- Model Name: Volume Timing Model; Model Construction Idea: The model uses volume indicators to maintain a cautious view under the background of shrinking volume; Model Construction Process: The volume timing signal for major broad-based indices is calculated and maintained a cautious view as of May 23, 2025[1][2][22]; Model Evaluation: The model is effective in maintaining a cautious stance during periods of shrinking volume[22] - Factor Name: Upward Number Ratio of CSI 300; Factor Construction Idea: The factor calculates the proportion of stocks with positive returns in the CSI 300 index to judge market sentiment; Factor Construction Process: - CSI 300 Index N-day Upward Number Ratio = Number of CSI 300 Index constituent stocks with positive returns in the past N days / Total number of CSI 300 Index constituent stocks - The factor captures upward opportunities quickly and exits early during overheated market phases, but has limitations in avoiding downward risks[23][24][25]; Factor Evaluation: The factor is effective in capturing upward opportunities but has limitations in avoiding downward risks[24] - Factor Name: Moving Average Sentiment Indicator; Factor Construction Idea: The factor uses the eight moving average system to judge the trend state of the target index; Factor Construction Process: - Calculate the eight moving average values of the CSI 300 closing price with parameters 8, 13, 21, 34, 55, 89, 144, 233 - Assign values to the eight moving average indicator based on the interval value: -1 for intervals 1/2/3, 0 for intervals 4/5/6, and 1 for intervals 7/8/9 - When the current price exceeds the eight moving average indicator value in more than 5 cases, it indicates a bullish view on the CSI 300 index[27][31][32]; Factor Evaluation: The factor is effective in indicating the trend state of the CSI 300 index[34] - Factor Name: Cross-sectional Volatility; Factor Construction Idea: The factor measures the cross-sectional volatility of index constituent stocks to evaluate the Alpha environment; Factor Construction Process: - Calculate the cross-sectional volatility of CSI 300, CSI 500, and CSI 1000 index constituent stocks - Recent cross-sectional volatility of CSI 300 and CSI 500 index constituent stocks has decreased, indicating a worse short-term Alpha environment; CSI 1000 index constituent stocks' cross-sectional volatility has increased, indicating a better short-term Alpha environment[35][36][38]; Factor Evaluation: The factor is effective in evaluating the Alpha environment based on cross-sectional volatility[38] - Factor Name: Time Series Volatility; Factor Construction Idea: The factor measures the time series volatility of index constituent stocks to evaluate the Alpha environment; Factor Construction Process: - Calculate the time series volatility of CSI 300, CSI 500, and CSI 1000 index constituent stocks - Recent time series volatility of CSI 300, CSI 500, and CSI 1000 index constituent stocks has decreased, indicating a worse short-term Alpha environment[39][41]; Factor Evaluation: The factor is effective in evaluating the Alpha environment based on time series volatility[41] Model Backtest Results - Volume Timing Model, cautious view for all major broad-based indices as of May 23, 2025[23] Factor Backtest Results - Upward Number Ratio of CSI 300, recent ratio around 56%[24] - Moving Average Sentiment Indicator, short-term bullish view on CSI 300 index[34] - Cross-sectional Volatility, recent values for CSI 300: 1.75%, CSI 500: 2.04%, CSI 1000: 2.41%[38] - Time Series Volatility, recent values for CSI 300: 0.56%, CSI 500: 0.44%, CSI 1000: 0.27%[41]

Group 1 - The core viewpoint of the articles revolves around the significant capital increase plan of Shengmei Shanghai, which aims to raise 4.48 billion yuan for various purposes, including R&D platform construction and equipment iteration [1][2] - The company claims that the fundraising is intended to narrow the R&D gap with overseas giants and achieve a platform transformation through the Lingang project [1] - There are concerns in the market regarding the company's ample cash reserves and the fact that a substantial portion of the previous fundraising remains unutilized, raising questions about the rationale behind the new fundraising [1][2] Group 2 - As of Q1 2025, the company has approximately 3 billion yuan in available funds, with a debt ratio of 36.06% and interest-bearing liabilities of 1.396 billion yuan [1] - The previous fundraising of 3.685 billion yuan from the 2021 IPO still has 523 million yuan unutilized, which is nearly 15% of the total [1] - The company has faced multiple delays in its previous fundraising projects, with significant projects pushed back to 2025, reflecting market skepticism about the effectiveness of its capital allocation [2] Group 3 - The semiconductor equipment industry is shifting from a "capital race" to a "technology endurance race," indicating a need for companies to convert financing into genuine technological advantages and market share [2]

