引言 2025 年 ， 仅 半 年 时 间 内 ， ST 、 恩 智 浦 、 瑞 萨 等 头 部 MCU 厂 商 几 乎 同 时 发 布 搭 载 新 型 嵌 入 式 存 储 （ 如 PCM 、 MRAM）的汽车MCU产品，打破了MCU长期以来以嵌入式Flash为主的技术格局。虽然谈"标配"仍为时尚早，但可 以肯定的是：新型存储已经从"尝试"跃升为"战略布局"，并开始对MCU生态产生深远影响。 | ） | 新存储路径 | 代表产品 | 工艺节点 | 面向应用 | | --- | --- | --- | --- | --- | | ST | PCM | Stellar P/G系列 | FD-SOI | SDV、电动化平台 | | NXP | MRAM | S32K5系列 | 16nm FinFET | 分区架构/OTA | | Renesas | MRAM | RA8P1系列 | 22nm | AI语音、多模态 | | Infineon | eRRAM | AURIX Next | 台积电合作 | 车规控制 | 公众号记得加星标⭐️，第一时间看推送不会错过。 过去，MCU是一种"小而美"的器件，用于基本控制逻辑。 ...

Investor Presentation May 2025 © 2025 Everspin Technologies. All rights reserved. 1 Safe Harbor Statement FORWARD LOOKING STATEMENTS This presentation contains "forward-looking statements" that involve risks, uncertainties and assumptions. If the risks or uncertainties materialize or the assumptions prove incorrect, our results may differ materially from those expressed or implied by such forward-looking statements. All statements other than statements of historical fact could be deemed forward-looking stat ...

东京大学研究生院工学研究科教授关真一郎的研究团队正在推进开发。该团队确认了在第三 类磁性材料中可以读写构成数字信息的"0"和"1"。与传统磁体的内存相比，速度快100倍以 上，并且预计可以压缩到原来的1/100…… 如今，电子设备的存储器几乎全部为电存储，但近年来，可以节能的磁存储备受关注。据印 度调查公司Mordor Intelligence预测，MRAM的市场规模到2029年将从2024年的约20亿美 元扩大至约226亿美元。 另一方面，现有MRAM存在难以提高容量的课题。MRAM使用名为"铁磁性材料"类别的材 料，当以很高的密度排列材料中的微小磁铁时，各个磁铁之间会相互干扰，导致无法准确读 写数据。因为需要确保间隔来排列，因此容量较低。 于是，使用第三类交替磁性的MRAM引发关注。这种磁铁之间不会发生干扰。能以较小的间 距排列磁铁，理论上集成率可提高到传统MRAM的100倍。读写速度也有望从以往的纳秒（1 纳秒为十亿分之一秒）级别提升至皮秒（1皮秒为一万亿分之一秒）级别。 具有磁铁性质的物质被称为"磁性材料"。目前已知有两种类别，而2022年德国的研究团队发 现了第三种类别。这种被称为"交替磁性材料"， ...

Core Viewpoint - TSMC is establishing its first design center in Europe, located in Munich, focusing on automotive applications and aiming for significant advancements in memory technology [1][2]. Group 1: TSMC's Strategic Shift - TSMC's new design center represents a strategic shift from solely chip manufacturing to providing design services, addressing the lack of advanced design expertise in Europe [1][2]. - The European Design Center (EUDC) is expected to support TSMC's €10 billion investment in the European Semiconductor Manufacturing Company (ESMC) located in Dresden, which TSMC operates with a 70% stake [1][2]. Group 2: Focus Areas and Technology Development - The design center will focus on high-density, high-performance, and energy-efficient chips, particularly in automotive, industrial, AI, and IoT applications [1][2]. - TSMC plans to introduce 5nm MRAM and 6nm RRAM technologies, which are critical for automotive applications and AI chip memory expansion [4][5]. Group 3: Market Projections and Future Plans - By 2030, the automotive sector is projected to account for 15% of a $1 trillion market, surpassing IoT's 10% share, with data centers and AI driving significant growth [6]. - TSMC's N3 technology is expected to achieve high yield and long-term operation, with over 70 new wafers anticipated by April 2025 [5][6].

Core Insights - The FPGA market is projected to grow from $11.14 billion in 2025 to $18.76 billion by 2030, with a CAGR of 10.98% during this period [2] - AMD and Lattice Semiconductor (LSCC) are key players in this market, with AMD benefiting from its acquisition of Xilinx and LSCC focusing on low-power FPGA solutions [1][7] AMD Insights - AMD's acquisition of Xilinx has allowed it to expand into various embedded markets, including CPUs, GPUs, and FPGAs [3] - The latest VP1902 adaptive SoC from AMD features 18.5 million logic cells, doubling the programmable logic density compared to the previous generation [4] - In Q1 2025, AMD launched a high-performance 5G core powered by the Virtex UltraScale+ XCVU5P FPGA and completed initial shipments of cost-optimized Spartan UltraScale Plus FPGAs [5] - AMD is enhancing partnerships with major cloud providers like AWS, which launched FPGA-accelerated instances powered by AMD's EPYC processors and Xilinx Virtex FPGAs [6] LSCC Insights - LSCC is experiencing strong demand for its small and mid-range FPGA solutions, particularly with its Nexus and Avant product families [7] - The company is targeting high-growth applications such as AI, data centers, and advanced driver-assistance systems in automotive [8] - In February 2025, LSCC validated Everspin Technologies' MRAM for use across its FPGAs, enhancing suitability for mission-critical applications [9] Performance and Valuation - Year-to-date, AMD shares have decreased by 6.9%, while LSCC shares have fallen by 1.4% due to a challenging macroeconomic environment [10] - Both AMD and LSCC shares are currently considered overvalued, with AMD trading at a forward Price/Sales ratio of 5.41X and LSCC at 13.91X [13] - The Zacks Consensus Estimate for AMD's 2025 earnings is $4.09 per share, reflecting a 23.56% year-over-year increase, while LSCC's estimate is $1.05 per share, indicating a 16.67% increase [16] - AMD has consistently beaten earnings estimates, while LSCC has missed estimates in two of the last four quarters [17] Conclusion - AMD's portfolio expansion and partnerships position it for significant growth in the FPGA market, while LSCC's focus on low-power solutions captures emerging opportunities [18] - AMD is rated higher than LSCC, with a Zacks Rank of 3 (Hold) compared to LSCC's 4 (Sell) [18]

