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特斯拉芯片由台积电、三星共同代工!
国芯网· 2025-11-05 03:42
尽管两家代工厂在将设计图转化为实体芯片的工艺上存在差异,特斯拉致力于确保 AI 软件在不同版本 芯片上实现完全一致的运行效果。 马斯克表示,特斯拉计划于 2026 年获得 AI5 芯片样品,并可能进行小批量生产, 大规模量产预计在 2027 年启动。 国芯网[原:中国半导体论坛] 振兴国产半导体产业! 不拘中国、 放眼世界 ! 关注 世界半导体论坛 ↓ ↓ ↓ 11月5日消息,特斯拉CEO马斯克在 X 平台回应网友提问时首次披露, Tesla AI5 芯片将由台积电和三 星电子共同代工,分为两个版本制造。 第二步:在公众号里面回复"加群",按照提示操作即可。 爆料|投稿|合作|社群 后续产品方面,AI6 芯片将继续采用台积电与三星双代工厂模式,目标性能较 AI5 提升约一倍,预计于 2028 年中期实现量产。对于更远期的 AI7 芯片,马斯克称其将更换代工厂,因设计更具挑战性。 目前特斯拉尚未公布 AI5 芯片的完整规格,但据透露,其运算性能可达 2000~2500 TOPS,为现款 HW4 芯片的 5 倍,支持更复杂的无监督 FSD 算法。该芯片为特斯拉自研设计,预期在算力、能效及成本方 面相较现有方案有显 ...
马斯克:AI5芯片设计评审完成,AI6/7 将紧随其后、AI8 超乎想象
Sou Hu Cai Jing· 2025-11-02 08:25
Core Insights - Tesla's CEO Elon Musk announced the completion of the design review for the AI5 chip, expressing confidence in its future performance [1][3] - Musk also revealed plans for the development of AI6 and AI7 chips, along with high expectations for the AI8 chip [1][3] Chip Development - The AI5 chip is the next-generation FSD chip with a computing performance of 2000 to 2500 TOPS, which is five times that of the current HW4 chip, enabling more complex unsupervised FSD algorithms [5] - The AI5 chip is being manufactured by TSMC and Samsung, with TSMC using a 3nm N3P process for mass production and Samsung as a backup foundry [5] Hardware Upgrades - The AI5/HW5 hardware suite will feature an upgraded FSD camera, equipped with Samsung's "weatherproof lens" that includes heating elements to melt ice and snow within a minute, and has a lens coating strength six times that of the current Model Y camera [6] - In July, Musk indicated that Tesla would commission Samsung to produce the next-generation AI6 chip, with a signed agreement valued at $16.5 billion (approximately 117.07 billion RMB at current exchange rates) [6] - Musk previously stated that Tesla is nearing the realization of a "universal, pure AI full self-driving solution" that relies entirely on cameras and Tesla's self-developed AI chips [6]