 1: Collaboration and Product Development - TuoJing Technology and the company began the localization development and validation of plasma radio frequency power systems in 2018, with product deliveries starting in the second half of 2020 [1] - The collaboration has expanded to include PEALD equipment, HDPCVD equipment, and advanced packaging bonding equipment, with ongoing validation work for these systems [1] Group 2: Customer Base and Sales Growth - The company has achieved bulk deliveries to semiconductor equipment manufacturers such as Zhongwei Company, Northern Huachuang, Weidao Nano, and Shengmei Shanghai [1] - Sales revenue from leading clients in niche markets, including Yitang Co., SIR Intelligent, and Wuxi Yiwen, is expected to exceed in the first half of 2025 [1] - The company is developing multiple models of plasma radio frequency power systems and matching devices for various models of Zhongwei Company, Weidao Nano, Northern Huachuang, and Shengmei Shanghai [1] Group 3: Market Diversification - The customer structure is continuously diversifying, with the company developing several models of in-situ replacement plasma radio frequency power systems and matching devices for multiple domestic wafer fabs [1]

Core Viewpoint - The company emphasizes its commitment to capacity building and supply chain management, achieving an 80% localization rate for core components, thus ensuring self-control in production [1] Group 1: Capacity and Supply Chain Management - The company has completed its capacity enhancement efforts and is actively promoting localized supply chain development [1] - The localization rate for core components has reached 80%, indicating significant progress in self-sufficiency [1] Group 2: Delivery and Market Dynamics - The delivery schedule is influenced by the complexity of semiconductor wet etching equipment, which focuses on advanced process technology with longer validation cycles [1] - Customers, primarily in the logic sector, have multiple options for both imported and domestic equipment, affecting the company's market strategy [1] Group 3: Business Development - The company plans to enhance its systematic business development capabilities to ensure successful conversion of key opportunities into revenue [1]

Core Viewpoint - The company, Zhichun Technology, is experiencing operational fluctuations in Q4 2025, leading to an overall annual loss despite cumulative profits in the first three quarters [2] Financial Performance - The revenue scale for Q4 2025 is expected to decline both year-on-year and quarter-on-quarter due to unmet delivery expectations [2] - The company has seen an increase in period expenses year-on-year, with a significant rise in Q4 attributed to ongoing strategic expenditures, particularly in R&D [2] Risk Factors - Credit impairment losses are impacting the financials, with specific provisions being made for legal matters that involve international litigation, which has a lengthy judgment and execution cycle [2] Strategic Initiatives - The management is focused on strategic business concentration, optimizing resource allocation, and enhancing accounts receivable management [2] - The company aims to improve operational quality by increasing orders and deliveries of high-end wet process equipment and expanding its electronic materials business, such as bulk gas stations [2] - The company emphasizes safeguarding investor rights and enhancing sustainable profitability through solidifying technological barriers and refined operations [2]

