Core Viewpoint - The article discusses the acquisition of a 49% stake in Zhongxin North by SMIC, emphasizing the strategic move to enhance its position in the semiconductor industry and the significance of this transaction for the domestic semiconductor sector [2]. Group 1: Acquisition Details - SMIC plans to acquire 49% of Zhongxin North for approximately 40.601 billion yuan, which will result in SMIC owning 100% of Zhongxin North [2]. - Zhongxin North, established in July 2013 with a registered capital of 4.8 billion USD, focuses on 12-inch wafer manufacturing with processes ranging from 65nm to 28nm [2]. - The company has initiated a 12-inch integrated circuit production line project, covering an area of about 286,000 square meters, with a planned monthly capacity of 70,000 12-inch wafers [2]. Group 2: Valuation and Financials - The equity book value of Zhongxin North is reported at 41.8 billion yuan, with an assessed value of 82.8 billion yuan, indicating a valuation increase of 41 billion yuan and a premium rate of 98.19% [2]. - SMIC also announced a new joint venture agreement with the National Integrated Circuit Fund and other investors, increasing the registered capital of Zhongxin South from 6.5 billion USD to approximately 10.0773 billion USD [2].

国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 12月30日消息，据外媒报道，美国政府已向三星电子等颁发年度许可证，允许其在2026年向其位于中国的工厂进 口芯片制造设备。 为了限制中国获取美国先进技术，美国总统特朗普政府一直在重新审视其认为拜登政府时期过于宽松的出口管制 措施。 三星电子是全球最大的存储芯片制造商，而另一家韩国存储芯片商则将中国视为其主要生产基地之一，尤其是在 传统存储芯片方面。由于人工智能（AI）数据中心的需求以及供应趋紧，传统存储芯片的价格一直在飙升。 半导体公众号推荐 ***************END*************** 此次批准对韩国公司而言是一项暂时的豁免，此前美国曾于2025年早些时候撤销了部分科技公司的许可证豁免。 消息人士称，美国政府方面推出了芯片制造设备对华出口的年度审批制度。 此前，三星、台积电等曾受益于美国政府对中国芯片相关产品出口的全面限制豁免。但这项被称为"最终用户认 证"（VEU）的特权将于12月31日到期，这意味着此后美国芯片制造工具运往中国工厂将需要获得美国出口许可 证。 第一步：扫 ...

Core Viewpoint - TSMC has quietly commenced mass production of its N2 2nm process, aligning with its previously set timeline for 2025 [2][4]. Group 1: TSMC N2 Process Overview - TSMC's N2 process is the first to utilize GAA (Gate-All-Around) technology, specifically employing nanosheet transistors, marking a significant advancement in semiconductor manufacturing [4]. - The N2 process boasts a 1.15x increase in transistor density compared to the previous N3E process, with power consumption reduced by 24%-35% and performance improved by 15% [4]. - The SRAM density of the N2 process reaches a record 37.9Mb/mm², providing robust hardware support for high-performance computing and AI applications [4]. Group 2: Market Implications - Initial wafer foundry prices for the N2 process are expected to reach $30,000 per wafer, equivalent to over 200,000 RMB, indicating that only financially strong companies can afford this technology [4]. - Major clients such as NVIDIA, AMD, Apple, Qualcomm, and MediaTek are anticipated to utilize the N2 process as its production capacity ramps up [2][4].

Core Viewpoint - The article discusses the ongoing control dispute over Nexperia, a subsidiary of Wingtech Technology, highlighting the legal actions being taken and the implications for the semiconductor supply chain [1][4]. Group 1: Control Dispute and Legal Actions - Wingtech Technology's chairman, Yang Mu, announced that the company has initiated legal proceedings following the Dutch government's freezing of Nexperia's assets due to "national security" concerns, with potential claims reaching up to $8 billion [1]. - The company plans to hold a second hearing in the Netherlands in January 2026 and may pursue international arbitration if the situation is not resolved [4]. - Wingtech has accused Nexperia Netherlands of several actions that disrupt the supply chain, including halting wafer supplies to Nexperia China and making unfounded claims about product quality [3]. Group 2: Supply Chain and Production Implications - Nexperia Netherlands has ceased wafer supply to Nexperia China, leading to a fragmented supply chain, prompting Nexperia China to accelerate localization efforts, with plans to complete domestic wafer supplier validation by Q2 2026 [1]. - Nexperia Netherlands is also planning to invest over $300 million in Malaysia to expand production capacity, aiming for 90% of its production needs to be met outside of China by mid-2026 [1]. Group 3: Diplomatic and Regulatory Context - Wingtech Technology asserts that the Dutch government's intervention violates the China-Netherlands Bilateral Investment Protection Agreement, and a dispute notification was submitted on October 15, with a six-month resolution window before seeking international arbitration [4]. - The Chinese government has reiterated that the root cause of the Nexperia issue is the improper administrative intervention by the Dutch government, urging for the withdrawal of administrative orders to restore stability in the semiconductor supply chain [4].

