半导体论坛 振兴国产半导体产业！ 信息爆 炸的时代 更需要断舍离 如何更加高效的获取高质量的信息 在碎片化的时代里 收获满满？ ↓↓↓值得您的关注↓↓↓ 国芯网 2025年，半导体人只需关注5个公众号 半导体技术天地 ID：ic2018ic ▲长按二维码"识别"关注 专注半导体产业技术，技术资料，专家讲解。欢迎关注! ID：CSF211ic ▲长按二维码"识别"关注 半导体行业第一的微信公众平台，50万的从业人员都已关注！ ↓↓↓值得您的关注↓↓↓ 全球电子市场 ID：xinlun99 ▲长按二维码"识别"关注 芯媒评论，请关注！ ↓↓↓值得您的关注↓↓↓ 半导体行业圈 ID：ic211ic ▲长按二维码"识别"关注 半导体行业圈，半导体人自己的圈子，请关注！ ↓↓↓值得您的关注↓↓↓ ID：icchinaunion ▲长按二维码"识别"关注 半导体全产业链联盟，请关注！ ***************END************** * 半导体论坛微信群 8万人在群，所有微信群免费开放！ 加群步骤： 第一步：扫描下方二维码，关注中国半导体论坛微信公众号。 第二步：在公众号里面回复"加群"，按照提示操作即可 ...

Core Viewpoint - The article discusses the competitive landscape in the semiconductor industry, particularly focusing on the advancements in HBM (High Bandwidth Memory) technology by SK Hynix and Samsung, highlighting their strategies and production capabilities [2][4]. Group 1: SK Hynix's Position - SK Hynix has become the largest memory manufacturer due to its success with HBM memory and has recently announced the mass production of HBM4 memory, further solidifying its market leadership [2]. - The company has established a significant lead over competitors, particularly Samsung, which is currently at least three months behind in HBM4 production [2]. Group 2: Samsung's Strategy - Samsung plans to complete HBM4 certification by Q1 of next year to align with the anticipated demand from NVIDIA's next-generation GPU, which will utilize 288GB of HBM4 memory [4]. - The company has already completed internal mass production of HBM4 and is preparing to produce samples for customer testing [4]. - Samsung is investing heavily in expanding its HBM4 production capacity with a new factory in Pyeongtaek, which is expected to complete construction this month [4]. - The new factory will utilize advanced second-generation 10nm DRAM technology, which is a step ahead of SK Hynix's current production technology [4].

Core Viewpoint - The article discusses the strategic move by Haiguang Information to open its CPU interconnect bus and core capabilities, aiming to enhance collaboration across the entire semiconductor industry chain, particularly benefiting domestic AI chip development [1][3][4]. Group 1: Impact on the Intelligent Computing Industry - The demand for large-scale AI models is driving the growth of intelligent computing power, but the current domestic computing resources are fragmented, leading to inefficiencies in power scheduling and resource flow [3][4]. - Haiguang's opening of CPU core capabilities and interconnect bus is seen as a significant step towards optimizing the domestic computing ecosystem [3][4]. Group 2: Benefits of Haiguang's Strategy - The platform role of Haiguang's CPU will facilitate efficient scheduling of AI chip resources and reduce application costs, while the open interconnect bus will foster collaboration across the industry chain [4][5]. - The government's recent action plan emphasizes the need for a cross-platform computing framework, aligning with Haiguang's initiative to enhance compatibility among various chip types and software [4][6]. Group 3: Timing and Rationale for Opening - Haiguang's decision to open its ecosystem is influenced by both policy encouragement and its solid technological foundation, having made significant advancements in its C86 architecture [6][7]. - The company has achieved self-research and commercialization of multiple generations of its general-purpose CPU, demonstrating its capability for technological iteration and product safety [6][7]. Group 4: Haiguang's Competitive Edge - Haiguang's unique position stems from its complete X86 cross-licensing, allowing it to build a broadly compatible ecosystem that can adapt to millions of software applications [7][8]. - The company has successfully gathered over 6,000 industry partners, creating an open innovation chain that accelerates the optimization of domestic solutions [8].

