近期利扬芯片(688135)发布2025年一季报，证券之星财报模型分析如下： 利润与收入 利扬芯片(688135)在2025年一季度实现了营业总收入1.3亿元，同比上升11.22%。然而，公司的盈利能力 显著下滑，归母净利润录得-758.45万元，同比下降2340.63%，扣非净利润为-748.57万元，同比下降 705.24%。这表明公司在增加收入的同时，并未有效转化为利润。 盈利能力 资产负债情况 截至2025年一季度末，公司的货币资金为3.17亿元，同比增加了231.91%；有息负债为12.04亿元，同比 增加了55.26%。有息资产负债率已达44.94%，建议投资者关注公司的债务状况。 应收账款 公司的应收账款为1.63亿元，同比增加了10.41%。考虑到一季度归母净利润为负，应收账款的回收情况 值得关注。 每股指标 每股净资产为5.24元，同比减少了6.87%；每股经营性现金流为0.22元，同比减少了22.42%；每股收益 为-0.04元。 商业模式与融资分红 从盈利能力来看，公司的毛利率为22.78%，同比减少了13.51个百分点；净利率为-5.33%，同比减少了 854.33个百分点。这反映出公 ...

Group 1 - The company has approved the proposal for the provision of asset impairment reserves for the year 2024, which complies with accounting standards and reflects the financial status and operating results as of December 31, 2024 [21][22][23] - The board of directors has also approved the proposal to convene the 2024 annual general meeting of shareholders, with unanimous support from the board members [3][2] Group 2 - The supervisory board held its eighth meeting on April 29, 2025, where all members were present, and the meeting was conducted in accordance with legal and regulatory requirements [6] - The supervisory board approved the 2024 annual report and its summary, ensuring that the report accurately reflects the company's financial status and operating results [7][9] - The supervisory board also approved the 2024 work report, confirming that it has conducted due diligence on the company's operations and decisions [10][11] - The board approved the special report on the use of raised funds for 2024, confirming compliance with relevant regulations and proper usage of funds [12][13] - The internal control evaluation report for 2024 was approved, indicating that the company has established effective internal control systems [14][15] - The financial settlement report for 2024 was approved, reflecting the company's financial condition and operating results accurately [16][17] - The profit distribution plan for 2024 was approved, considering the company's profitability and cash flow [18][19] Group 3 - The company plans to apply for a comprehensive credit limit of up to RMB 2 billion (or equivalent foreign currency) for 2025, which will be used to support the business development of the company and its subsidiaries [24][28] - The company will provide guarantees for its wholly-owned subsidiaries, with the total guarantee amount also not exceeding RMB 2 billion [19][30] - The board of directors has recommended that the shareholders' meeting approve the comprehensive credit application and guarantee proposal [38][39] Group 4 - The company will hold an investor briefing on May 19, 2025, to discuss the 2024 annual results and the first quarter of 2025, allowing for interactive communication with investors [42][43] - Investors can submit questions in advance from May 12 to May 16, 2025, and participate in the online meeting [40][45]

Core Viewpoint - The company, Guangdong Liyang Chip Testing Co., Ltd., reported a negative net profit for 2024 and will not distribute profits or dividends, focusing on sustainable development and future funding needs [4]. Company Overview - Liyang Chip is a well-known independent third-party professional testing service provider in China, specializing in integrated circuit testing solutions, including 12-inch and 8-inch wafer testing services, and chip finished product testing [7][8]. - The company has developed 44 categories of chip testing solutions and completed mass testing for thousands of chip models, accumulating a vast database of testing data [30][31]. Business Operations - The company has expanded its services to include wafer thinning, polishing, laser grooving, and laser dicing, enhancing its technical service offerings to meet comprehensive wafer cutting needs [6][11]. - Liyang Chip's testing services are crucial in the integrated circuit industry, ensuring that every chip undergoes 100% testing to verify compliance with design specifications [8][9]. Industry Position - The integrated circuit testing industry is characterized by high capital intensity and knowledge requirements, with significant barriers to entry due to the need for advanced testing platforms and skilled personnel [26][27]. - The industry is experiencing a shift towards specialization, with increasing pressure on traditional IDM (Integrated Device Manufacturer) models, favoring Fabless companies that outsource manufacturing and testing [38][39]. Future Development Trends - The company aims to strengthen its position in emerging fields such as automotive electronics, industrial control, high-performance computing, and sensor technologies, responding to the growing demand for independent third-party testing services [33][34]. - The integrated circuit testing sector is expected to grow as the complexity of chips increases, necessitating more sophisticated testing solutions to meet stringent quality and performance standards [25][29].