半导体论坛 振兴国产半导体产业！ 信息爆 炸的时代 更需要断舍离 如何更加高效的获取高质量的信息 在碎片化的时代里 收获满满？ 2025年，半导体人只需关注5个公众号 半导体技术天地 ▲长按二维码"识别"关注 ID：ic2018ic 半导体行业第一的微信公众平台，50万的从业人员都已关注！ ▲长按二维码"识别"关注 专注半导体产业技术，技术资料，专家讲解。欢迎关注! ↓↓↓值得您的关注↓↓↓ 国芯网 ID：CSF211ic ▲长按二维码"识别"关注 芯媒评论，请关注！ ↓↓↓值得您的关注↓↓↓ 半导体行业圈 ID：ic211ic ↓↓↓值得您的关注↓↓↓ 全球电子市场 ID：xinlun99 ***************END************** * 半导体论坛微信群 ▲长按二维码"识别"关注 半导体行业圈，半导体人自己的圈子，请关注！ ↓↓↓值得您的关注↓↓↓ 半导体产业联盟 ID：icchinaunion ▲长按二维码"识别"关注 半导体全产业链联盟，请关注！ 8万人在群，所有微信群免费开放！ 加群步骤： 第一步：扫描下方二维码，关注中国半导体论坛微信公众号。 第二步：在公众号里面回复"加群"， ...

Core Viewpoint - The semiconductor industry is experiencing a significant price increase across both mature and advanced processes, driven by structural supply-demand imbalances and rising costs, particularly influenced by the AI industry's growth [2][4][5]. Group 1: Price Increases - SMIC has officially notified downstream customers of a price increase of approximately 10% for 8-inch BCD process foundry services, with multiple chip companies confirming receipt of this notice [2]. - Taiwan's World Advanced Semiconductor has followed suit with a similar 10% price increase for the same process, indicating a clear industry-wide trend [2]. - TSMC plans to implement a series of price increases for advanced processes below 5nm starting January 2026, with an average increase of 3%-5% over four years [2]. Group 2: Supply-Demand Dynamics - The current price surge is attributed to a long-term structural imbalance between supply and demand, with explosive growth in demand, particularly from the AI sector, being a key driver [4]. - The demand for power management chips in AI servers has surged, leading to a critical shortage of related production capacity, particularly for BCD processes [4]. - TrendForce's research indicates that by the second half of 2025, driven by AI demand, wafer foundries' capacity utilization rates are expected to remain higher than previously anticipated, with some manufacturers performing better in Q4 than in Q3 [4]. Group 3: Supply Constraints - TSMC is actively reducing its 8-inch mature process capacity to focus on high-value advanced processes, planning to shut down some production lines by the end of 2027, which exacerbates the supply constraints in the mature process segment [5]. - Domestic foundries are operating at full capacity, with SMIC achieving a capacity utilization rate of 95.8% and a monthly output of over 1 million 8-inch wafers [5]. - Huahong Semiconductor's capacity utilization rate has reached 109.5%, indicating an overworked state, which provides a strong basis for price increases [5]. Group 4: Cost Pressures - The cost of raw materials, particularly metals like gold and copper, remains high, with leading silicon wafer companies raising prices by an average of 12% in late December, directly increasing wafer manufacturing costs [5]. - Rising energy and labor costs further compress profit margins for foundries, making price increases a necessary response to maintain profitability [5].

Core Viewpoint - The article emphasizes the resilience of TSMC's operations in the face of a significant earthquake, highlighting the effectiveness of their extensive seismic safety measures and the minimal impact on global semiconductor supply chains [2][4][5]. Group 1: Earthquake Impact - A 6.6 magnitude earthquake struck near Yilan County, Taiwan, marking the strongest quake in the region in 27 years [1]. - TSMC reported that all its factories remained undamaged, preventing major fluctuations in global chip prices [2]. - The earthquake's effects were largely limited to minor damages across Taiwan, with TSMC's facilities experiencing only a level 4 tremor [4]. Group 2: TSMC's Safety Measures - TSMC has invested heavily in seismic safety, implementing advanced structural designs and emergency systems to mitigate earthquake risks [5]. - The company's clean rooms feature double-shell designs and are equipped with dampers and hydraulic pistons to isolate vibrations [5]. - TSMC's proactive measures include a dedicated earthquake early warning system, which has proven effective in past seismic events, allowing for rapid recovery of operations [5]. Group 3: Operational Resilience - Following the earthquake, TSMC quickly initiated evacuation and safety protocols, ensuring personnel safety while maintaining operational integrity [2][4]. - The company demonstrated its capability to restore 70% of equipment functionality within 10 hours during a previous earthquake, showcasing its robust recovery plans [5]. - TSMC's investments in disaster preparedness have significantly reduced potential economic losses, with past incidents resulting in manageable damages [5].

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不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 12月26日消息，据韩媒报道，三星将在 2026 年 2 月开始大规模量产 HBM4 芯片，其竞争对手 SK 海力士也会在大致相同的时间开始量产，成为全球内存 半导体行业首例。 业内人士透露，SK 海力士将从明年 2 月起，在韩国京畿道利川 M16 工厂、清州 M15X 工厂全面启动生产。而三星也将于同一时间在平泽园区启动 HBM4 量产工作。 据报道，HBM4 不只是一次单纯的性能升级，而是转向客制化产品的重要分水岭。其中 SK 海力士选择与台积电合作，在 HBM4 的基底 Die 上采用 12nm 制程工艺，让带宽相比上代型号提升 2 倍，能效比提升 40% 以上。 而三星则凭借 Turnkey方案、领先制程技术正面迎战，这家厂商选择果断导入 10nm 先进制程，在内部技术评估中实现 11.7Gbps 的行业领先性能，因此有 足够的自信将量产时间提前至 2 月。 国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 同时，三星生产出的 HBM4 芯片大部分都将供应给英伟达的下一代 AI 加速器系统"Vera Rubin"，计划 2026 年下旬发布 ...

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