（原标题：从"链全球"到"领未来" 深圳让优秀企业"落得下、长得好"） 最近，深圳再次成为世界瞩目的焦点。 近日，2025深圳全球招商大会落下帷幕。大会洽谈签约项目超340个，涉及投资总额超7700亿元，以丰 硕成果彰显深圳作为全球投资热土的强大吸引力。会上，深圳向全球企业家、科学家、投资者及各类优 秀人才来发出"城市合伙人"的邀请。 "开放链全球，创新领未来"。从"链全球"到"领未来"，是姿态，更是行动。这不仅是一场汇聚全球资本 与智慧的盛会，更是一次对深圳城市特质与发展势能的集中展示。 就在12月11日，2026年亚太经合组织非正式高官会举行，APEC"中国年"正式拉开序幕。这场国际盛会 选择深圳，既是对城市综合实力的高度认可，更是全球赋予深圳的重大发展机遇。 站在"十四五""十五五"交汇的历史关口，作为APEC中国第三城的深圳再次成为世界瞩目的焦点。开放 创新的深圳以其雄厚的产业生态和一流的营商环境，向世界发出了携手共赢的时代强音。 创新不问出身的活力 创新，是深圳最鲜明的标识，也是其吸引全球投资者的核心优势。 一组数据足以佐证：全社会研发投入强度达6.67%，跃居全国城市首位；深圳-香港-广州创新集群 ...

Core Viewpoint - The company, Xingsen Technology, confirmed that its PCB, semiconductor test boards, and IC packaging substrate businesses are operating normally, with readiness for mass production in the FCBGA packaging substrate segment depending on industry demand recovery and client progress [2] Group 1 - The company is actively engaged in the production of PCB, semiconductor test boards, and IC packaging substrates [2] - The FCBGA packaging substrate business has achieved sufficient production capacity and product yield for mass production [2] - The timeline for large-scale mass production is primarily influenced by the recovery of industry demand, the production progress of clients, and their supplier management strategies [2]

证券日报网讯12月15日，兴森科技（002436）在互动平台回答投资者提问时表示，截至2025年12月10 日，公司股东总户数为十一万一千余户。 ...

Core Viewpoint - Longqi Technology announced plans to use idle self-owned funds for entrusted wealth management, with a proposed limit of 5 billion RMB [2] Group 1 - The company will hold its fourth board meeting on December 15, 2025, to review the proposal for the 2026 fiscal year [2] - The proposed entrusted wealth management amount is 5 billion RMB, which includes the principal [2] - The funds can be used on a rolling basis, with any investment amount at any point in time not exceeding the proposed limit [2]

Group 1 - The core viewpoint of the article is that the company, Xingsen Technology, is focusing on digital transformation and high-end packaging substrate strategies, particularly in the FCBGA packaging substrate market [1] - The company identifies chip design firms and packaging manufacturers as target customers for its packaging substrate business, although specific customer collaborations cannot be disclosed due to confidentiality agreements [1] - The company is accelerating the market expansion of its FCBGA packaging substrate project to enhance its core competitiveness [1]

Core Viewpoint - The company plans to invest a total of 4.297 billion RMB in its Thailand park for the construction of production facilities and supporting infrastructure in 2026, aiming to capitalize on the growing AI application market [1] Investment Plan - The board of directors has approved the investment plan for 2026, which includes the construction of production plants and related facilities in Thailand [1] - The investment will also focus on increasing production capacity for high-end HDI (including SLP), HLC, and other products [1] Market Strategy - The investment is aimed at providing comprehensive PCB solutions across various fields, including servers, AI edge products, and low-orbit satellites, to meet the demands of the rapidly growing AI market [1] - The project is expected to enhance the company's "cloud-edge-end" full industry chain layout and accelerate its global business expansion [1]

Core Viewpoint - The company, Pengding Holdings, has approved an investment plan for 2026 to invest a total of 4.297 billion RMB in a production park in Thailand, focusing on the rapidly growing AI application market [1] Investment Plan - The investment will be used for the construction of production facilities and supporting infrastructure in Thailand [1] - The investment includes the capacity expansion for high-end HDI products, including SLP and HLC, to provide comprehensive PCB solutions across various fields such as servers, AI edge products, and low-orbit satellites [1] - The project is scheduled to be completed throughout the year 2026 [1] Strategic Goals - The investment aims to capitalize on the AI trend and leverage the ONEAVARY product technology platform [1] - The company intends to accelerate its full industry chain layout for AI, covering cloud, management, and edge [1] - This move is part of the company's strategy to enhance its global business footprint [1]

证券日报网讯12月15日，兴森科技（002436）在互动平台回答投资者提问时表示，公司不涉及封装业 务，CPO封装主要是用MSAP工艺，公司的产品可用于CPO产品的封装。 ...

Group 1 - The company has confirmed that it possesses a comprehensive product matrix covering liquid cooling, air cooling, and other thermal management solutions, indicating its capability as a "full-stack cooling expert" [2] - The company has developed and produced a range of products including CDU, liquid cooling modules, liquid cooling plates, air cooling modules, heat pipes, heat spreaders, and graphite sheets, showcasing its systemic thermal solution capabilities [2] - The company has already begun bulk shipments of cooling modules and other products to international clients such as AMD, highlighting its presence in the global market [2]

Core Viewpoint - The company, Lingyi Zhi Zao (002600), has developed a comprehensive product matrix covering a full range of cooling solutions, including liquid cooling and air cooling products, and has the capability for research, development, and production of various cooling solutions [1] Group 1 - The product matrix includes CDU, liquid cooling modules, liquid cooling plates, air cooling modules, heat pipes, uniform heat plates, and graphite sheets [1] - The company has successfully shipped cooling modules and other products in bulk to international clients such as AMD [1]