加快突破处理器、存储芯片、边缘计算芯片等高端通用芯片的设计 加快突破处理器、存储芯片、边缘计算芯片等高端通用芯片的设计，积极支持RISC-V（基于精简指令 集原则的开源指令集架构）、车规级、显示驱动、传感器、光通信、6G等专用芯片的开发，加强对集 成电路企业产品首轮流片支持，对符合条件的相关企业开展拥有自主知识产权的28nm及以下或具备较 大竞争优势的芯片流片，按照不高于流片费用的50%给予补助。 1月13日消息，为深入贯彻国家集成电路产业高质量发展战略部署，助力广州打造国家集成电路产业发 展"第三极"核心承载区，《广州市关于"十五五"时期全链条推动集成电路产业高质量发展的若干政策 （征求意见稿）》 公开征求意见。 争取国家集成电路产业基金支持重大项目建设 引导社会资本参与集成电路企业兼并重组 争取国家、省集成电路产业发展基金支持广州市重大项目建设。鼓励金融机构、地方金融组织通过银行 信贷、融资租赁等方式支持项目建设和企业经营，鼓励产业主导部门对本行业重大项目按照实际贷款部 分的一定比例进行贴息。支持企业利用多层次资本市场上市融资发展。鼓励各类风险投资和股权投资基 金进入集成电路领域，引导社会资本参与重大项目 ...

1月13日消息，为深入贯彻国家集成电路产业高质量发展战略部署，助力广州打造国家集成电 路产业发展"第三极"核心承载区，《广州市关于"十五五"时期全链条推动集成电路产业高质 量发展的若干政策（征求意见稿）》 公开征求意见。 争取 国家集成电路产业基金 支持重大项目建设 引导社会资本参与集成电路企业兼并重组 争取国家、省集成电路产业发展基金支持广州市重大项目建设。鼓励金融机构、地方金融 组织通过银行信贷、融资租赁等方式支持项目建设和企业经营，鼓励产业主导部门对本行 业重大项目按照实际贷款部分的一定比例进行贴息。支持企业利用多层次资本市场上市融 资发展。 鼓励各类风险投资和股权投资基金进入集成电路领域，引导社会资本参与重大 项目建设、企业兼并重组、上市企业培育、企业技术改造和关键基础设施建设。 加快突破处理器、存储芯片、 边缘计算芯片 等高端通用芯片的设计 加快突破处理器、存储芯片、边缘计算芯片等高端通用芯片的设计，积极支持RISC-V （基于精简指令集原则的开源指令集架构）、车规级、显示驱动、传感器、光通信、6G 等专用芯片的开发，加强对集成电路企业产品首轮流片支持，对符合条件的相关企业开展 拥有自主知识产权的2 ...

加快突破处理器、存储芯片、边缘计算芯片等高端通用芯片的设计 加快突破处理器、存储芯片、边缘计算芯片等高端通用芯片的设计，积极支持RISC-V（基于精简指令 集原则的开源指令集架构）、车规级、显示驱动、传感器、光通信、6G等专用芯片的开发，加强对集 成电路企业产品首轮流片支持，对符合条件的相关企业开展拥有自主知识产权的28nm及以下或具备较 大竞争优势的芯片流片，按照不高于流片费用的50%给予补助。 综合自人民财讯 责编：梁秋燕 1月13日消息，为深入贯彻国家集成电路产业高质量发展战略部署，助力广州打造国家集成电路产业发 展"第三极"核心承载区，《广州市关于"十五五"时期全链条推动集成电路产业高质量发展的若干政策 （征求意见稿）》 公开征求意见。 争取国家集成电路产业基金支持重大项目建设 引导社会资本参与集成电路企业兼并重组 争取国家、省集成电路产业发展基金支持广州市重大项目建设。鼓励金融机构、地方金融组织通过银行 信贷、融资租赁等方式支持项目建设和企业经营，鼓励产业主导部门对本行业重大项目按照实际贷款部 分的一定比例进行贴息。支持企业利用多层次资本市场上市融资发展。鼓励各类风险投资和股权投资基 金进入集成电路 ...