不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 据悉，印刷OLED技术是一种通过高精度喷头将液态发光材料按照预设图案精准喷射到基板上，再经干燥固化等形成像素的OLED显示面板 制造技术。 9月13日消息，TCL科技集团股份有限公司发布公告，公司、旗下子公司TCL华星与广州市人民政府、广州经济技术开发区管理委员会共同 签署项目合作协议， 拟共同出资于广州市建设一条月加工2290mm x 2620mm玻璃基板能力约2.25万片的第8.6代印刷OLED显示面板生 产线（简称"t8项目"）。 该产线主要产品涵盖平板、笔记本电脑、显示器等应用领域， 预计总投资额约人民币295亿元。 据了解，TCL华星t8项目所采用技术均为TCL华星自有，基于印刷OLED技术建设的第8.6代线，也将为我国在全球新型显示产业竞争新格 局中抢占战略制高点、发挥引领作用提供有力支撑。 根据公告，TCL华星t8项目预计2025年11月开工。 | TCL | | --- | | 证券代码:000100 证券简称:TCL 科技 公告编号:2025-083 | | TCL 科技集团股份有 ...

国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 9月13日消息，据国外媒体报道称，美国又一次对中国的半导体企业下手。 美国商务部工业与安全局（BIS）发布公告，将23家中国实体列入实体清单。美方称这些公司 或机构存在"违背美国国家安全或外交政策利益"的行为。 对于美国的行径，中方已多次表达立场，商务部新闻发言人此前表示：中方注意到有关情 况。美国持续泛化国家安全概念，滥用出口管制措施，将多家中国实体列入出口管制"实体清 单"，中方对此坚决反对。 美方此举意在打压遏制他国实体，剥夺他国发展权利，将严重损害相关实体合法权益，破坏 全球产业链供应链安全稳定。美方此举不利于为双方通过对话合作解决问题创造氛围。中方 敦促美方立即停止错误做法，并将采取必要措施，坚决维护中国实体的合法权益。 "我们敦促美方停止泛化国际安全概念，停止将经贸科技问题政治化、工具化、武器化，停止 滥用各类制裁清单，无理打压中国企业。中方将采取必要措施，坚定维护中国企业的合法权 益。" 2025 湾区半导体产业生态博览会(深圳) ICTOR ECOSYSTEM EX 湾芯展 WESE ...

Core Viewpoint - Alibaba and Baidu have begun using self-designed chips for training their AI models, partially replacing NVIDIA chips, marking a significant shift in China's tech and AI sectors [3]. Group 1: Company Developments - Alibaba has applied its self-developed chips for lightweight AI model training since the beginning of this year [3]. - Baidu is experimenting with its Kunlun P800 chip to train the new version of its Wenxin large model [3]. - Employees who have used Alibaba's chips claim that they are now comparable to NVIDIA's H20 [3]. Group 2: Market Context - The shift towards self-developed AI chips is driven by increasing U.S. export restrictions on advanced AI chips to China, prompting local companies to enhance their own chip development efforts [3]. - Both Alibaba and Baidu continue to use NVIDIA chips for developing their most advanced AI models, indicating a transitional phase rather than a complete shift [3]. - NVIDIA acknowledges the competition and emphasizes its commitment to gaining the trust and support of global developers [3].

