Workflow
智算芯片
icon
Search documents
“装”点未来——2025“引领汽车技术与装备发展”创新成果征集正式启动
Core Viewpoint - The Ministry of Industry and Information Technology, in collaboration with various organizations, has launched an initiative to collect innovative cases that drive high-quality development in the automotive industry, particularly focusing on new energy vehicles and advanced technologies. Group 1: Key Directions for Innovation - Direction 1: Breakthrough Automotive Technologies - The initiative seeks to gather submissions on disruptive power technologies, cross-domain integration technologies, AI-enabled technologies, and exploratory results that have significant potential to lead the industry [1]. - Direction 2: Intelligent Manufacturing Equipment - The focus is on collecting innovative manufacturing equipment that meets the demands of large-scale customization, agile flexible production, and lightweight manufacturing for new energy vehicles, including advanced CNC machine tools and intelligent robots [2]. - Direction 3: Intelligent Chassis - The initiative aims to collect technologies and products related to intelligent chassis that enhance the intelligence, driving performance, and safety of new energy vehicles [3]. - Direction 4: Intelligent Computing Chips - The focus is on gathering products that provide computational support for scenarios such as autonomous driving and intelligent cockpits, which are essential for upgrading automotive electronic chip technology [4]. Group 2: Submission Process and Timeline - The collection period runs from September 18 to October 10, 2025, and is open to the public [4]. - Participants are required to prepare materials according to the "Innovation Achievement Submission Template" and ensure that the intellectual property rights of the technologies involved are clearly defined [4]. - After the submission period, a panel of industry experts will review the cases and select outstanding examples, with a maximum of 10 per direction, to be announced at the "2025 Automotive Technology and Equipment Development Forum" [4].
报名仅剩2天!是德科技 & 南京ICisC 高速芯片测试技术研讨会
芯世相· 2025-05-19 04:19
Core Insights - The article discusses the development trends of intelligent computing chips and edge AI chips amidst the AI boom, highlighting the increasing demand for high-speed chips and the challenges in testing them [1] Group 1: Event Overview - The event titled "Keysight & Nanjing ICisC High-Speed Chip Testing Technology Seminar" will take place on May 21, focusing on semiconductor technologies popular in 2025 and testing methods for high-speed chips [1] - The seminar will cover topics such as PCIe 5.0/6.0 technology, Ethernet technology, MIPI, and USB technology, with live demonstrations of high-speed chip testing [1][2] Group 2: Agenda Highlights - The agenda includes a welcome speech, an introduction to the Nanjing Integrated Circuit Industry Service Center (ICisC), discussions on key technologies and measurement for intelligent computing chips, and challenges in testing consumer-side chips [9] - There will be a tea break and opportunities for free communication among participants, followed by a technical salon [9] Group 3: Participant Benefits - Attendees will receive practical gifts such as Xiaomi backpacks, with limited availability on a first-come, first-served basis [2][5][7]