Core Viewpoint - Ankai Micro announced the acquisition of 85.79% of Sichao Technology for 325.99 million yuan, marking a strategic move to enhance collaboration in technology, customer base, and supply chain within the IoT chip sector [1][5]. Summary by Sections Acquisition Details - The acquisition consists of two parts: Ankai Micro will pay 22 million yuan for 36% of Sichao Technology from its founding team and 303.99 million yuan for 49.79% from 17 investors, making Sichao a subsidiary [5]. - The deal has been approved by Ankai Micro's board and will be submitted for shareholder vote in 2025, not classified as a related party transaction or major asset restructuring [5]. Company Profiles - Ankai Micro, established in 2001, specializes in IoT SoC chips for smart home and security applications, serving major clients like ROKU and TP-LINK [5]. - Sichao Technology, founded in 2019, focuses on ultra-low power IoT chips, with products in data collection and edge AI inference, already integrated into supply chains of brands like Xiaomi and Honor [6]. Strategic Synergies - The transaction highlights technological complementarity, with Ankai Micro planning to integrate Sichao's low-power and power management technologies to enhance product performance [7]. - Ankai Micro's existing customer base in smart home and security can leverage Sichao's strengths in consumer electronics, creating a synergistic market effect [7]. - Sichao's procurement costs will be optimized through Ankai Micro's centralized purchasing platform, enhancing cost efficiency [7]. Financial Considerations - The merger will create goodwill on the balance sheet, with potential impairment risks if Sichao's performance does not meet expectations [8]. - Ankai Micro reported a negative operating cash flow of 56.86 million yuan for the first three quarters of 2025, with plans to finance the acquisition through a mix of self-funding and long-term loans [8]. - Sichao Technology is projected to generate 62.04 million yuan in revenue and a net loss of 48.64 million yuan in 2024, indicating a need for time to validate its growth potential [8]. Industry Context - The acquisition aligns with the trend of resource integration through mergers in the semiconductor industry, particularly in the context of deepening integration between IoT and AI technologies [8].

Core Viewpoint - Cambrian Technologies has established a wholly-owned subsidiary, Cambrian Intelligent Computing Technology (Beijing) Co., Ltd., with a registered capital of 100 million RMB, focusing on integrated circuit design and manufacturing [1][2]. Group 1: Company Establishment - The new subsidiary is fully owned by Cambrian Technologies and aims to enhance its capabilities in integrated circuit design, chip manufacturing, and related services [1][3]. - The establishment of the subsidiary is part of Cambrian's strategy to strengthen its presence in the AI chip and computing infrastructure sectors [3]. Group 2: Business Scope and Objectives - The business scope of the new company includes integrated circuit sales, design, manufacturing, and technical services, which aligns with Cambrian's focus on AI chips and computing platforms [2][3]. - The subsidiary is expected to improve local service capabilities and delivery efficiency by being closer to key customers and application scenarios in Beijing, which is rapidly developing its AI and computing infrastructure [3]. Group 3: Industry Context - Cambrian Technologies specializes in AI chips and foundational system software, with products that support data centers, edge computing, and smart terminals [3]. - The company is expanding its industry chain layout to enhance its competitiveness in the domestic AI computing industry [3].

Core Viewpoint - Chengdu Huami (688709.SH) is actively developing its capabilities in space computing and high-performance GPU applications through strategic partnerships and product innovations [1] Group 1: Space Computing Deployment - The company has signed a strategic cooperation agreement with Suiruan Technology to collaborate in the fields of large models and high-performance GPUs, with applications in model training, space computing, and edge inference [1] - The company has developed radiation-resistant FPGA products and is working on higher-performance edge computing chips, with a current offering of 16 Tops and a future target of 100 Tops [1] Group 2: Product Layout - The company has a range of products with radiation resistance capabilities, including the 8-bit 64G ultra-high-speed ADC (HWD08B64GA1) series, which can withstand radiation levels of 75 MeV, suitable for on-satellite AI real-time processing [1] - Ongoing research includes high-performance large-scale FPGAs with 100 million and 250 million gates, focusing on radiation-resistant features based on downstream customer needs [1] Group 3: Customer Base and Partnerships - Core customers include state-owned enterprises such as the Aerospace Science and Technology Corporation and the Aerospace Science and Industry Corporation, with products recognized and widely used in critical fields like electronics, communications, control, and measurement [1] Group 4: Market Expansion Plans - The company is committed to advancing technology research and market expansion, closely monitoring cutting-edge technology trends and customer demands to explore potential application scenarios [1] Group 5: Product Mass Production - The company has established a product line of FPGA with gate counts ranging from 5 million to 70 million, with AI computing capabilities of 16 Tops already in small-scale trials with specialized industry clients [1] - The 8-bit 64G ultra-high-speed ADC series and the 12-bit 6G high-precision ADC series have been tested in small batches for satellite-related customer system validation, with a 4-channel 12-bit 40GSPS ADC chip completing customer validation and receiving intent orders [1]

