Core Viewpoint - CMP (Chemical Mechanical Polishing) technology is essential for the development of integrated circuits, playing a critical role in achieving surface flatness during chip manufacturing, which is increasingly important as technology nodes shrink and the number of layers in chips increases [6][38]. Group I: CMP Technology and Market Overview - CMP technology is a necessary process in wafer manufacturing, which includes multiple steps such as diffusion, lithography, etching, ion implantation, thin film growth, and CMP itself [9]. - The global CMP materials market is experiencing continuous growth, driven by advancements in semiconductor technology and increasing demand from various sectors, including 5G and AI [32][49]. - The CMP materials market is characterized by a high degree of technical, talent, and patent barriers, with significant market share held by leading companies from the US and Japan [54]. Group II: Market Size and Growth - The global CMP polishing pad market size increased from $650 million in 2016 to $1.13 billion in 2021, with a CAGR of 11.69% [49]. - The CMP polishing liquid market also saw growth, rising from $1.1 billion in 2016 to $1.43 billion in 2021, with a CAGR of 5.39% [50]. - China's CMP polishing liquid market grew significantly, from 1.23 billion yuan in 2016 to 2.2 billion yuan in 2021, achieving a CAGR of 12.28%, indicating a faster growth rate compared to the global market [50]. Group III: Domestic Industry Dynamics - Chinese companies are increasingly entering the CMP materials market, with government policies supporting the development of the semiconductor industry and promoting domestic alternatives to imported materials [39][41]. - The domestic semiconductor materials market is expected to continue growing at a rate higher than the global average, driven by technological advancements and increasing local demand [32][39]. - The shift towards domestic production of CMP materials is seen as a strategic move to reduce reliance on foreign suppliers, especially in light of export controls from the US and Japan [39][54]. Group IV: Product Segmentation and Applications - CMP materials are primarily categorized into polishing liquids, polishing pads, and cleaning agents, with polishing liquids accounting for 49% and polishing pads for 33% of the market share [18]. - Various types of polishing liquids are used for different applications, including copper CMP, tungsten CMP, and dielectric CMP, each tailored for specific manufacturing processes [19][21]. - Polishing pads are typically made from polyurethane and are designed to maintain a stable polishing environment while effectively distributing polishing liquids [20][22].

Core Viewpoint - The recent supply disruption of CMP slurry, specifically DST slurry produced by AGC in Taiwan, has accelerated the pace of domestic alternatives in the semiconductor industry, highlighting the urgency for local manufacturers to innovate and adapt [1][2]. Group 1: Importance of CMP Slurry - CMP slurry is essential for the chemical mechanical polishing process in semiconductor manufacturing, akin to smoothing and leveling surfaces in construction [2]. - The slurry consists of ultra-fine abrasives, chemical agents, and water, and is crucial for achieving the required surface smoothness in logic and memory chip production [2]. Group 2: Market Dynamics - The CMP slurry market is predominantly controlled by American and Japanese companies, with Cabot Microelectronics holding 33% of the global market share, while Japanese firms account for an additional 23% [3]. - Domestic manufacturers currently hold a market share of 25-30%, which is even lower in high-end processes (e.g., below 28nm) [3]. - The global CMP slurry market was valued at $1.89 billion in 2021 and is projected to exceed $2.6 billion by 2026, with a compound annual growth rate (CAGR) of approximately 6% [3]. - In China, the CMP slurry market is expected to grow from approximately 2.3 billion yuan in 2023 to 4.6 billion yuan by 2028, reflecting a CAGR of 15% [3]. Group 3: Demand Surge Factors - The demand for CMP slurry is increasing due to the growing complexity of high-end processes, with the number of CMP steps for 14nm logic chips doubling, requiring more types of slurry [3]. - The rise of 3D NAND memory chips, with increasing stacking layers, necessitates more intricate polishing processes, leading to a significant increase in CMP slurry usage [3]. Group 4: Domestic Players - Anji Technology has been a leader in CMP slurry since 2006, achieving a market share of over 5% globally and increasing its share in China from 20.9% in 2020 to 30.8% in 2021 [4]. - Sanhe New Materials focuses on diamond polishing liquids for hard materials and is gradually increasing its market share by supplying to companies like SMIC [4]. - Dinglong Co. is a key player in the domestic polishing pad market, offering a comprehensive solution that includes polishing liquids, cleaning liquids, and polishing pads, enhancing its competitive edge [5].