Core Viewpoint - The company, Shengmei Semiconductor Equipment (Shanghai) Co., Ltd., has revised its plan for a specific issuance of A-shares for the year 2024, which has been approved by multiple board meetings and shareholder meetings [1][2]. Group 1: Issuance Plan Details - The company has updated the maximum number of shares to be issued and the total amount of funds to be raised, along with the investment amounts for each project [2][5]. - The revised plan includes updates on the company's basic information and the total share capital [2][4]. - The company has provided a feasibility analysis for the use of raised funds, detailing the allocation for various projects, including R&D and working capital [2][6]. Group 2: Financial Impact and Compliance - The board has discussed the potential impact of the issuance on the company's financial indicators, including the dilution of immediate returns and the measures to mitigate this effect [5][6]. - The company has ensured that the issuance complies with relevant laws and regulations, including the Company Law and Securities Law [4][7]. - Updates have been made regarding the company's recent cash dividend distribution and its implications for existing shareholders [4][5]. Group 3: Project Specifics - The revised documents include detailed descriptions of specific projects funded by the issuance, such as the R&D and process testing platform and high-end semiconductor equipment iteration projects [3][7]. - The company has updated the expected revenue growth rates and net profit margins associated with these projects [4][6].

Fundraising Plan - The company plans to issue up to 44,129,118 shares to raise a total of no more than 448,200 million yuan, with the net proceeds allocated to R&D and process testing platform construction, high-end semiconductor equipment iterative R&D projects, and supplementing working capital [1][2] R&D and Process Testing Platform Construction - The project aims to establish an integrated circuit equipment R&D and process testing platform, enhancing the company's R&D testing capabilities and shortening product verification cycles, thereby improving efficiency and competitiveness [4][6][28] - The platform will utilize existing cleanroom environments and necessary testing instruments, including lithography machines and ion implanters, to support the R&D process from design to product finalization [4][5][6] High-End Semiconductor Equipment Iterative R&D Project - This project focuses on acquiring R&D hardware and software to enhance the company's capabilities in high-end semiconductor equipment, ensuring that key technologies possess differentiated global intellectual property rights [11][12][28] - The project is expected to accelerate the iterative development of cleaning equipment, high-end electroplating equipment, and advanced packaging wet process equipment, positioning the company among the top global semiconductor equipment suppliers [12][14][28] Working Capital Supplement - The company intends to use 130,418.07 million yuan of the raised funds to supplement working capital, addressing the increasing financial demands due to business expansion and ensuring sustainable development [23][26] Market Environment and Competitive Position - The semiconductor equipment market is experiencing significant growth, with China's market size reaching 366 billion USD in 2023, making it the largest globally [17][28] - The company has established a strong customer base and maintains stable relationships with leading semiconductor manufacturers, which supports its project initiatives [18][28] Technological and Talent Foundation - The company has a robust R&D foundation, with 931 R&D personnel, representing 46.50% of total employees, and a high level of educational qualifications among its staff [10][9][28] - The company has accumulated significant technological expertise, holding 470 patents, including 468 invention patents, which underpins its competitive edge in the semiconductor equipment sector [19][20][28]

Core Viewpoint - The company plans to issue A-shares to specific investors, aiming to raise up to RMB 4.482 billion for R&D, process testing platform construction, high-end semiconductor equipment iteration, and working capital supplementation [1][2]. Financial Impact - The issuance is expected to dilute immediate returns for existing shareholders, with potential impacts on key financial metrics such as earnings per share [3][4]. - The total share capital post-issuance could reach approximately 48.54 million shares, depending on various profit scenarios for 2025 [4][5]. Necessity and Reasonableness of the Issuance - The fundraising is aligned with the company's long-term development strategy and aims to enhance its competitive position in the semiconductor equipment industry [7][8]. - The projects funded by this issuance are closely related to the company's existing business, focusing on R&D and technological advancements [6][9]. Company’s Technological and Market Position - The company has established a strong presence in the semiconductor equipment sector, recognized for its advanced technologies and a comprehensive product line [11][10]. - The company has accumulated significant intellectual property, with 470 patents, enhancing its competitive edge [10]. Measures to Mitigate Dilution of Immediate Returns - The company plans to enhance its overall strength and expand its business scale post-issuance, improving risk resistance and market value [12]. - Internal management will be strengthened to reduce operational costs and improve efficiency [12]. - The company will accelerate the implementation of fundraising projects to achieve expected returns quickly [12][13]. Commitments from Management and Shareholders - The board and senior management have committed to fulfilling the measures to mitigate the dilution of immediate returns, ensuring the protection of shareholder interests [14].