Core Viewpoint - The semiconductor equipment industry is entering a high-growth cycle driven by AI computing demand, domestic substitution, and global capacity expansion, with significant performance improvements from both international and domestic companies [4][7][21]. Group 1: Industry Performance - ASML reported a net sales of €32.7 billion in 2025, a 16% year-on-year increase, with a backlog of €38.8 billion in unfulfilled orders [4]. - Samsung's semiconductor business saw a 33% increase in operating profit, while SK Hynix's Q4 operating profit surged by 137% year-on-year [4]. - Domestic semiconductor equipment companies like Jinhaitong and Changchuan Technology also announced significant performance increases [4]. Group 2: Demand Drivers - The scale application of generative AI has drastically reshaped storage demand, with AI server DRAM needs being eight times that of regular servers and NAND needs three times higher [6]. - High Bandwidth Memory (HBM) is emerging as a core growth engine, with a projected CAGR of 33% from 2024 to 2030, potentially capturing 50% of the DRAM market by 2030 [6]. - Major global storage manufacturers are ramping up production, with Samsung's capital expenditure for 2025 expected to increase by 89% and SK Hynix raising its annual capital expenditure to $20.3 billion [6]. Group 3: Domestic Substitution Progress - The domestic semiconductor equipment localization rate is expected to reach 35% in 2024, doubling from 16.4% in 2022, with etching equipment localization at 23% and CMP equipment at 30%-40% [7]. - China has maintained its position as the largest semiconductor equipment market globally for five consecutive years, with sales expected to reach $49.54 billion in 2024, accounting for 42.34% of the global market [7]. Group 4: Future Trends - The global DRAM industry capital expenditure is projected to reach $61.3 billion in 2026, a 14% year-on-year increase, while NAND Flash capital expenditure is expected to be $22.2 billion, up 5% [9]. - ASML's order situation reflects high industry prosperity, with €13.2 billion in new orders in 2025, including €7.4 billion for EUV lithography machines, and a backlog extending to 2027 [9]. - The global semiconductor equipment market is projected to reach $117 billion in 2024, with a CAGR of 8.4% from 2025 to 2033, potentially growing to $224.93 billion by 2033 [9]. Group 5: Key Segments - The etching equipment market, representing 22% of the front-end equipment market, is expected to reach a domestic market size of ¥48.67 billion in 2025 [12]. - Thin film deposition is also experiencing rapid growth, with a global market size of $12.68 billion, driven by domestic leaders like TuoJing Technology [12]. - Testing and packaging equipment are benefiting from advanced process promotion and capacity expansion, with companies like Changchuan Technology and Huafeng Measurement Control covering multiple semiconductor fields [12]. Group 6: Material and Component Localization - The localization rate of core semiconductor equipment components is expected to rise from 10% to 20% in 2024, with Anji Technology's CMP polishing liquid achieving a 15% global market share [14]. - Continuous breakthroughs in supporting segments are enhancing the competitiveness of domestic equipment, fostering a collaborative development advantage across the entire industry chain [14]. Group 7: Strategic Outlook for 2026 - The advanced process competition is intensifying, leading to a surge in demand for high-end equipment, with global semiconductor giants pushing for 2nm and below processes [17]. - Policy and capital are driving domestic substitution deeper into high-end segments, with significant support for key technologies and substantial financing events in the semiconductor equipment sector [18]. - The demand structure is optimizing, with emerging fields like AI computing centers and electric vehicles creating new growth opportunities, while domestic companies expand into overseas markets [19].

Core Insights - The semiconductor equipment industry is experiencing significant growth driven by AI computing power, domestic substitution, and global capacity expansion, marking a definitive growth cycle for the sector [1] Group 1: Industry Performance - ASML reported a net sales of €32.7 billion in 2025, a 16% year-on-year increase, with a backlog of orders reaching €38.8 billion, of which €25.5 billion is from EUV [1] - Samsung's semiconductor business saw an operating profit increase of 33%, while SK Hynix's Q4 operating profit surged by 137% [1] - Domestic semiconductor equipment companies like Jinhaitong and Changchuan Technology also reported significant performance increases, indicating a robust domestic market [1] Group 2: Demand Drivers - The rise of generative AI has drastically reshaped storage demand, with AI servers requiring 8 times more DRAM and 3 times more NAND than regular servers, and each AI server needing up to 2TB of storage [3] - HBM (High Bandwidth Memory) is emerging as a key growth driver, with a projected CAGR of 33% from 2024 to 2030, expected to capture 50% of the DRAM market by 2030 [3] - Major global storage manufacturers are ramping up production, with Samsung's capital expenditure for 2025 increasing by 89% and SK Hynix raising its annual capital expenditure to $20.3 billion [3] Group 3: Domestic Substitution and Market Share - The domestic semiconductor equipment localization rate is projected to reach 35% by 2024, doubling from 16.4% in 2022, with etching equipment localization at 23% and CMP equipment at 30%-40% [4] - China remains the largest semiconductor equipment market globally, with sales expected to reach $49.54 billion in 2024, accounting for 42.34% of the global market [4] - The continuous expansion of domestic wafer fabs provides ample validation scenarios for local equipment, creating a positive cycle of technological breakthroughs and market share increases [4] Group 4: Future Trends - The global DRAM industry capital expenditure is forecasted to reach $61.3 billion in 2026, a 14% increase year-on-year, while NAND Flash capital expenditure is expected to reach $22.2 billion, a 5% increase [6] - ASML's order situation reflects high industry prosperity, with €13.2 billion in new orders in 2025, including €7.4 billion for EUV lithography machines, and a backlog extending to 2027 [6] - The global semiconductor equipment market is projected to reach $117 billion in 2024, with a CAGR of 8.4% from 2025 to 2033, potentially growing to $224.93 billion by 2033 [6] Group 5: Key Segments and Opportunities - The etching equipment segment holds a 22% market share in the front-end equipment market, with the domestic market size reaching ¥48.67 billion in 2025 [8] - Thin film deposition is also experiencing rapid growth, with a global market size of $12.68 billion, supported by domestic leaders like TuoJing Technology [8] - Testing and packaging equipment are benefiting from the promotion of advanced processes, with companies like Changchuan Technology and Huafeng Measurement Control expanding their product coverage [8] Group 6: Material and Component Localization - The localization rate of core semiconductor equipment components is expected to rise from 10% to 20% in 2024, with Anji Technology's CMP polishing liquid achieving a 15% global market share [9] - Continuous breakthroughs in supporting segments enhance the competitiveness of domestic equipment, fostering a collaborative development advantage across the entire industry chain [9] Group 7: Strategic Outlook for 2026 - The competition in advanced processes is intensifying, driving demand for high-end equipment, with major global players focusing on 2nm and below technologies [11] - Policy and capital support are crucial for deepening domestic substitution, with significant investments in key technologies and local industry clusters receiving subsidies [13] - The demand structure is diversifying, with emerging fields like AI computing centers and electric vehicles driving growth, while domestic companies expand into overseas markets [14]

