Group 1 - The board of Guangdong Lier New Materials Technology Co., Ltd. has nominated Mr. She Yingjie, founder and general manager of Guangdong Shiyun Circuit Technology Co., Ltd., as a non-independent director candidate for its third board, marking a significant transition from "capital marriage" to "governance integration" in their alliance with German capital [1] - Lier Technology, established in 2004, focuses on the research, manufacturing, and sales of functional adhesive films, flexible circuit boards, new energy coating foils, and carbon nanotubes, positioning itself as a high-tech enterprise in the functional materials sector [1] - The company has established three major industrial bases centered in Guangdong, radiating to central and southwestern regions, and is recognized as a leading player in the domestic functional materials niche [1] Group 2 - Mr. She Yingjie, born in 1957, has held various leadership roles, including general manager of Shenzhen Shiyun Circuit and chairman of Heshan Shiyun, and currently serves as chairman and general manager of Guangdong Shiyun Circuit Technology Co., Ltd. [3] - He founded Shiyun Circuit in Hong Kong in 1985 and expanded to Shenzhen in 1991, focusing on PCB and early investments in the new energy vehicle and AI sectors, becoming a supplier for major international companies like Tesla and Siemens [5] - In 2025, he was listed on the Hurun Rich List with a net worth of 7.5 billion yuan, maintaining his status as the richest person in Heshan, and has donated over 5 million yuan to support education and rural development [5]

Core Insights - The automotive PCB industry is experiencing significant growth, with the global market size projected to increase from $6.457 billion in 2020 to $9.195 billion by 2024, representing a compound annual growth rate (CAGR) of 9.2% [2] - China, as the largest automotive producer and consumer, is expected to see its automotive PCB market reach approximately 22.27 billion yuan in 2024, growing by 4.3% year-on-year, driven by the rapid advancement of electric vehicles and smart automotive technologies [2] Industry Overview - Printed Circuit Boards (PCBs) are essential components in various sectors, including automotive, consumer electronics, industrial, medical, and military applications [4] - In the automotive sector, PCBs must exhibit excellent electrical performance and reliability, with rigorous testing for high-temperature aging, low-temperature shock, and thermal cycling [8] - The automotive PCB market is characterized by a shift towards high-end products, with increasing demand for advanced technologies such as ADAS and electric vehicle components [2][4] Market Dynamics - The automotive PCB market is expected to expand further, reaching $9.712 billion in 2025, with a year-on-year growth of 5.6% [2] - The competitive landscape is evolving, with a tiered structure where international giants dominate high-end markets while Chinese companies focus on mid-range segments [2] - Key competitors in the automotive PCB space include companies like Huada Technology, Shennan Circuit, and Jinko Electronics, with market shares of 3.7%, 2.3%, and 4.1% respectively in 2024 [2][3] Application and Characteristics - Automotive PCBs are categorized into flexible PCBs, rigid PCBs, thick copper PCBs, multilayer PCBs, and HDI boards, each serving different applications based on their material properties [5] - Key features required for automotive PCBs include durability, lightweight design, high current carrying capacity, and thermal resistance, which are critical for various automotive applications such as battery management systems and electronic control units [5][8] Industry Supply Chain - The automotive PCB supply chain consists of upstream raw materials (electrolytic copper, wood pulp, fiberglass, synthetic resins), midstream manufacturing, and downstream applications in traditional and electric vehicles [6][7] - The manufacturing process is capital and technology-intensive, with high barriers to entry due to the lengthy certification processes required by automotive manufacturers [6]

每经AI快讯，1月13日，元件板块走弱，世运电路跌超7%，金禄电子、格利尔、江海股份、达利凯普等 跟跌。 （文章来源：每日经济新闻） ...

元件板块走弱，世运电路跌超7%，金禄电子、格利尔、江海股份、达利凯普等跟跌。 ...

在区域布局方面，世运电路海外业务基础扎实，正积极拓展国内市场；莱尔科技在国内新能源领域具备 优势，并逐步推进海外延伸。合作有助于实现国内外市场的联动发展与资源整合。 中证报中证网讯(王珞)近日，莱尔科技(688683)发布公告称，公司董事会审议通过了关于提名佘英杰为 公司第三届董事会非独立董事候选人的议案。佘英杰是世运电路（603920）创始人、总经理。此次提名 是双方继2025年7月签署战略合作与股权转让协议、实现股权联结后，在公司治理层面的重要推进，标 志着战略协同进入新阶段。 此外，双方在生产原材料方面具有较高共性，均大量使用铜材、胶膜基材等关键物料。通过联合采购与 供应链资源共享，有望提升采购规模优势，增强供应链韧性与成本控制能力。 公告显示，佘英杰进入莱尔科技董事会，将进一步推动双方在客户与市场方面的协同。世运电路主营车 规级PCB产品，已进入多家全球知名车企供应链；莱尔科技主要产品包括功能性胶膜、FFC、涂碳箔 等，广泛应用于汽车电子与新能源电池领域。双方可通过客户资源对接与市场网络互补，共同拓展新能 源汽车市场，并在AI服务器、低空经济等新兴领域加强联合开拓。 莱尔科技表示，佘英杰作为世运电路的 ...