Core Insights - A significant news event has emerged regarding Yushu Technology, a prominent player in humanoid robotics, which has completed its IPO guidance, indicating a potential listing on the STAR Market in the first quarter of next year [1][2][3] Financial Performance - Yushu Technology's financial performance shows a remarkable net profit of 589 million yuan for the third quarter, reflecting a staggering year-on-year growth of 469.1% [2][5] - The total revenue for Yushu Technology reached 14.454 billion yuan, with a year-on-year decline of 8.8% [2] - Liou Co., a financial investor in Yushu Technology, reported a net profit of 589 million yuan, marking a turnaround from a loss [5] - Jinfa Technology achieved a net profit of 1.065 billion yuan, with a year-on-year growth of 55.86% [6][7] - Zhongke Chuangda reported a net profit of 229 million yuan, reflecting a growth of 50.72% [8][11] Market Dynamics - The recent acceleration in listings of hard technology companies, including Yushu Technology, is seen as a strategic move to inject confidence into the market [3] - Companies closely associated with Yushu Technology, referred to as "shadow stocks," are expected to benefit significantly from its upcoming IPO [4][9] Supply Chain Relationships - Yushu Technology has established strong ties with key suppliers, including Zhongda Lide, Mingzhi Electric, and Aobi Zhongguang, which provide essential components for its robotics [9] - The dual role of companies like Zhongke Chuangda and Allwinner Technology, which both invest in and supply Yushu Technology, enhances their strategic partnership [9][11]

Group 1 - Chengdu has launched the first city-level Sci-Fi and Future Industry Development Fund with a target size exceeding 3 billion yuan, focusing on sci-fi reading, film, games, and related sectors [2] - ZhenDian Smart Sensor has completed nearly 10 million yuan in angel round financing, aiming to enhance its core technology in industrial and consumer-grade sensors [3] - JuXin Microelectronics has completed a D+ round financing to further develop low-power, high-integration smart sensing chips, breaking foreign monopolies in high-end chip markets [3] - Shanghai Leju Technology has secured exclusive B++ round financing from Kunlun Capital, enhancing its digital services in the energy sector [4] - YiPu Power has completed an A round financing to support innovation in power systems for new energy vehicles and industrial equipment [5] - DeRui Smart Chip has completed a C round financing to advance its research in smart chips for various applications [5] - Hongshi Baosheng Technology has successfully completed an angel round financing, focusing on new material development with potential applications in energy-saving and environmental protection [5] - Suzhou Jiedi has completed a B round financing to expand production and enhance competitiveness in high-end equipment manufacturing [6] Group 2 - Meijin Energy is planning to issue H-shares and list on the Hong Kong Stock Exchange to enhance its international capital layout and competitiveness [7] - Dapeng Industrial has successfully passed the review for listing on the Beijing Stock Exchange, aiming to raise 154 million yuan for smart industrial cleaning equipment projects [7]

Group 1 - The latest stock price of Cambrian-U is 695.00 yuan, with an increase of 5.94 yuan, representing a growth of 0.86% compared to the previous trading day [1] - The opening price for the day was 686.00 yuan, with a highest point of 699.90 yuan and a lowest point of 682.58 yuan, resulting in a trading volume of 48,788 lots and a total transaction amount of 3.38 billion yuan [1] - Cambrian-U operates in the semiconductor industry, focusing on the research and development of artificial intelligence chips, with products including cloud intelligent chips, edge computing chips, and processor IPs [1] Group 2 - The company aims to provide core hardware support for intelligent computing, with its business covering multiple technology sectors [1] - On the day of reporting, the net inflow of main funds into Cambrian-U was 157.58 million yuan, accounting for 0.05% of the circulating market value [1] - Over the past five trading days, the cumulative net outflow of main funds was 150.80 million yuan, also representing 0.05% of the circulating market value [1]

Core Insights - The integration of artificial intelligence and robotics is driving the development of embodied intelligent agents towards higher levels of autonomy and intelligence [1] - Key components of embodied intelligent agents include high-precision sensors, bionic actuators, edge computing chips, and flexible materials, which directly impact the performance and application scenarios of robots [1] - The forum will focus on the technological frontiers, common challenges, and application ecosystems of core components in embodied intelligence, inviting industry experts and representatives from the supply chain for discussions [1] Forum Details - The forum is themed "Focusing on Core Components to Empower Embodied Intelligence" and is organized by various institutions including the China Association for Science and Technology [2] - Scheduled for August 10, 2025, at the Beijing Yichuang International Exhibition Center [2] - The agenda includes expert reports, solution presentations, and roundtable discussions on industry hot topics [3] Industry Context - The event is part of the World Robot Conference, emphasizing the urgent need for high-performance core components in industrial and humanoid robots [3] - Key components such as bionic tactile sensors and flexible drive mechanisms are seen as critical breakthroughs to overcome performance bottlenecks in robotic systems [3]