Group 1 - The company held its 19th meeting of the second supervisory board, which was legally valid and attended by all three supervisors [1] - The supervisory board approved several proposals related to the issuance of A-shares to specific targets for the year 2024, with unanimous support from all supervisors [1][2] - The approved proposals include the conditions for issuing A-shares, adjustments to the issuance plan, and feasibility analyses regarding the use of raised funds, all receiving 100% approval [2] Group 2 - The company confirmed that the raised funds will be directed towards technology innovation, as outlined in the approved proposals [2]

盛美半导体设备（上海）股份有限公司 关于本次募集资金投向属于科技创新领域的说明 盛美半导体设备（上海）股份有限公司（以下简称"盛美上海"或"公司"）根 据《上市公司证券发行注册管理办法》（以下简称"《注册管理办法》"）等有关 规定，结合公司 2024 年度向特定对象发行 A 股股票（以下简称"本次发行"）方 案及实际情况，对本次发行募集资金投向是否属于科技创新领域进行了研究，制 定了《关于本次募集资金投向属于科技创新领域的说明》（以下简称"本说明"）。 除另有说明外，本专项说明中简称和术语的涵义与《盛美半导体设备（上海） 股份有限公司 2024 年度向特定对象发行 A 股股票预案》释义部分内容一致。 一、公司主营业务 公司主要从事对集成电路制造与先进晶圆级封装制造行业至关重要的半导 体清洗设备、半导体电镀设备、立式炉管系列设备、涂胶显影 Track 设备、等离 子体增强化学气相沉积 PECVD 设备、无应力抛光设备、后道先进封装设备以及 硅材料衬底制造工艺设备等的开发、制造和销售，并致力于为半导体制造商提供 定制化、高性能、低消耗的工艺解决方案，有效提升客户多个步骤的生产效率、 产品良率，并降低生产成本。 公 ...

盛美半导体设备（上海）股份有限公司 关于向特定对象发行 A 股股票预案及相关文件 修订情况说明的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 盛美半导体设备（上海）股份有限公司（以下简称"公司"）2024 年度向特 定对象发行 A 股股票相关议案已由第二届董事会第八次会议、2024 年第一次临 时股东大会、第二届董事会第十四次会议、第二届董事会第十六次会议、2025 年第一次临时股东大会审议通过。 公司根据最新情况，于 2025 年 5 月 20 日召开了第二届董事会第二十次会议， 审议通过了《关于公司 2024 年度向特定对象发行 A 股股票预案（二次修订稿） 的议案》《关于公司 2024 年度向特定对象发行 A 股股票方案论证分析报告（二次 修订稿）的议案》《关于公司 2024 年度向特定对象发行 A 股股票募集资金使用可 行性分析报告（二次修订稿）的议案》等相关议案。 本次拟对向特定对象发行股票预案及相关文件进行相应修订，除修订了本次 发行相关事项已履行和尚需履行的决策程序外，其他修订具体情况如下： 证券代码 ...

证券代码：688082 证券简称：盛美上海 公告编号：2025-035 盛美半导体设备（上海）股份有限公司 关于召开2024年年度股东大会的通知 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 一、 召开会议的基本情况 （一） 股东大会类型和届次 2024年年度股东大会 召开日期时间：2025 年 6 月 12 日 9 点 00 分 召开地点：中国（上海）自由贸易试验区临港新片区新元南路 388 号 （五） 网络投票的系统、起止日期和投票时间。 网络投票系统：上海证券交易所股东大会网络投票系统 网络投票起止时间：自2025 年 6 月 12 日 至2025 年 6 月 12 日 （七） 涉及公开征集股东投票权 无 二、 会议审议事项 本次股东大会审议议案及投票股东类型 | 序号 | 议案名称 | 投票股东类型 | | --- | --- | --- | | | | A 股股东 | | | 非累积投票议案 | | | 1 | 关于 2024 年年度报告及摘要的议案 | √ | | 2 | 关于 2024 年度董 ...

证券代码：688082 证券简称：盛美上海 公告编号：2025-030 盛美半导体设备（上海）股份有限公司 第二届监事会第十九次会议决议公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、监事会会议召开情况 2025年5月20日，盛美半导体设备（上海）股份有限公司（以下简称"公司"） 第二届监事会第十九次会议在中国（上海）自由贸易试验区丹桂路999弄B2栋会 议室举行。本次会议应出席监事3名，实际出席会议的监事3名。全体监事认可本 次会议的通知时间、议案内容等事项，会议的召开符合《中华人民共和国公司法》 《中华人民共和国证券法》等法律法规及《盛美半导体设备（上海）股份有限公 司章程》《盛美半导体设备（上海）股份有限公司监事会议事规则》的相关规定， 合法有效。 会议由监事会主席TRACY DONG LIU女士主持。 二、监事会会议审议情况 （一）审议通过《关于公司符合向特定对象发行 A 股股票条件的议案》 表决情况：3票赞成，占监事人数的100%；0票弃权；0票反对。 （二）审议通过《关于调整公司 2024 年度向特定 ...