半导体行业布局顺利，紧抓大尺寸碳化硅材料历史机遇。1）半导体材料领域，公司完成12 英寸碳化硅 衬底关键技术突破，并建设加工中试线，加快推进碳化硅衬底片海外产能布局，抢抓第三代半导体材料 市场机遇；不断提高石英坩埚产品品质及服务能力，石英坩埚市场份额持续提升。 2）半导体精密零部件领域，公司加强核心零部件国产化的延伸布局，持续深化与产业链核心客户的合 作，不断提升产品供应与综合服务能力，紧抓半导体产业链国产化提速的行业趋势，公司半导体精密零 部件业务实现产业规模快速提升，市场竞争力持续增强。3）半导体设备端，公司开发了应用于芯片制 造的8-12 英寸减压外延设备、ALD 设备等薄膜沉积类设备，应用于先进封装的12 英寸减薄抛光机、12 英寸减薄抛光清洗一体机、超快紫外激光开槽设备。以差异化的工艺和技术优势，为客户提供优质的产 品和服务，有望跟随客户放量。 盈利预测：预计公司25-27 年实现营业收入110.79/109.42/119.27 亿元，归母净利润10.50/17.77/20.31 亿 元。公司深耕光伏设备，单晶炉龙头地位明确，紧抓大尺寸碳化硅材料历史机遇，首次覆盖，给予"推 荐"评级。 风险提示:下 ...

记者2月4日从中电科电子装备集团有限公司（以下简称电科装备）获悉，近日，由电科装备下属北京中电科公司自主研制的国内首台套12英寸 碳化硅晶锭减薄设备、衬底减薄设备成功发货，顺利交付行业龙头企业，标志着国产设备在大尺寸碳化硅加工领域实现新突破，为大尺寸衬底 产能升级提供重要装备保障。 此外，两款设备均为全自动设备，满足大尺寸产线无人化、智能化生产需要，搭配电科装备自研的激光剥离设备，在减薄和剥离工艺高效协同 下，可将材料损耗降低30%以上，在进一步保障加工品质一致性的同时，提升产线量产能力、强化成本控制。 后续，电科装备将着力突破大尺寸碳化硅加工装备系列化研发与规模化应用的关键瓶颈，助力我国第三代半导体产业链向高端跃升。 此次推出的两款设备分别针对晶锭和衬底减薄的不同工艺难点，实现了关键技术突破：晶锭减薄机创新采用自动化抓取与吸附双模式搬送系 统，可确保大尺寸晶锭的稳定高效传输，大幅缩短加工周期，适配规模化量产需求；衬底减薄机则集成自主研发的超精密空气主轴与气浮承片 台等关键轴系，可将晶圆片内厚度偏差稳定控制在1微米以内，攻克了均匀性控制难题，达到国际先进水平。 ...