北京市金杜律师事务所上海分所 关于盛美半导体设备（上海）股份有限公司 2024 年年度股东大会之法律意见书 致：盛美半导体设备（上海）股份有限公司 北京市金杜律师事务所上海分所（以下简称本所）接受盛美半导体设备（上 海）股份有限公司（以下简称公司）委托，根据《中华人民共和国证券法》（以 下简称《证券法》）、《中华人民共和国公司法》（以下简称《公司法》）、中国证券 监督管理委员会（以下简称中国证监会）《上市公司股东会规则》（以下简称《股 东会规则》）等中华人民共和国境内（以下简称中国境内，为本法律意见书之目 的，不包括中国香港特别行政区、中国澳门特别行政区和中国台湾省）现行有效 的法律、行政法规、规章和规范性文件和现行有效的公司章程有关规定，指派律 师出席了公司于 2025 年 6 月 12 日召开的 2024 年年度股东大会（以下简称本次 股东大会），并就本次股东大会相关事项出具本法律意见书。 为出具本法律意见书，本所律师审查了公司提供的以下文件，包括但不限于： 1. 经公司 2025 年第二次临时股东大会审议通过的《盛美半导体设备（上海） 股份有限公司章程》（以下简称《公司章程》）； 2. 公司第二届董事会 ...

Group 1 - The core point of the news is that Shengmei Shanghai has received approval from the Shanghai Stock Exchange for its plan to issue shares to specific investors, pending final approval from the China Securities Regulatory Commission (CSRC) [1] - The company plans to raise a total of up to 4.482 billion yuan, with net proceeds allocated primarily to R&D and process testing platform construction (922 million yuan), high-end semiconductor equipment iterative R&D (2.255 billion yuan), and working capital (1.304 billion yuan) [1] - Shengmei Shanghai has established a complete product matrix in front-end semiconductor equipment and has a unique competitive advantage in the global market due to its differentiated technology route [1] Group 2 - The management team indicated that the company is benefiting from the recovery of the global semiconductor industry and increased demand in the Chinese market, resulting in a sufficient order backlog [2] - The company expects its annual revenue for 2025 to be between 6.5 billion yuan and 7.1 billion yuan, with an average gross margin projected to remain between 42% and 48% [2] - The planned capital increase is expected to enhance Shengmei Shanghai's technological reserves in the semiconductor equipment sector and strengthen its competitiveness in the global market [2]

Group 1 - The core viewpoint of the articles highlights that Shengmei Semiconductor Equipment (Shanghai) Co., Ltd. is moving forward with a private placement of A-shares to raise up to 4.482 billion yuan for R&D and operational needs, marking its first refinancing since its listing in November 2021 [1][2] - The company plans to allocate approximately 922 million yuan for R&D and process testing platform construction, 2.255 billion yuan for high-end semiconductor equipment iterative R&D, and 1.304 billion yuan for working capital [1] - Shengmei Shanghai has developed advanced semiconductor manufacturing equipment and is recognized for its leading position in the domestic market, particularly in wet cleaning equipment [2][3] Group 2 - The company has shown stable growth in its performance over the past three years, with projected revenues for 2025 expected to be between 6.5 billion yuan and 7.1 billion yuan, and an average gross margin anticipated to remain between 42% and 48% [2] - The semiconductor equipment industry is characterized by rapid technological upgrades and high R&D investment, necessitating the company to enhance its R&D efforts through the private placement to keep pace with international competitors [2][3] - The global semiconductor equipment market is expanding rapidly, driven by demand from AI and automotive electronics, prompting domestic companies, including Shengmei Shanghai, to adopt platform development strategies to enhance competitiveness and market share [3]

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 盛美半导体设备（上海）股份有限公司（以下简称"公司"）于2025年6月6 日收到上海证券交易所出具的《关于盛美半导体设备（上海）股份有限公司向特 定对象发行股票的交易所审核意见》，具体意见如下： "盛美半导体设备（上海）股份有限公司向特定对象发行股票申请符合发行 条件、上市条件和信息披露要求。本所将在收到你公司申请文件后提交中国证监 会注册。" 公司本次向特定对象发行A股股票事项尚需获得中国证券监督管理委员会 （以下简称"中国证监会"）作出同意注册的决定后方可实施，最终能否获得中 国证监会同意注册的决定及其时间尚存在不确定性。公司将根据该事项的进展情 况及时履行信息披露义务，敬请广大投资者注意投资风险。 证券代码：688082 证券简称：盛美上海 公告编号：2025-037 盛美半导体设备（上海）股份有限公司 关于 2024 年度向特定对象发行 A 股股票申请收到上海 证券交易所审核意见通知的公告 特此公告。 盛美半导体设备（上海）股份有限公司 董事会 2025年6月7日 ...

