证券日报网讯12月29日，帝尔激光（300776）在互动平台回答投资者提问时表示，公司持续聚焦主营业 务的同时积极向消费电子、新型显示和集成电路等领域开拓。公司应用于半导体芯片封装、显示芯片封 装等领域的TGV设备，已经完成面板级玻璃基板通孔设备的出货，实现了晶圆级和面板级TGV封装激 光技术的全面覆盖。公司应用于PCB行业的超快激光钻孔技术目前正在研发中，持续推动技术的延伸和 应用拓展。目前，超快激光钻孔设备样机正在试制中。 ...

证券日报网讯12月29日，英诺激光（301021）在互动平台回答投资者提问时表示，公司已完成对M9等 材料的初步打样工作，现正发挥超快激光钻孔设备能力，针对新一代算力技术的新材料和新工艺升级需 求，积极对接客户的审厂安排，提供创新解决方案！公司于日前收到来自IC载板客户的首台超快激光钻 孔设备订单。IC载板在高性能计算芯片如CPU、GPU、FPGA和ASIC等产品的封装中发挥着关键作用， 因此，该订单反映了公司的超快激光钻孔设备得到了高端客户的认可，也预示着其凭借优异性能有望向 下兼容类载板、高阶HDI和高多层板等算力领域的精密钻孔需求。 ...

格隆汇12月11日丨帝尔激光(300776.SZ)在互动平台表示，公司持续聚焦主营业务的同时积极向消费电 子、新型显示和集成电路等领域开拓。公司应用于半导体芯片封装、显示芯片封装等领域的TGV设 备，已经完成面板级玻璃基板通孔设备的出货，实现了晶圆级和面板级TGV封装激光技术的全面覆 盖。公司应用于PCB行业的超快激光钻孔技术目前正在研发中，持续推动技术的延伸和应用拓展。目 前，超快激光钻孔设备样机正在试制中。今年以来，公司主要订单源自于XBC、TOPCon激光技术，在 非光伏领域，有TGV激光微孔设备中试线订单。 ...

（编辑 姚尧） 证券日报网讯 12月4日，帝尔激光在互动平台回答投资者提问时表示，公司持续聚焦主营业务的同时积 极向消费电子、新型显示和集成电路等领域开拓。公司应用于半导体芯片封装、显示芯片封装等领域的 TGV设备，已经完成面板级玻璃基板通孔设备的出货，实现了晶圆级和面板级TGV封装激光技术的全 面覆盖。公司应用于PCB行业的超快激光钻孔技术目前正在研发中，持续推动技术的延伸和应用拓展。 目前，超快激光钻孔设备样机正在试制中。 ...

Core Viewpoint - The company has achieved comprehensive coverage of TGV packaging laser technology for both wafer-level and panel-level glass substrates, indicating significant advancements in its laser micro-hole equipment [1] Group 1: Company Developments - The company has completed the shipment of panel-level glass substrate through-hole equipment, marking a milestone in its TGV laser micro-hole technology [1] - The company's PCB business is focusing on the development of ultrafast laser drilling technology, with ongoing engagements with 2 to 3 clients [1] - Prototypes of the ultrafast laser drilling equipment are currently in the trial production phase [1]

Group 1: Tesla and Autonomous Driving - Elon Musk expects Tesla's Full Self-Driving (FSD) software to receive full approval in China by early 2026, with partial approval already obtained [1][12][13] Group 2: Automotive Industry in India - India's automotive industry recorded a 40.5% year-on-year increase in retail sales for October, indicating a strong rebound in domestic consumption [1] Group 3: Strategic Partnerships - Hema signed an 80 million yuan order with Silver Fern Farms to establish the first direct sourcing base for New Zealand beef and lamb [2][7] - Alibaba's AliExpress partnered with Homart Group to bring four well-known Australian health brands to its platform [10] Group 4: Corporate Developments - Samsung Electronics appointed Park Hark-kyu as the new head of its Business Support Office, which has been upgraded to a formal institution [1] - Haosen Intelligent extended the validity of its concerted action agreement among its actual controllers until November 8, 2026 [3] Group 5: Airbus Performance - Airbus delivered 78 aircraft in October and received 112 new orders, bringing total deliveries from January to October to 585 [4] Group 6: Investment Initiatives - Zhongyuan Home Furnishing plans to invest 16 million USD in building a self-owned production base in Vietnam [5][6] Group 7: Technological Advancements - Dier Laser is in the process of trial production for its ultra-fast laser drilling equipment, expanding its capabilities in laser technology [8]

Core Viewpoint - The company has successfully completed the shipment of its TGV laser micro-hole equipment for panel-level glass substrates, achieving comprehensive coverage of wafer-level and panel-level TGV packaging laser technology [1] Group 1: Company Developments - The company's PCB business is primarily focused on the development of ultrafast laser drilling technology [1] - The company has engaged with 2 to 3 clients for its ultrafast laser drilling technology [1] - Prototypes of the ultrafast laser drilling equipment are currently in the trial production stage [1]

Core Insights - The company has completed the shipment of panel-level glass substrate through-hole equipment, achieving comprehensive coverage of wafer-level and panel-level TGV packaging laser technology [1] - The company's PCB business is primarily focused on the development of ultrafast laser drilling technology, with ongoing engagement with 2 to 3 clients [1] - A prototype of the ultrafast laser drilling equipment is currently under trial production [1]

Core Viewpoint - The company has successfully completed the shipment of through-hole equipment for panel-level glass substrates, achieving comprehensive coverage of wafer-level and panel-level TGV packaging laser technology [1] Group 1: Company Developments - The company's TGV laser micro-hole equipment has been shipped, marking a significant milestone in its technology offerings [1] - The company is focusing on the development of ultrafast laser drilling technology for its PCB business and has engaged with 2 to 3 clients for collaboration [1] - A prototype of the ultrafast laser drilling equipment is currently under trial production [1]

Group 1: Financial Performance - In the first three quarters of 2025, the company achieved a revenue of 1.781 billion CNY, representing a year-on-year growth of 23.69% [3] - The net profit attributable to shareholders was 496 million CNY, with a year-on-year increase of 29.39% [3] - The net cash flow from operating activities was 11 million CNY, up 113.40% year-on-year [3] - The gross margin for the first three quarters was 46.2%, a slight decrease of 0.79 percentage points year-on-year [3] - The net profit margin was 27.85%, showing a slight increase year-on-year [3] - R&D expenditure totaled 178 million CNY, down 15.29% year-on-year, accounting for 10.02% of revenue [3] Group 2: Financial Ratios - As of September 30, 2025, the company's asset-liability ratio was 41.57%, down 6.10 percentage points from the end of the previous year [4] - The current ratio and quick ratio were 3.17 and 2.28, respectively, indicating improved short-term solvency [4] Group 3: Business Development - The company has a strong focus on the photovoltaic sector, with ongoing development of new laser technologies for application in this field [5] - In the PCB market, the company is developing ultra-fast laser drilling technology, with prototypes currently in trial production [6] - The company anticipates a demand for 40-50 GW of capacity expansion in the BC sector by 2026 [7] Group 4: Product and Technology Updates - The company has made progress in laser welding solutions, with successful pilot orders and expectations for GW-level mass production orders by Q4 2025 [8] - The efficiency of the company's TCP and TCI devices has improved by approximately 0.15%-0.2% [10] - The company maintains strong partnerships with top global laser source manufacturers, ensuring stable supply chains [10] Group 5: Market Outlook - The company is focusing on expanding its product portfolio beyond photovoltaics to enhance risk resilience, including investments in PCB, TGV, display panels, and integrated circuits [5]