那么，这些工厂都属于哪些行业？它们成长为领航工厂的"密码"是什么？它们有哪些共性，又昭示着怎 样的发展趋势？ 基本覆盖制造业重点赛道 中国发展改革报社记者 卜文娟 近日，工业和信息化部等六部门联合公布2025年度领航级智能工厂培育名单，全国首批15家领航级智能 工厂正式亮相。这些工厂覆盖装备制造、原材料、电子信息、消费品等关键行业，是政策引导下的"标 杆样本"，也是技术创新与产业升级的"实践先锋"。 工业和信息化部相关负责人表示，领航级智能工厂代表着我国当前制造业发展的最高水平，为行业持续 探索未来发展新模式，对我国制造业转型升级有着明显的标杆示范效应。 作为我国制造业的核心引擎之一，长三角地区凭借雄厚的产业基础、活跃的创新生态及政策协同优势， 已成为领航级智能工厂的集中发展区域。 从长三角入选企业的实践成效来看，领航级智能工厂的创新价值已充分显现。例如，徐州重型机械有限 公司通过人工智能驱动的研发与制造模式提升全球定制能力，订单交付周期缩短55%；宝钢通过以人工 智能驱动的预测式制造提升硅钢全流程效率，成品库存下降超50%；上海航天设备制造总厂构建智能化 全流程链动模式，支撑高可靠宇航产品规模化生产，显著降 ...

2025年12月的全球大宗商品市场，现货白银价格一举突破了每盎司60美元的历史关口，年内涨幅超过 110%。 这个曾经安静待在黄金阴影下的金属，如今正上演着资本市场最疯狂的行情。 但如果你认为这只是一场普通的资本投机狂欢，那就大错特错了。 这场席卷全球的"白银风暴"，核心的旋风眼正来自中国的一项将于2026年1月正式实施的出口管制新 政。 中国为何此时选择收紧白银出口呢？而西方世界又将如何接招？ 根据商务部2025年10月发布的公告，2026到2027年度的白银出口要实行国营贸易企业申报制度。 生产企业想申报出口资质，要么之前连续三年有出口实绩，要么新申请的企业年产量得达到一定标准， 西部地区的企业虽然标准稍微放宽，但也有明确要求。 而且不管是生产企业还是流通企业，都得通过质量体系和环境管理体系认证，按时缴纳各项社会保险， 没有违法违规记录才能申报。 以前白银出口是配额加许可证的双轨制，企业拿到配额基本就能出口，现在改成了严格的出口许可证管 理。 也就是说，就算有资质的企业，出口时也得提交用途说明、下游客户资质证明，商务部还要联合相关部 门审核合同的真实性和合规性。 这重点限制那些无序出口和低附加值的加工品外 ...

Core Viewpoint - The company, Qipai Technology, has announced a plan to raise no more than 159 million yuan through a private placement, primarily to supplement its working capital, amidst ongoing financial losses over the past three and a half years [2][5]. Group 1: Fundraising Details - Qipai Technology plans to issue shares at a price of 20.11 yuan per share, with a total of no more than 7.9 million shares to be issued [5]. - The issuance will be fully subscribed by the actual controllers, Liang Dazhong, Bai Ying, and their son Liang Huate, indicating their strong support and confidence in the company's future [5][8]. - The funds raised will be used entirely to improve the company's liquidity, which is crucial given the capital-intensive nature of the semiconductor packaging and testing industry [8]. Group 2: Financial Performance - The company has reported continuous losses, with net profits of -58.57 million yuan in the first half of 2025, which is a deterioration of 18.07 million yuan compared to the same period last year [11]. - Revenue for the first half of 2025 was 326 million yuan, reflecting a year-on-year growth of 4.09% [11]. - The company has experienced a significant stock price rebound since April, with an overall increase of over 21% year-to-date, although it faced a decline of 3.90% on August 14, closing at 26.38 yuan per share [9][11]. Group 3: Company Background and Industry Position - Qipai Technology is a leading domestic semiconductor packaging and testing company in South China, having been listed on the STAR Market in June 2021 [10]. - The company has developed several core technologies in semiconductor packaging, including GaN RF power amplifier packaging technology and high-density matrix integrated circuit packaging technology, which provide it with a competitive edge in the industry [10]. - Despite its technological advancements, the company has struggled financially, with projected revenues of 540 million yuan, 554 million yuan, and 667 million yuan for 2022, 2023, and 2024, respectively, alongside increasing net losses [10].