Group 1 - The National Semiconductor Chip Index (980017) has shown a slight increase of 0.06% as of June 6, 2025, with notable gains from stocks such as Zhaoyi Innovation (603986) up by 4.75% and Geke Micro (688728) up by 1.45% [1] - The semiconductor ETF (159813) is experiencing mixed trading, with the latest quote at 0.78 yuan, reflecting a 0.26% increase [2] - Over the past nine trading days, there have been net inflows of funds on six days, totaling 108 million yuan, with an average daily net inflow of 12.05 million yuan [2] Group 2 - The "5th China Integrated Circuit Design Innovation Conference and IC Application Ecological Exhibition" (ICDIA) is scheduled for July 11-12, 2025, in Suzhou, focusing on themes such as AI computing, photonic integrated circuits, and 5G/6G semiconductors [3] - Shanghai Securities maintains a bullish outlook on the electronics sector, predicting a comprehensive recovery in the semiconductor industry by 2025, with an optimistic overall development outlook [3] - The semiconductor ETF closely tracks the National Semiconductor Chip Index, reflecting the market performance of listed companies in the semiconductor industry [3] Group 3 - As of May 30, 2025, the top ten weighted stocks in the National Semiconductor Chip Index account for 66.85% of the index, including companies like SMIC (688981) and Cambrian (688256) [4] - The semiconductor ETF has various connection options, including A, C, and I classes [4]

证券代码：688082 证券简称：盛美上海 公告编号：2025-036 盛美半导体设备（上海）股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2024/8/8 | | | --- | --- | --- | | 回购方案实施期限 | 2024 年 8 月 6 日~2025 年 | 8 月 5 日 | | 预计回购金额 | 5,000万元~10,000万元 | | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 □用于转换公司可转债 | | | | □为维护公司价值及股东权益 | | | 累计已回购股数 | 0万股 | | | 累计已回购股数占总股本比例 | 0% | | | 累计已回购金额 | 0万元 | | | 实际回购价格区间 | 0元/股~0元/股 | | 一、回购股份的基本情况 盛美半导体设备（上海）股份有限公司（以下简称"公司"）于2024年8月6 日召开第二届董事会第十二次会议及第二届监事会第 ...

证券代码：688082 证券简称：盛美上海 盛美半导体设备（上海）股份有限公司 2024 年年度股东大会会议资料 2025 年 6 月 盛美半导体设备（上海）股份有限公司 2024 年年度股东大会会议须知 七、主持人可安排公司董事、监事、高级管理人员回答股东所提问题。对于 可能将泄露公司商业秘密及/或内幕信息，损害公司、股东共同利益的提问，主 持人或其指定有关人员有权拒绝回答。 为维护全体股东的合法权利，确保股东大会的正常秩序和议事效率，保证大 会的顺利进行，根据《中华人民共和国公司法》《中华人民共和国证券法》《上市 公司股东会规则》以及《盛美半导体设备（上海）股份有限公司章程》《盛美半 导体设备（上海）股份有限公司股东大会议事规则》等相关规定，盛美半导体设 备（上海）股份有限公司（以下简称"公司"）特制定 2024 年年度股东大会会 议须知： 一、为确认出席大会的股东或其代理人或其他出席者的出席资格，会议工作 人员将对出席会议者的身份进行必要的核对工作，请被核对者予以配合。 二、为保证本次大会的严肃性和正常秩序，切实维护股东的合法权益，请出 席大会的股东或其代理人或其他出席者准时达到会场签到确认参会资格，在 ...

