智算芯片
Search documents
建设全国一体化算力网络按下“加速键” 向“智”向“绿”转型发展
Yang Shi Wang· 2025-12-15 02:08
央视网消息:记者从工业和信息化部了解到,我国正有序推进算力中心建设布局,提升智算资源供给能力和资源利用效率,加速构建协同 高效的全国一体化算力网络。 数据显示,我国算力基础设施规模和水平不断提升,在用算力中心规模达1250万标准机架。当前,我国算力发展面临着算力监测效率不 高、算力供需信息不全、算力分配缺乏全局规划等难点。 工业和信息化部副部长张云明称:"合力布局智能算力设施,加快构建全国一体化算力网络,深化人工智能在信息通信网络中的部署应 用,提升信息通信业支撑AI、应用AI、融合AI的能力。" 工业和信息化部日前发布的《算力互联互通行动计划》提出,构建算力互联互通平台体系,实现不同主体、不同架构的公共算力资源标准 化互联。 中国信通院云计算与大数据研究所副所长栗蔚称:"2025年整体体系完成试验验证阶段,算力标识网关、高性能传输协议、异构计算API 等标准化接口和协议在试验阶段实现公共算力标准化互联可行,到2028年形成具备智能感知、实时发现、随需获取的算力互联网。" 国际数据公司预计,中国智能算力规模仍将保持高速增长,2025年将较2024年增长43%,2026年中国智能算力规模将达到2024年的两倍。 ...
经济大省挑大梁|上海高质量孵化器再扩容,至今共启动建设18家
Xin Lang Cai Jing· 2025-12-11 09:21
上海唯一聚焦新材料的高质量孵化器 新材料的产业下游可以链接到各种各样的应用行业,其产业特征被形容为"三高三长"——高投入、高难 度、高门槛;长研发周期、长验证周期、长应用周期。这既体现了新材料企业产业化的痛点和难点,也 更彰显了孵化器的必要价值。 上 来源:智通财经记者 蒋乐来 上海新一轮高质量孵化器名单再次扩容。 智通财经(www.thepaper.cn)记者12月11日从上海市科委获悉,巢生上海创新孵化平台、司南脑机智能 孵化器、上海埃米三江新材料产业创新中心、"数通链谷"区块链应用创新孵化器、"大零号湾"科创策源 孵化器、张江高科895孵化器等6家"新生力量"被纳入其中。 2023年6月,上海发布《上海市高质量孵化器培育实施方案》。截至2024年底,已在浦东张江、徐汇西 岸以及临港、嘉定、杨浦等区域,围绕大模型、光电量子、智能传感、人形机器人、合成生物、细胞与 基因治疗等新兴产业领域等前沿赛道,陆续启动建设了12家高质量孵化器。此次扩容后,这一数量达到 18家。 巢生上海创新孵化平台位于浦东张江,重点聚焦生物医药产业合成生物、细胞与基因治疗等领域。该平 台致力于寻找具有颠覆性可能的生命科学底层技术,开展 ...
“装”点未来——2025“引领汽车技术与装备发展”创新成果征集正式启动
Zhong Guo Jin Rong Xin Xi Wang· 2025-09-22 03:02
Core Viewpoint - The Ministry of Industry and Information Technology, in collaboration with various organizations, has launched an initiative to collect innovative cases that drive high-quality development in the automotive industry, particularly focusing on new energy vehicles and advanced technologies. Group 1: Key Directions for Innovation - Direction 1: Breakthrough Automotive Technologies - The initiative seeks to gather submissions on disruptive power technologies, cross-domain integration technologies, AI-enabled technologies, and exploratory results that have significant potential to lead the industry [1]. - Direction 2: Intelligent Manufacturing Equipment - The focus is on collecting innovative manufacturing equipment that meets the demands of large-scale customization, agile flexible production, and lightweight manufacturing for new energy vehicles, including advanced CNC machine tools and intelligent robots [2]. - Direction 3: Intelligent Chassis - The initiative aims to collect technologies and products related to intelligent chassis that enhance the intelligence, driving performance, and safety of new energy vehicles [3]. - Direction 4: Intelligent Computing Chips - The focus is on gathering products that provide computational support for scenarios such as autonomous driving and intelligent cockpits, which are essential for upgrading automotive electronic chip technology [4]. Group 2: Submission Process and Timeline - The collection period runs from September 18 to October 10, 2025, and is open to the public [4]. - Participants are required to prepare materials according to the "Innovation Achievement Submission Template" and ensure that the intellectual property rights of the technologies involved are clearly defined [4]. - After the submission period, a panel of industry experts will review the cases and select outstanding examples, with a maximum of 10 per direction, to be announced at the "2025 Automotive Technology and Equipment Development Forum" [4].
报名仅剩2天!是德科技 & 南京ICisC 高速芯片测试技术研讨会
芯世相· 2025-05-19 04:19
Core Insights - The article discusses the development trends of intelligent computing chips and edge AI chips amidst the AI boom, highlighting the increasing demand for high-speed chips and the challenges in testing them [1] Group 1: Event Overview - The event titled "Keysight & Nanjing ICisC High-Speed Chip Testing Technology Seminar" will take place on May 21, focusing on semiconductor technologies popular in 2025 and testing methods for high-speed chips [1] - The seminar will cover topics such as PCIe 5.0/6.0 technology, Ethernet technology, MIPI, and USB technology, with live demonstrations of high-speed chip testing [1][2] Group 2: Agenda Highlights - The agenda includes a welcome speech, an introduction to the Nanjing Integrated Circuit Industry Service Center (ICisC), discussions on key technologies and measurement for intelligent computing chips, and challenges in testing consumer-side chips [9] - There will be a tea break and opportunities for free communication among participants, followed by a technical salon [9] Group 3: Participant Benefits - Attendees will receive practical gifts such as Xiaomi backpacks, with limited availability on a first-come, first-served basis [2][5][7]