Core Viewpoint - The company is actively researching and developing TGV glass substrates, which represent a cutting-edge technology in the semiconductor packaging field [1] Group 1: Company Initiatives - The company has initiated forward-looking research and layout regarding TGV glass substrates in recent years [1] - The company is conducting technical research and engaging in upstream and downstream communication related to glass substrate processes and key links in the industry chain [1] - The company is tracking and reserving high-quality targets in the domestic glass substrate sector [1]

Core Viewpoint - The company is actively engaged in research and development of TGV glass substrates, which represent a cutting-edge technology in the semiconductor packaging field [1] Group 1: Company Initiatives - The company has initiated forward-looking research and layout regarding TGV glass substrates in recent years [1] - The company is conducting technical research and communication across key processes and the industrial chain related to glass substrates [1] - The company is tracking and reserving high-quality targets in the domestic glass substrate sector [1]

Core Viewpoint - The company is actively engaged in the research and development of TGV glass substrates, which represent a cutting-edge technology in the semiconductor packaging field [1] Group 1: Company Initiatives - The company has initiated forward-looking research and layout regarding TGV glass substrates in recent years [1] - The company is conducting technical research and engaging in upstream and downstream communication related to glass substrate processes and key links in the industry chain [1] - The company is tracking and reserving high-quality targets in the domestic glass substrate sector [1]

Important Matters - Chengjian Development has achieved a three-day stock increase and holds 18.91 million shares of Century Space, making it the fourth largest shareholder [1] - Lens Technology is a strategic investor in Strong Brain Technology and has exclusively undertaken the mass production of core hardware [1] - Shiyun Circuit is collaborating with brain-machine clients to advance the development of new material numbers [1] - Xinyada has indirectly held shares in Zhongke Aerospace through Xi'an Qingchuan [1] - Chipone Technology has completed the acquisition of Zhudian Semiconductor [1] - Suoling Co., Ltd. has seen a three-day stock increase, with its controlling shareholder's concerted action partner, Tanghe Holdings, successfully bidding for 37.5 million shares of the company [1] - iFlytek's robot super brain platform has achieved multiple technological breakthroughs in multi-modal noise reduction and has formed extensive collaborations with Yushu and Zhiyuan [1] Investment Operations - ZTE Corporation has conducted NTN technology trials and achieved breakthroughs, providing comprehensive satellite payload products [1] - Chaojie Co., Ltd. expects rapid growth in revenue from commercial aerospace-related businesses by 2026 [1] - Xinyi Chang plans to launch its second-generation wheeled robot before the 2026 Spring Festival, with three robot products expected to enter mass production in the second half of 2026 [1] - Zhejiang Xiantong is collaborating with Haohai Starry Sky and Qiteng Robotics, with robots expected to roll off the production line by the end of March [1] - Fengzhushou is placing significant emphasis on opportunities in commercial aerospace and aviation internet development, clearly positioning it as a fourth growth curve [1] - Chaoying Electronics has adjusted the investment amount for its AI computing high-end printed circuit board expansion project from 1.468 billion to 3.315 billion yuan [1] Contracts and Collaborations - Guoji Jinggong is focusing on new business areas, particularly in commercial aerospace bearings and humanoid robot bearings [1] - iFlytek's robot super brain platform has achieved multiple technological breakthroughs and has formed extensive collaborations with Yushu and Zhiyuan [1] - Desay SV Automotive has established strategic partnerships with several well-known robotics companies [1] - Tuobang Co., Ltd. has deepened cooperation with UBTECH in related business areas [1] - Fushite has signed a strategic cooperation agreement with Jiangxi Copper [1] - Robotech's subsidiary ficonTEC has signed a full automatic OCS packaging line order with a Swiss client [1] - Times New Materials has signed a sales contract for wind turbine blades worth approximately 3.32 billion yuan [1]

登录新浪财经APP 搜索【信披】查看更多考评等级 证券代码：603920 证券简称：世运电路 公告编号：2026-001 广东世运电路科技股份有限公司 关于公司股票期权激励计划2025年第四季度自主行权结果暨股份变动公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性承担法律责任。 重要提示内容： ● 2021年股票期权激励计划预留授予股票期权行权结果：2021年股票期权激励计划预留授予股票期权第 二个行权期可行权股票期权数量为920,000股，行权方式为自主行权，行权期为2025年1月14日至2025年 12月6日。2025年第四季度行权0股，累计行权919,500股，占预留授予股票期权第二个行权期可行权股 票期权总量的99.95%。 ● 上述行权股票上市流通时间：上述激励计划均采用自主行权模式行权，激励对象行权所得股票于行权 日（T日）后的第二个交易日（T+2）日上市交易。 一、股票期权行权的决策程序和信息披露情况 首次授予激励对象名单的调整以及首次授予的激励对象名单进行核实并发表了核查意见，同意公司2021 年股票期权激励计划首次授予 ...