如果您希望可以时常见面，欢迎标星收藏哦~ 如今，随着先进制程研发成本激增、量子隧穿效应等物理极限逼近，传统工艺升级的红利日 益收窄。在摩尔定律逐渐放缓的当下，半导体行业正从单一依赖制程微缩的路径转向多元化 创新。 其中，先进封装技术的兴起为芯片性能的进一步优化提供了新的思路。此外，特色工艺的发 展更是成为推动半导体产业多元化和差异化竞争的关键力量。 不同于追求晶体管密度极致的先进制程（如3nm、2nm），特色工艺以其定制化、多样化制程优化 能力，聚焦特定应用场景的深度优化，通过整合异构技术、材料创新、器件架构革新等手段，实现 性能、功耗与成本的精准平衡，在汽车电子、工业控制、物联网等对可靠性与功能集成要求严苛的 领域，展现出不可替代的优势。 据相关数据统计，当前全球特色工艺市场规模已突破500亿美元，年复合增长率达15%，远超半导 体行业平均增速。 在此背景和趋势下，台积电、联电、中芯国际等厂商正加速布局，其中台积电以"技术广度+生态 深度"构建起特色工艺的全球标杆：从存储技术领域的RRAM、MRAM，到满足汽车电子严苛要求 的车规级工艺，再到针对特定应用的功率器件和射频工艺，凭借其深厚的技术积累和强大的研发 ...

台积电特色工艺全景 台积电作为全球领先的晶圆代工厂，拥有丰富的特色工艺组合，涵盖多个技术领域。在台积电 2025技术研讨会上，台积电执行副总经理暨共同营运长米玉杰博士介绍了台积电的特色工艺技 术 ， 为 汽 车 、 ULP/IoT （ 超 低 功 耗 和 物 联 网 ） 、 RF （ 射 频 ） 、 eNVM （ 嵌 入 式 非 易 失 性 存 储 器）、高电压显示、CIS（CMOS图像传感器）和电源IC提供最全面的解决方案，助力连接数字世 界与现实世界。 汽车电子与高压技术： 汽车客户采用台积电最先进的逻辑技术，从N7A、N5A到N3A，通过汽车 级认证，专为ADAS、自动驾驶和智能座舱设计，支持高可靠性和长生命周期需求；BCD-Power 工艺：集成双极晶体管、CMOS和DMOS器件，提供高压（如40-90V）解决方案，适用于汽车电 源管理、工业控制等场景，提升系统集成度。 低功耗与物联网： 台积电N4e工艺针对超低功耗物联网AI设备优化，结合嵌入式非易失性存储器 （eNVM），实现高效能与低成本的平衡；ULP（超低功耗）技术提供超低漏电晶体管和低电压 解决方案，适用于可穿戴设备和传感器节点。 射频： 边 ...

Core Insights - Numem has appointed two former Intel executives, Rob Crooke and Ashu Bakhle, to enhance its leadership team, indicating a shift towards a product-focused approach in addressing AI-related memory challenges [1][4] - The company is committed to developing energy-efficient MRAM solutions that cater to various applications, including data centers and edge computing, aiming to eliminate memory bottlenecks that affect performance and power [2][7] Company Developments - The addition of Crooke and Bakhle, who bring extensive semiconductor experience, is expected to drive the adoption of Numem's MRAM technology, addressing performance, power, density, and endurance challenges in AI applications [3][5] - CEO Max Simmons highlighted that the company is transitioning from technology development to commercialization, with a new go-to-market team in place to expand its MRAM-based solutions in the AI market [4] Market Positioning - Cambium Capital views Numem as a key player in redefining AI infrastructure, emphasizing the importance of memory as a constraint in system architectures and a significant investment opportunity [4] - Numem's patented AI Memory Engine architecture is designed to meet the increasing demands of high-performance computing (HPC) and AI applications, providing a scalable solution that outperforms traditional memory technologies [2][7]

Everspin (MRAM) Q1 2025 Earnings Call April 30, 2025 05:00 PM ET Company Participants Faye Hoffman - Investor Relations ContactSanjeev Aggarwal - President and CEOBill Cooper - CFO Conference Call Participants Quinn Bolton - Senior AnalystRichard Shannon - Senior Research Analyst Operator Good afternoon, welcome to the Everspin Technologies First Quarter twenty twenty five Financial Results Conference Call. At this time, participants are in a listen only mode. After the conclusion of management's prepared r ...

Everspin (MRAM) Q1 2025 Earnings Call April 30, 2025 05:00 PM ET Speaker0 Good afternoon, welcome to the Everspin Technologies First Quarter twenty twenty five Financial Results Conference Call. At this time, participants are in a listen only mode. After the conclusion of management's prepared remarks, instructions will be provided for the question and answer session. As a reminder, this conference call is being recorded. I would now like to turn the conference over to Faye Hoffman, Investor Relations for E ...