Group 1 - The core viewpoint of the article is the approval of the first vesting list for the 2024 restricted stock incentive plan by the supervisory board of the company [1][2] - The supervisory board confirms that the 68 incentive objects meet the qualifications stipulated by relevant laws and regulations, as well as the company's articles of association [2] - The total number of restricted stocks to be vested for these 68 qualified incentive objects is 154,939 shares [2]

Group 1 - The legal opinion letter is issued by Shanghai Jintiancheng Law Firm regarding the 2024 Restricted Stock Incentive Plan of Anji Microelectronics Technology (Shanghai) Co., Ltd. [1][2] - The plan has received necessary approvals and authorizations from the company's board and supervisory board, confirming compliance with relevant laws and regulations [4][6][9]. - The first vesting period for the restricted stock is defined as from June 23, 2025, to June 18, 2026, following the grant date of June 20, 2024 [9][10]. Group 2 - The adjustment of the grant price and quantity of restricted stocks is based on the company's profit distribution plan, which includes a cash dividend of 4.50 yuan per 10 shares and a capital reserve increase of 3 shares for every 10 shares [7][8]. - The adjusted grant price is calculated to be approximately 42.16 yuan per share, while the adjusted quantity of restricted stocks is approximately 329,115 shares [8][9]. - The vesting conditions for the first period have been met, including the absence of adverse audit opinions and the fulfillment of performance targets [10][12]. Group 3 - A total of 7,504 shares of restricted stock will be canceled due to two incentive targets leaving the company, and an additional 139 shares will be canceled due to performance evaluations [13]. - The legal opinion concludes that the adjustments, vesting conditions, and cancellations comply with the relevant laws and regulations, confirming the legality and effectiveness of the incentive plan [13][14].

1 | 资深业务人员（78 | 人） | 16.9026 | 15.97% | 0.10% | | --- | --- | --- | --- | --- | | 合计 243 人 | | 105.8122 | 100% | 0.63% | 注：上表中部分合计数与各明细数直接相加之和在尾数上如有差异，是由于四舍五入所造成。 安集微电子科技（上海）股份有限公司 2025 年限制性股票激励计划激励对象名单 安集微电子科技（上海）股份有限公司 （截至授予日） 安集微电子科技（上海）股份有限公司 2025 年限制性股票激励计划的分配 情况如下表： | 姓名 | 职务 | 获授限制性股 | 占授予限制性 | 占授予时股 | | --- | --- | --- | --- | --- | | | | 票数量(万股) | 股票总数比例 | 本总额比例 | | 一、董事、高级管理人员、核心技术人员 | | | | | | Shumin Wang （王淑敏） | 董事长、核心技术人员 | 6.8016 | 6.43% | 0.04% | | Zhang Ming （张明） | 董事、总经理 | 6.5832 | 6.22% | ...

证券代码：688019 证券简称：安集科技 公告编号：2025-040 转债代码：118054 转债简称：安集转债 安集微电子科技（上海）股份有限公司 关于调整公司 2023 年、2024 年限制性股票激励计划 相关事项及作废处理部分限制性股票的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 安集微电子科技（上海）股份有限公司（以下简称"公司"）于 2025 年 7 月 1 日召开了第三届董事会第二十一次会议及第三届监事会第二十一次会议，审议 通过了《关于调整公司 2023 年、2024 年限制性股票激励计划相关事项的议案》 《关于作废处理部分限制性股票的议案》。现将有关事项说明如下： 一、股权激励计划已履行的相关审批程序 同日，公司召开第二届监事会第二十二次会议，审议通过了《关于公司<2023 年限制性股票激励计划（草案）>及其摘要的议案》《关于公司<2023 年限制性股 票激励计划激励对象名单>的议案》以及《关于公司<2023 年限制性股票激励计 划实施考核管理办法>的议案》等议案，公司监事会对本激励计划的相关事 ...