Core Viewpoint - The company has reported its Q1 2025 financial results, indicating temporary profit pressure but highlighting underlying growth potential driven by a fixed cost structure primarily based on depreciation and amortization, with revenue showing both year-on-year and quarter-on-quarter growth, signaling an inflection point in income and the imminent release of scale effects [1] Group 1: Business Strategy and Focus - The company is focusing on its core business of integrated circuit testing, with a strategic layout described as "one body, two wings," emphasizing independent third-party wafer testing and chip product testing as the mainstay, while also expanding into wafer laser grooving, dicing, thinning, and ultra-wide spectrum layered image sensor chips for applications in autonomous driving and robotics [1] - The company aims to establish itself as a leading independent third-party professional testing service provider in China, driven by technological innovation and unique testing solutions across various fields including high computing power, industrial control, automotive electronics, sensors, AIoT, consumer electronics, storage, and specialty chips [1] Group 2: Technological Advancements - The company possesses industry-leading ultra-thin chip thinning technology capable of processing below 25μm, and its laser grooving and dicing technologies address quality issues in traditional cutting methods, enhancing chip yield and reliability [2] - The company collaborates with Shanghai Dielong Optoelectronics Technology Co., Ltd. to provide unique wafer heterogeneous stacking and testing services, leveraging core technologies in all-weather ultra-wide spectrum layered image sensor chips to improve recognition rates under complex weather and lighting conditions, thus enhancing safety in autonomous driving applications [2] Group 3: Market Expansion and Innovation - The company is actively expanding its relationships with well-known design enterprises and utilizing big data analysis tools to maintain existing customers, which is expected to increase future revenue and enhance overall profitability [3] - The company is embracing technological innovation, focusing on building an intelligent algorithm training system with independent intellectual property rights, integrating cutting-edge general model technology to drive research and development innovation [3] Group 4: Future Projects and Market Opportunities - The company is developing various testing solutions for high-pixel CMOS image sensors, high-performance robotic vision processing chips, AI computing power chips, high-bandwidth RF chip testing, and more, targeting high-demand markets such as automotive electronics, high computing power chips, sensors, and storage [4] - The company’s proactive positioning in high-barrier technology fields is expected to capture industry growth dividends, with ongoing business expansion and revenue growth anticipated to lead to profit recovery and performance breakthroughs in the future [4]

广东利扬芯片测试股份有限公司 2024 年度独立董事述职报告（郭群） 2024 年，我本人作为广东利扬芯片测试股份有限公司（以下简称"公司"） 的独立董事，根据《中华人民共和国公司法》（以下简称"《公司法》"）《中 华人民共和国证券法》（以下简称"《证券法》"）《上市公司独立董事管理 办法》等有关法律、法规、规范性文件以及《公司章程》《独立董事工作制度》 《独立董事专门会议制度》等规定和要求，秉承客观、独立、公正的立场，忠 实勤勉，独立地履行职责，积极出席公司各项会议，独立自主决策，认真审议 公司重大事项，并发表审慎、客观的独立意见，充分发挥了独立董事及各专门 委员会的作用，切实维护公司及全体股东特别是中小股东合法权益，促进规范 运作。现将本人 2024 年度的工作情况汇报如下： 一、独立董事的基本情况 （一）个人工作履历、专业背景以及兼职情况 郭群，女，1964 年 11 月出生，中国国籍，无境外永久居留权，毕业于中山 大学会计专业，硕士研究生学历，副教授。1994 年 9 月至 2021 年 8 月，任职于 中山大学管理学院，任副教授；2018 年 6 月至 2024 年 6 月，任广州市康硕家居 用品有 ...

广东利扬芯片测试股份有限公司 2024 年，我本人作为广东利扬芯片测试股份有限公司（以下简称"公司"） 的独立董事，根据《中华人民共和国公司法》（以下简称"《公司法》"）《中 华人民共和国证券法》（以下简称"《证券法》"）《上市公司独立董事管理办 法》等有关法律、法规、规范性文件以及《公司章程》《独立董事工作制度》《独 立董事专门会议制度》等规定和要求，秉承客观、独立、公正的立场，忠实勤勉， 独立地履行职责，积极出席公司各项会议，独立自主决策，认真审议公司重大事 项，并发表审慎、客观的独立意见，充分发挥了独立董事及各专门委员会的作用， 切实维护公司及全体股东特别是中小股东合法权益，促进规范运作。现将本人 2024 年度的工作情况汇报如下： 一、独立董事的基本情况 （一）个人工作履历、专业背景以及兼职情况 游海龙，男，1979 年 6 月出生，中国国籍，无境外永久居留权，毕业于西 安电子科技大学微电子学与固体电子学专业，博士研究生学历，教授。2007 年 6 月至今，任职于西安电子科技大学微电子学院，先后担任讲师、副教授、教授。 2010 年 9 月至 2011 年 9 月任职于美国佐治亚理工学院工业与系统工程 ...

