登录新浪财经APP 搜索【信披】查看更多考评等级 证券代码：688469 证券简称：芯联集成 公告编号：2025-053 基于新型政策性金融工具的落实和推进的契机，为了保障"三期12英寸集成电路数模混合芯片制造项 目"的持续实施，公司拟向国家开发银行全资子公司国开新型政策性金融工具有限公司申请不超过人民 币18亿的政策性金融工具，期限为5年。新型政策性金融工具资金将通过权益性资金注入芯联先锋作 为"三期12英寸集成电路数模混合芯片制造项目"资本金，并由公司全资子公司芯联越州集成电路制造 （绍兴）有限公司（以下简称"芯联越州"）为上述新型政策性金融工具提供连带责任保证。 芯联集成电路制造股份有限公司 关于拟申请新型政策性金融工具事项及全资子公司为公司担保的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性承担个别及连带责任。 重要内容提示： ● 芯联集成电路制造股份有限公司（以下简称"公司"）拟向国家开发银行全资子公司国开新型政策性金 融工具有限公司申请不超过人民币18亿元的新型政策性金融工具 ● 公司全资子公司芯联越州为本次新型政策性金融 ...

今日焦点 芯联集成公告称，基于公司的整体战略发展规划和实际经营需求，看好功率模组应用配套所需各类芯片 的市场发展，以及新型政策性金融工具的落实和推进的重要契机，公司拟向控股子公司芯联先锋增资人 民币18亿元，保障"三期12英寸集成电路数模混合芯片制造项目"的持续实施。增资后，芯联集成对芯联 先锋的持股比例不低于50.85%。 广晟有色：预计前三季度净利1亿元—1.3亿元 广晟有色公告称，广晟有色发布2025年前三季度业绩预告，预计归属于上市公司股东的净利润为1.00亿 元至1.30亿元，同比扭亏为盈。2025年前三季度稀土市场行情整体上涨，公司抓住市场机会，加大分离 企业生产规模；同时强化市场研判，统筹企业管理，加强上下游营销业务协同，并创新市场营销模式， 调整贸易结构，稀土冶炼分离及稀土永磁材料产销量均实现不同程度增长，实现预期利润。 福耀玻璃：曹德旺辞去董事长职务，选举曹晖为新董事长 福耀玻璃公告称，公司董事长曹德旺因推动公司治理结构战略性优化与可持续发展的需要，辞去董事长 职务，但将继续担任公司董事及部分子公司的董事、董事长和法定代表人职务。同时，公司选举曹晖为 新任董事长，并任命其为法定代表人及董事局 ...

三、日常经营、对外投资 1、兆丰股份：与纽鼐机器人签订战略合作框架协议，后者专注于认知机器人与人形机器人开发。 一、复牌 智光电气：拟定增购买广州智光储能科技全部或部分少数股权，股票复牌。 并购 国投丰乐：收购人国投种业拟认购不超过1.84亿股，本次发行股票的价格为5.91元/股。 二、回购、股权转让 1、之江生物：拟以6000万元至1.2亿元回购股份。 2、圆通速递：出于股东自身发展战略和资金筹划考虑，杭州灏月拟通过大宗交易方式转让不超过2%。 10、云南能投：投资18.72亿元建设昆明安宁350MW压缩空气储能示范项目。 四、业绩变动 1、仕佳光子：前三季度净利润2.99亿元，同比增长728% 光芯片和器件等产品订单同比实现不同程度增 加 2、华域汽车：完成收购上海上汽清陶能源科技有限公司49%股权。 3、鼎际得：石化科技高端新材料项目POE工业化装置已投产。 4、芯联集成：拟向控股子公司增资18亿元，保障"三期12英寸集成电路数模混合芯片制造项目"持续实 施。 5、上海洗霸：取得IATF16949汽车质量管理体系认证证书，认证范围为新能源电池用硅碳负极材料的 设计与生产。 6、中天科技：中标深海科技领域 ...

Core Viewpoint - The company plans to increase its investment in its subsidiary, Chip Union Pioneer, by 1.8 billion yuan to support the ongoing implementation of the "Phase III 12-inch integrated circuit analog mixed chip manufacturing project" [1] Investment Details - The total investment for the Phase III project is expected to reach 22.2 billion yuan, aiming to achieve a production capacity of 100,000 wafers per month [1] - After the capital increase, the registered capital of Chip Union Pioneer will not be less than 13.292 billion yuan, with the company maintaining at least a 50.85% stake [1] Project Status - The production line for the project has completed preliminary construction, and all process platforms have entered the stage of mass production [1] - The products from this project are expected to have wide applications in sectors such as new energy, automotive, industrial control, and consumer electronics [1] Strategic Implications - This capital increase reinforces the company's control over its subsidiary, which is beneficial for long-term development and helps expand market scale and enhance market competitiveness [1]

Core Viewpoint - The company plans to increase its investment in its subsidiary, ChipLink Pioneer, by 1.8 billion yuan to support the ongoing implementation of the "Phase III 12-inch integrated circuit analog mixed-signal chip manufacturing project" [1] Group 1: Investment and Capital Structure - The capital increase will ensure that ChipLink Pioneer has a registered capital of no less than 13.292 billion yuan, with the company maintaining at least a 50.85% stake in the subsidiary [1] - Other shareholders will waive their preemptive rights in this capital increase [1] Group 2: Project Details - The total investment for the Phase III project is expected to reach 22.2 billion yuan, aiming to achieve a production capacity of 100,000 wafers per month [1] - The products from this project are intended for diverse applications, including new energy, automotive, industrial control, and consumer sectors [1] - The production line has completed its preliminary construction, and all process platforms have entered the stage of mass production [1] Group 3: Strategic Implications - This capital increase reinforces the company's control over its subsidiary, which is beneficial for long-term development [1] - The move is expected to help the company expand its market scale and enhance its competitive position in the market [1]

Core Viewpoint - Company plans to increase capital by 1.8 billion RMB to its subsidiary, ChipLink Pioneer, to support the ongoing implementation of a 12-inch integrated circuit analog-digital mixed chip manufacturing project, indicating confidence in the market for power module application chips and the importance of new policy financial tools [1] Group 1 - The total investment for the 12-inch integrated circuit project is expected to reach 22.2 billion RMB, with a production capacity of 100,000 wafers per month [1] - After the capital increase, the registered capital of ChipLink Pioneer will not be less than 13.292 billion RMB, and the company will maintain a shareholding ratio of no less than 50.85% [1] - The project is anticipated to have applications in various sectors, including new energy, automotive, industrial control, and consumer electronics [1] Group 2 - The production line has completed preliminary construction, and all process platforms have entered the stage of mass production [1]