Group 1: Food Science and Technology - The 27th China Association for Science and Technology Annual Conference is focusing on key common technologies in food science, aiming to address global food supply and safety challenges while fostering new productive forces in the food industry [1][3] - Experts discussed high-quality food supply, functional ingredient extraction, and innovative development in the food industry, proposing practical solutions to implement the "Big Food Concept" [3] Group 2: Green Low-Carbon Energy Technology - The "Green Low-Carbon Energy Technology Development and Integration Innovation" forum emphasizes the importance of developing green low-carbon energy technologies for sustainable development and national energy security [5] - The forum includes discussions on opportunities and challenges in low-carbon energy, new technologies and methods in low-carbon energy chemistry, and smart systems for low-carbon energy [5] Group 3: Electronic Chemicals - The "Key Materials Design and Preparation of Electronic Chemicals" forum addresses the need for a safe and controllable development path for China's electronic chemicals industry, which is crucial for sectors like semiconductor manufacturing and 5G communications [6] - Experts aim to enhance China's independent innovation capabilities in high-end electronic chemicals through collaborative innovation platforms and strategic planning [6]

Core Viewpoint - The article discusses the evolution of semiconductor technology, particularly focusing on the transition from traditional SoC (System on Chip) designs to Chiplet architectures, which are expected to extend the economic benefits of Moore's Law in the post-Moore era [4][6][18]. Group 1: Chiplet Technology - Chiplet architecture allows for modular design, enabling flexible customization for specific applications, which can lead to significant performance and cost optimizations [5][7]. - The Chiplet model is anticipated to reduce development cycles and risks associated with chip manufacturing, as seen in AMD's 32-core Chiplet example, which has a total area of 852 mm² compared to a SoC's 777 mm² [5][6]. - Chiplet technology is gaining traction in various fields, including FPGA, CPU, and GPU, with a projected market growth rate (CAGR) of 46% for FPGA and 58% for GPU applications from 2018 to 2025 [10][9]. Group 2: Advanced Packaging Techniques - Advanced packaging technologies such as 2.5D and 3D packaging are critical for the successful implementation of Chiplet architectures, enhancing integration and performance [13][16]. - The industry is focusing on various advanced packaging methods, including Flip-Chip, Wafer Level Packaging, and System in Package (SiP), which improve electrical performance and reduce overall costs [13][16]. - Major players like TSMC, Intel, and Samsung are investing heavily in high-performance packaging as a key direction for the next generation of semiconductor technology [16]. Group 3: SiC Power Semiconductors - Silicon Carbide (SiC) is emerging as a preferred material in the post-Moore era due to its superior performance in high-power and high-frequency applications, particularly in electric vehicles and renewable energy systems [20][22]. - The global SiC power device market is expected to grow significantly, with a CAGR of 42.4% from 2017 to 2021, driven by applications in electric vehicles and industrial automation [28][29]. - SiC devices offer advantages such as higher efficiency, reduced size, and improved thermal performance compared to traditional silicon devices, making them ideal for high-temperature and high-voltage applications [22][27]. Group 4: Market Dynamics and Trends - The SiC power device market is rapidly expanding, with China increasing its market share significantly, indicating a shift in the global supply chain dynamics [28][30]. - The SiC industry is characterized by a strong reliance on substrate suppliers, with a significant portion of the market controlled by foreign companies, highlighting the need for domestic investment and development [30][32]. - The cost structure of SiC devices is heavily influenced by substrate and epitaxy processes, which are critical for maintaining competitive pricing and performance in the market [30][32].