广东利扬芯片测试股份有限公司 2024 年度独立董事述职报告（郑文） 2024 年，我本人作为广东利扬芯片测试股份有限公司（以下简称"公司"） 的独立董事，根据《中华人民共和国公司法》（以下简称"《公司法》"）《中 华人民共和国证券法》（以下简称"《证券法》"）《上市公司独立董事管理办 法》等有关法律、法规、规范性文件以及《公司章程》《独立董事工作制度》《独 立董事专门会议制度》等规定和要求，秉承客观、独立、公正的立场，忠实勤勉， 独立地履行职责，积极出席公司各项会议，独立自主决策，认真审议公司重大事 项，并发表审慎、客观的独立意见，充分发挥了独立董事及各专门委员会的作用， 切实维护公司及全体股东特别是中小股东合法权益，促进规范运作。现将本人 2024 年度的工作情况汇报如下： 一、独立董事的基本情况 （一）个人工作履历、专业背景以及兼职情况 郑文，男，1966 年 9 月出生，中国国籍，无境外永久居留权，毕业于西安 交通大学机械制造专业，博士研究生学历，副教授。1991 年 9 月至今，任职于 广州大学，任副教授。2020 年 2 月至今任公司独立董事、薪酬与考核委员会主 任委员、审计委员会委员。 （二）独 ...

广发证券股份有限公司 关于广东利扬芯片测试股份有限公司 2024 年度募集资金存放与使用情况的专项核查报告 广发证券股份有限公司（以下简称"广发证券"）作为广东利扬芯片测试 股份有限公司（以下简称"利扬芯片"或"公司"）的持续督导机构，根据《证 券发行上市保荐业务管理办法》《上海证券交易所科创板上市公司自律监管指 引第 1 号——规范运作》《上市公司监管指引第 2 号——上市公司募集资金管 理和使用的监管要求》《上海证券交易所科创板股票上市规则》等有关法律法 规和规范性文件的要求，就利扬芯片 2024 年度募集资金存放与使用情况进行了 核查，发表意见如下： 一、募集资金基本情况 （一）实际募集资金金额和资金到账时间 根据中国证券监督管理委员会出具的《关于同意广东利扬芯片测试股份有 限公司向不特定对象发行可转换公司债券注册的批复》（证监许可〔2024〕266 号），公司获准向不特定对象发行面值总额为人民币 52,000.00 万元的可转换公 司债券，期限 6 年。公司本次发行可转换公司债券应募集资金 52,000.00 万元， 实际募集资金 52,000.00 万元，扣除保荐及承销费、审计及验资费、律师费、资 ...

| 证券代码：688135 | 证券简称：利扬芯片 | 公告编号：2025-024 | | --- | --- | --- | | 证券代码：118048 | 转债简称：利扬转债 | | 广东利扬芯片测试股份有限公司 2024 年度募集资金存放与实际使用情况的专项报告 本公司董事会及全体董事保证公告内容不存在虚假记载、误导性陈述或者重 大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带法律责任。 （一）募集资金金额和资金到账时间 根据中国证券监督管理委员会出具的《关于同意广东利扬芯片测试股份有限 公司向不特定对象发行可转换公司债券注册的批复》（证监许可〔2024〕266 号）， 广东利扬芯片测试股份有限公司（以下简称"公司"）获准向不特定对象发行面 值总额为人民币 52,000.00 万元的可转换公司债券，期限 6 年。公司本次发行可 转换公司债券应募集资金 52,000.00 万元，实际募集资金 52,000.00 万元，扣除 保荐及承销费、审计及验资费、律师费、资信评级费、信息披露及证券登记费等 其他发行费用合计(不含税)人民币 7,110,905.68 元后，实际募集资金净额为人 民币 512,8 ...

证券代码：688135 证券简称：利扬芯片 公告编号：2025-022 证券代码：118048 转债简称：利扬转债 广东利扬芯片测试股份有限公司 关于 2025 年度公司及子公司申请综合授信额度 并提供担保的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 重要内容提示： 2025 年度公司及全资子公司拟向银行、其他金融机构申请总额度不超过 人民币 20.00 亿元（或等值外币）的综合授信额度。 被担保人均为广东利扬芯片测试股份有限公司（以下简称"公司"）的 全资子公司，即上海利扬创芯片测试有限公司（以下简称"上海利扬"）、东莞 利扬芯片测试有限公司（以下简称"东莞利扬"）及利阳芯（东莞）微电子有限 公司（以下简称"利阳芯"）。 公司及子公司拟向银行及其他金融机构申请总计不超过人民币 20.00 亿 元（或等值外币）的综合授信融资额度，并为全资子公司提供不超过人民币 20.00 亿元（或等值外币）的担保额度，截至本公告披露日，公司对外担保余额为 52,474.51 万元，均为公司对子公司连带责任担保，未发生对外担保逾 ...