Investment Rating - The report does not explicitly provide an investment rating for the advanced packaging equipment industry. Core Insights - The advanced packaging technology aims to enhance chip performance, increase functional integration, reduce product size, and improve thermal management capabilities, driven by the demand for high-performance electronic products. The key to achieving these advanced packaging technologies lies in advanced packaging equipment [2]. Summary by Sections Semiconductor Packaging Equipment Industry Overview - Traditional packaging focuses on low cost and simple structures, while advanced packaging utilizes high-density interconnects, heterogeneous integration, and 3D stacking technologies to meet the demands of high-performance computing, 5G, and AI [16]. - The global semiconductor manufacturing equipment sales are projected to grow from $106.3 billion in 2023 to $117.1 billion in 2024, with advanced packaging driving an increase in the share of packaging equipment sales [21][22]. Required Semiconductor Equipment for Packaging Processes - Advanced packaging introduces new applications such as wafer thinning, RDL (Redistribution Layer) production, bump production, and TSV (Through-Silicon Via) production, necessitating both existing backend packaging equipment and new front-end equipment [9][27]. - The traditional backend packaging equipment must undergo technological upgrades to accommodate smaller sizes, higher integration, and more complex structures, focusing on precision, material compatibility, process control, and automation [32]. Advanced Packaging Equipment Analysis - The report highlights the need for various semiconductor equipment types, including thinning machines, dicing machines, and bonding machines, to support advanced packaging processes [35][45]. - The global thinning machine market is dominated by Japanese companies, with a concentration ratio of approximately 85%, while domestic companies like Huahai Qingke and Jing Sheng Machinery are emerging players [40][44]. Traditional Backend Equipment Upgrades and Manufacturers - Traditional backend packaging equipment requires upgrades to meet the demands of advanced packaging, focusing on precision enhancement, material compatibility, process control, and automation [32]. - Key domestic suppliers for thinning machines include Huahai Qingke, Jing Sheng Machinery, and China Electronics Technology Group [32].

Core Viewpoint - The Shanghai Guotou Company aims to deepen cooperation with Shengmei Semiconductor Equipment (Shanghai) Co., Ltd. in equipment research and development and industrial chain collaboration to enhance the autonomy and control of equipment in the semiconductor industry [1] Group 1 - The visit was led by Dai Minmin, the Deputy Secretary of the Party Committee and President of Shanghai Guotou Company [1] - The focus of the collaboration is to inject new momentum into building a world-class integrated circuit industry in Shanghai [1]

Investment Rating - The report indicates a cautious investment rating for major broad-based indices as of May 23, 2025, with the ChiNext Index classified as "safe" and other indices categorized as "moderate" [19][22]. Core Insights - The market experienced a contraction with major indices declining during the week of May 19-23, 2025. The report highlights a rapid rotation in themes, with precious metals and automotive sectors performing well. However, the "dividend + micro-cap" strategy showed signs of short-term adjustment after reaching a yearly high, suggesting a potential decline in trading preferences [12][13]. - The report emphasizes that liquidity easing and rising risk appetite are expected to drive a rebound in A-shares in the medium to long term, with "dividend + small-cap" combinations being the preferred allocation strategy post-adjustment [12]. Summary by Sections Market Review - Major indices saw declines: Shanghai Composite Index down 0.57%, SSE 50 down 0.18%, CSI 300 down 0.18%, CSI 500 down 1.10%, CSI 1000 down 1.29%, ChiNext Index down 0.88%, and North Star 50 down 3.68% [13][14]. Valuation Analysis - As of May 23, 2025, the ChiNext Index is in the "safe" valuation percentile, while other major indices are in the "moderate" range. In terms of sector valuation, industries such as construction materials, light industry manufacturing, power equipment and new energy, defense and military, computer, and comprehensive finance are classified as "dangerous," while non-ferrous metals, utilities, home appliances, food and beverage, agriculture, non-bank financials, and transportation are deemed "safe" [19][20]. Fund Flow Tracking - The report notes that institutional interest was highest for stocks like Huichuan Technology (352 institutions), Fuchuang Precision (109), Bozhong Precision (106), Boshi Software (102), and Shengmei Shanghai (101) during the week [51]. - Southbound capital saw a net inflow of 18.96 billion HKD, with the Shanghai-Hong Kong Stock Connect contributing 19.05 billion HKD and the Shenzhen-Hong Kong Stock Connect experiencing a net outflow of 0.97 billion HKD [3]. Sector Performance - The top five performing sectors this week were comprehensive, pharmaceuticals, automotive, non-ferrous metals, and home appliances, while the worst performers included comprehensive finance, computers, electronics, machinery, and communications [15]. Institutional Research - A total of 379 institutional research activities were recorded, with the majority focused on companies listed in Shenzhen and Shanghai. The report highlights that specific object research and other types accounted for 78.36% and 8.71% of the total, respectively [42][46].