格隆汇1月14日丨世运电路(603920.SH)在投资者互动平台表示，公司的产品有销往中国台湾地区。 ...

Group 1 - The core point of the article is the strategic collaboration between Guangdong Lier New Materials Technology Co., Ltd. and Shun Control Group, marking a transition from capital partnership to governance integration, with the nomination of Mr. She Yingjie as a non-independent director of Lier Technology's board [1] - The collaboration follows a clear "three-step" path: signing a strategic cooperation framework agreement, completing share transfer, and now integrating governance through board participation [1][2] - The partnership aims to leverage complementary strengths in the value chain, particularly in high-growth sectors such as new energy vehicles and AI servers, to achieve synergistic effects [2] Group 2 - Shun Control Group has a strong foundation in overseas markets and is expanding its domestic business, while Lier Technology has a solid base in the domestic new energy market and is actively pursuing international expansion, creating effective market network synergies [3] - The nomination of Mr. She signifies a shift from being a strategic shareholder to participating in core decision-making, enhancing the competitive edge of both companies in a rapidly evolving manufacturing landscape [3] - The collaboration model exemplifies a typical industrial capital operation within the Shunde district, which encourages companies to embrace capital markets and shift from family to shareholder thinking [4] Group 3 - Shunde district has a robust ecosystem with 44 listed companies, representing a significant portion of the local economy, and a total market value of approximately 880 billion [4][5] - The district is fostering a multi-tiered capital market structure, with a focus on nurturing companies through various stages of listing and capital market engagement [5] - Current favorable macroeconomic conditions, including national policy support and improved regulatory efficiency, present a "golden window period" for companies to enter the capital market [5]

Group 1 - The board of Guangdong Lier New Materials Technology Co., Ltd. has nominated Mr. She Yingjie, founder and general manager of Guangdong Shiyun Circuit Technology Co., Ltd., as a non-independent director candidate for its third board, marking a significant transition from "capital marriage" to "governance integration" in their alliance with German capital [1] - Lier Technology, established in 2004, focuses on the research, manufacturing, and sales of functional adhesive films, flexible circuit boards, new energy coating foils, and carbon nanotubes, positioning itself as a high-tech enterprise in the functional materials sector [1] - The company has established three major industrial bases centered in Guangdong, radiating to central and southwestern regions, and is recognized as a leading player in the domestic functional materials niche [1] Group 2 - Mr. She Yingjie, born in 1957, has held various leadership roles, including general manager of Shenzhen Shiyun Circuit and chairman of Heshan Shiyun, and currently serves as chairman and general manager of Guangdong Shiyun Circuit Technology Co., Ltd. [3] - He founded Shiyun Circuit in Hong Kong in 1985 and expanded to Shenzhen in 1991, focusing on PCB and early investments in the new energy vehicle and AI sectors, becoming a supplier for major international companies like Tesla and Siemens [5] - In 2025, he was listed on the Hurun Rich List with a net worth of 7.5 billion yuan, maintaining his status as the richest person in Heshan, and has donated over 5 million yuan to support education and rural development [5]