| 证券代码：688019 | 证券简称：安集科技 | 公告编号：2025-041 | | --- | --- | --- | | 转债代码：118054 | 转债简称：安集转债 | | 安集微电子科技（上海）股份有限公司 2023 年限制性股票激励计划 第二个归属期符合归属条件的公告 | | | 归属权益数量占授 | | --- | --- | --- | | 归属安排 | 归属时间 | 予权益总量的比例 | （1）股权激励方式：第二类限制性股票。 （2）授予数量：2023 年限制性股票激励计划（以下简称"激励计划"）授予 的限制性股票数量为 126.6101 万股（本次调整后），约占目前公司股本总额 16794.0414 万股的 0.75%。 重要内容提示： 一、本次股权激励计划批准及实施情况 （3）授予价格：46.53 元/股（本次调整后），即满足授予条件和归属条件后， 激励对象可以每股46.53元的价格购买公司向激励对象增发的公司A 股普通股股 票。 （一）本次股权激励计划方案及履行的程序 （4）激励人数：授予人数 201 人，为公司董事、高级管理人员、核心技术 人员、董事会认为需要激励的其他人员。 ...

| 证券代码：688019 | 证券简称：安集科技 | 公告编号：2025-042 | | --- | --- | --- | | 转债代码：118054 | 转债简称：安集转债 | | 安集微电子科技（上海）股份有限公司 2024 年限制性股票激励计划 第一个归属期符合归属条件的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 一、本次股权激励计划批准及实施情况 （一）本次股权激励计划方案及履行的程序 1、本次股权激励计划主要内容 （1）股权激励方式：第二类限制性股票。 （2）授予数量：2024 年限制性股票激励计划（以下简称"激励计划"）授予 的限制性股票数量为 32.9115 万股（本次调整后），约占目前公司股本总额 16794.0414 万股的 0.20%。 （3）授予价格：42.16 元/股（本次调整后），即满足授予条件和归属条件后， 激励对象可以每股 42.16 元的价格购买公司 A 股普通股股票。 （4）激励人数：授予人数 70 人，为董事会认为需要激励的人员。 | 第一个归属期 | 12 ...

（截至授予日） 安集微电子科技（上海）股份有限公司（以下简称"公司"）董事会薪酬与考 核委员会依据《中华人民共和国公司法》（以下简称"《公司法》"）、《中华人民 共和国证券法》（以下简称"《证券法》"）、《上市公司股权激励管理办法》（2025 修正）（以下简称"《管理办法》"）、《上海证券交易所科创板股票上市规则》（以 下简称"《上市规则》"）、《科创板上市公司自律监管指南第 4 号—股权激励信息 披露》等相关法律、法规及规范性文件和《安集微电子科技（上海）股份有限公 司章程》的有关规定，对公司 2025 年限制性股票激励计划（以下简称"本次激 励计划"）激励对象名单（截至授予日）进行审核，发表核查意见如下： 1、本次激励计划激励对象均不存在《管理办法》第八条规定的不得成为激 励对象的情形： 安集微电子科技（上海）股份有限公司董事会薪酬与考核委员会 关于 2025 年限制性股票激励计划激励对象名单的核查意见 2、本次激励计划激励对象不包括公司独立董事、监事、上市公司实际控制 人及其配偶、父母、子女。 3、公司本次授予激励对象人员名单与公司 2024 年年度股东大会批准的 《2025 年限制性股票激励计划（草案 ...

| 证券代码：688019 | 证券简称：安集科技 | 公告编号：2025-043 | | --- | --- | --- | | 转债代码：118054 | 转债简称：安集转债 | | 安集微电子科技（上海）股份有限公司 关于调整公司 2025 年限制性股票激励计划 相关事项的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 安集微电子科技（上海）股份有限公司（以下简称"公司"）于 2025 年 7 月 1 日召开了第三届董事会第二十一次会议，审议通过了《关于调整公司 2025 年 限制性股票激励计划相关事项的议案》。现将有关事项说明如下： 一、股权激励计划已履行的相关审批程序 1、2025 年 4 月 14 日，公司召开第三届董事会第十八次会议，会议审议通 过了《关于公司<2025 年限制性股票激励计划（草案）>及其摘要的议案》《关于 公司<2025 年限制性股票激励计划实施考核管理办法>的议案》以及《关于提请 公司股东大会授权董事会办理股权激励相关事宜的议案》等议案。董事会薪酬与 考核委员会对本激励计划的相关事项 ...