国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 9 月 12 日消息，SK 海力士刚刚宣布已成功完成面向 AI 的超高性能存储器新产品 HBM4 的 开发，并在全球范围内率先构建了量产体系。 SK 海力士表示："公司成功开发将引领人工智能新时代的 HBM4，并基于此技术成果，在全 球首次构建了 HBM4 的量产体系。此举再次向全球市场彰显了公司在面向 AI 的存储器技术 领域的领导地位。" 高带宽存储器（HBM，High Bandwidth Memory）垂直连接多个 DRAM，相比现有的 DRAM 可显著提升数据处理速度，目前已推出六代产品 ——HBM、HBM2、HBM2E、 HBM3、HBM3E、HBM4。 据海力士介绍，全新的 HBM4 采用了较前一代产品翻倍的 2048 条数据传输通道，将带宽扩 大一倍，同时能效也提升 40% 以上。凭借这一突破，该产品实现了全球最高水平的数据处理 速度和能效。 公司预测，将该产品引入客户系统后，AI 服务性能最高可提升 69%，这一创新不仅能从根本 上解决数据瓶颈问题，还可显著降低数据中心电力成本。 与 ...

Core Viewpoint - The article emphasizes the importance of focusing on high-quality information sources in the fragmented era of the semiconductor industry, suggesting that professionals should follow specific WeChat public accounts to stay informed and connected [1]. Group 1: Recommended WeChat Public Accounts - "半导体技术天地" focuses on semiconductor industry technology, technical materials, and expert explanations [3]. - "全球电子市场" is the leading WeChat platform in the semiconductor industry, with 500,000 industry professionals already following it [5]. - "半导体行业圈" serves as a community for semiconductor professionals [7]. - "半导体产业联盟" is a platform for the entire semiconductor industry chain [9]. Group 2: Community Engagement - There is a free open access to a WeChat group with 80,000 members, promoting community engagement among semiconductor professionals [12]. - Steps to join the group include scanning a QR code to follow the China Semiconductor Forum WeChat public account and replying with "加群" for further instructions [13][15].

国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 等多个领域。芯来科技的技术积累和市场资源将为芯原股份带来显著的协同效应。 2023年7月，芯来科技成为全球首家通过ISO 26262 ASIL–D级别汽车功能安全认证的RISC– V IP公司。2024年，其RISC–V IP业务收入在中国RISC–V IP企业中位居前列。 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 9月12日，A股半导体及芯片概念股迎来全面爆发，科创芯片指数、芯片产业指数涨幅均超 1%，消费电子指数上涨1.3%。被称为"半导体IP第一股"的芯原股份今日复牌，开盘后迅速 拉升，盘中触及20%涨停，截至午间收盘报183.6元/股，总市值达965亿元，逼近千亿元大 关。 9月11日晚间，芯原股份披露发行股份及支付现金购买资产并募集配套资金预案，拟以发行股 份及支付现金的方式购买芯来科技合计97.0070%股权并募集配套资金，但本次交易相关的审 计、评估工作尚未完成，标的资产拟定交易价格尚未最终确定。 市场强劲表现背后，是公司基本面的显著支撑。芯原股份最新公告显示，截至2025年第二季 度末，公司累计在手订单金额达30.25亿元， ...

Core Viewpoint - The rapid development of AI chips by companies like NVIDIA has led to a surge in demand for advanced packaging services from TSMC, forcing the company to accelerate its production plans significantly [2][4]. Group 1: Market Demand and Production Challenges - TSMC is a leading supplier in advanced packaging technologies such as CoWoS, but it is currently unable to meet the overwhelming market demand on its own [4]. - The company has been compelled to speed up its production processes by more than 75%, and in some cases, by up to a year, deviating from traditional sequential deployment methods [4]. - The product cycles for AI GPU manufacturers like NVIDIA typically range from 6 months to a year, resulting in a sustained high demand for advanced packaging technologies like CoWoS and SoIC [4]. Group 2: Strategic Responses - To address these challenges, TSMC is implementing several forward-looking strategies, including pre-ordering necessary equipment and collaborating with local packaging suppliers [4]. - TSMC has formed a "3DIC Advanced Packaging Manufacturing Alliance," which includes members such as TSMC, ASE, and several other companies, to enhance its production capabilities [4]. - The introduction of NVIDIA's Rubin product line, which will debut six months after the Blackwell Ultra, highlights the need for timely delivery and adaptation to significant architectural differences between product lines [4].