Core Insights - The automotive PCB industry is experiencing significant growth, with the global market size projected to increase from $6.457 billion in 2020 to $9.195 billion by 2024, representing a compound annual growth rate (CAGR) of 9.2% [2] - China, as the largest automotive producer and consumer, is expected to see its automotive PCB market reach approximately 22.27 billion yuan in 2024, growing by 4.3% year-on-year, driven by the rapid advancement of electric vehicles and smart automotive technologies [2] Industry Overview - Printed Circuit Boards (PCBs) are essential components in various sectors, including automotive, consumer electronics, industrial, medical, and military applications [4] - In the automotive sector, PCBs must exhibit excellent electrical performance and reliability, with rigorous testing for high-temperature aging, low-temperature shock, and thermal cycling [8] - The automotive PCB market is characterized by a shift towards high-end products, with increasing demand for advanced technologies such as ADAS and electric vehicle components [2][4] Market Dynamics - The automotive PCB market is expected to expand further, reaching $9.712 billion in 2025, with a year-on-year growth of 5.6% [2] - The competitive landscape is evolving, with a tiered structure where international giants dominate high-end markets while Chinese companies focus on mid-range segments [2] - Key competitors in the automotive PCB space include companies like Huada Technology, Shennan Circuit, and Jinko Electronics, with market shares of 3.7%, 2.3%, and 4.1% respectively in 2024 [2][3] Application and Characteristics - Automotive PCBs are categorized into flexible PCBs, rigid PCBs, thick copper PCBs, multilayer PCBs, and HDI boards, each serving different applications based on their material properties [5] - Key features required for automotive PCBs include durability, lightweight design, high current carrying capacity, and thermal resistance, which are critical for various automotive applications such as battery management systems and electronic control units [5][8] Industry Supply Chain - The automotive PCB supply chain consists of upstream raw materials (electrolytic copper, wood pulp, fiberglass, synthetic resins), midstream manufacturing, and downstream applications in traditional and electric vehicles [6][7] - The manufacturing process is capital and technology-intensive, with high barriers to entry due to the lengthy certification processes required by automotive manufacturers [6]

Group 1 - The component sector is experiencing a downturn, with Shiyun Circuit falling over 7% [2] - Other companies such as Jinlu Electronics, Greer, Jianghai Co., and Dali Kipu are also seeing declines [2]

元件板块走弱，世运电路跌超7%，金禄电子、格利尔、江海股份、达利凯普等跟跌。 ...

Core Viewpoint - The nomination of She Yingjie as a non-independent director of Lair Technology marks a significant step in the governance collaboration between Lair Technology and Shiyun Circuit, following their strategic partnership established in July 2025, indicating a new phase of strategic synergy [1][2] Group 1: Strategic Collaboration - The entry of She Yingjie into Lair Technology's board is expected to enhance collaboration in customer and market aspects between the two companies [1] - Both companies aim to leverage their customer resources and market networks to jointly expand in the new energy vehicle market and strengthen their presence in emerging fields such as AI servers and low-altitude economy [1] Group 2: Market Positioning - Shiyun Circuit specializes in automotive-grade PCB products and has entered the supply chains of several global automotive companies, while Lair Technology's products are widely used in automotive electronics and new energy battery sectors [1] - The collaboration is anticipated to facilitate the integration of domestic and international markets, enhancing resource allocation and development [1] Group 3: Supply Chain Synergy - Both companies share a high degree of commonality in raw material usage, including significant quantities of copper and film substrates, which could lead to improved procurement scale advantages and enhanced supply chain resilience through joint purchasing and resource sharing [1]

Core Viewpoint - The company is actively researching and developing TGV glass substrates, which represent a cutting-edge technology in the semiconductor packaging field [1] Group 1: Company Initiatives - The company has initiated forward-looking research and layout regarding TGV glass substrates in recent years [1] - The company is conducting technical research and engaging in upstream and downstream communication related to glass substrate processes and key links in the industry chain [1] - The company is tracking and reserving high-quality targets in the domestic glass substrate sector [1]

Core Viewpoint - The company is actively engaged in research and development of TGV glass substrates, which represent a cutting-edge technology in the semiconductor packaging field [1] Group 1: Company Initiatives - The company has initiated forward-looking research and layout regarding TGV glass substrates in recent years [1] - The company is conducting technical research and communication across key processes and the industrial chain related to glass substrates [1] - The company is tracking and reserving high-quality targets in the domestic glass substrate sector [1]

Core Viewpoint - The company is actively engaged in the research and development of TGV glass substrates, which represent a cutting-edge technology in the semiconductor packaging field [1] Group 1: Company Initiatives - The company has initiated forward-looking research and layout regarding TGV glass substrates in recent years [1] - The company is conducting technical research and engaging in upstream and downstream communication related to glass substrate processes and key links in the industry chain [1] - The company is tracking and reserving high-quality targets in the domestic glass substrate sector [1]