证券代码：688352 证券简称：颀中科技 公告编号：2025-045 合肥颀中科技股份有限公司 第二届监事会第六次会议决议公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、监事会会议召开情况 合肥颀中科技股份有限公司（以下简称"公司"）第二届监事会第六次会 议通知于 2025 年 8 月 11 日以通讯和邮件方式发出，于 2025 年 8 月 21 日以现 场及通讯相结合的方式召开。会议由监事会主席杨国庆女士主持，本次会议应 出席监事 3 人，实际出席监事 3 人。本次会议的召集、召开方式符合《中华人 民共和国公司法》（以下简称"《公司法》"）《合肥颀中科技股份有限公司章程》 及《合肥颀中科技股份有限公司监事会议事规则》的相关规定，会议决议合法 有效。 二、监事会会议审议情况 （三）会议审议通过了《关于公司 2025 年半年度利润分配预案的议案》 表决结果：同意 3 票，反对 0 票，弃权 0 票。 本次会议审议表决，通过了相关议案，形成决议如下： （一）会议审议通过了《关于公司 2025 年半年度报告全文及摘要 ...

合肥颀中科技股份有限公司监事会 关于公司 2024 年限制性股票激励计划（草案二次修订稿） 的核查意见 合肥颀中科技股份有限公司（以下简称"公司"）监事会依据《中华人民共 和国公司法》（以下简称"《公司法》"）、《中华人民共和国证券法》（以下简称"《证 券法》"）、《上市公司股权激励管理办法》（以下简称"《管理办法》"）、《上海证券 交易所科创板股票上市规则》（以下简称"《上市规则》"）、《科创板上市公司自律 监管指南第 4 号——股权激励信息披露》（以下简称"《自律监管指南》"）等相关 法律、法规及规范性文件和《合肥颀中科技股份有限公司章程》（以下简称"《公 司章程》"）的有关规定，对《合肥颀中科技股份有限公司 2024 年限制性股票激 励计划（草案二次修订稿）》（以下简称"《激励计划（草案二次修订稿）》"或"本 激励计划"）进行了核查，发表核查意见如下： 1、公司不存在《管理办法》规定的不得实行股权激励的情形，包括：（1） 最近一个会计年度财务会计报告被注册会计师出具否定意见或者无法表示意见 的审计报告；（2）最近一个会计年度财务报告内部控制被注册会计师出具否定意 见或无法表示意见的审计报告；（3）上市后 ...

证券代码：688352 证券简称：颀中科技 公告编号：2025-044 合肥颀中科技股份有限公司（以下简称"公司"）第二届董事会第六次会 议通知于 2025 年 8 月 11 日以通讯和邮件方式发出，于 2025 年 8 月 21 日以现 场及通讯相结合的方式召开。会议由董事长陈小蓓女士召集和主持，本次会议 应出席董事 9 人，实际出席董事 9 人。本次会议的召集、召开方式符合《中华 人民共和国公司法》（以下简称"《公司法》"）《合肥颀中科技股份有限公司章 程》（以下简称"《公司章程》"）《合肥颀中科技股份有限公司董事会议事规则》 的相关规定，会议决议合法有效。 合肥颀中科技股份有限公司 二、董事会会议审议情况 第二届董事会第六次会议决议公告 本次会议审议表决，通过了相关议案，形成决议如下： 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、董事会会议召开情况 表决结果：同意 9 票，反对 0 票，弃权 0 票。 （一）会议审议通过了《关于公司2025年半年度报告全文及摘要的议案》 本议案已经公司第二届董事会审计委员会第 ...

在实施权益分派的股权登记日前合肥颀中科技股份有限公司（以下简称 "公司"）总股本发生变动的，拟维持分配总额不变，相应调整每股分配比例，并 将另行公告具体调整情况。 本事项已经第二届董事会第六次会议及第二届监事会第六次会议审议 通过，尚需提交公司 2025 年第一次临时股东大会审议。 证券代码：688352 证券简称：颀中科技 公告编号：2025-038 合肥颀中科技股份有限公司 2025 年半年度利润分配预案的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 每股分配比例：每 10 股派发现金红利 0.5 元（含税），不送红股，不以 公积金转增股本。 本次利润分配以实施权益分派股权登记日登记的总股本为基数，具体日 期将在权益分派实施公告中明确。 一、利润分配预案内容 截至 2025 年 6 月 30 日，公司合并报表未分配利润为人民币 1,285,034,312.33 元，母公司报表未分配利润为人民币 144,178,832.49 元。经公司第二届董事会第 六次会议决议，同意公司 2025 年半年度拟以 ...

合肥颀中科技股份有限公司2025 年半年度报告 二、 重大风险提示 公司已在本报告中详细阐述公司在生产经营过程中可能面临的各种风险，敬请查阅本报告"第 三节管理层讨论与分析"之"四、风险因素"。 三、 公司全体董事出席董事会会议。 四、 本半年度报告未经审计。 公司代码：688352 公司简称：颀中科技 合肥颀中科技股份有限公司 2025 年半年度报告 1 / 187 合肥颀中科技股份有限公司2025 年半年度报告 重要提示 一、 本公司董事会、监事会及董事、监事、高级管理人员保证半年度报告内容的真实性、准确 性、完整性，不存在虚假记载、误导性陈述或重大遗漏，并承担个别和连带的法律责任。 五、 公司负责人杨宗铭、主管会计工作负责人余成强及会计机构负责人（会计主管人员）王媛 媛声明：保证半年度报告中财务报告的真实、准确、完整。 六、 董事会决议通过的本报告期利润分配预案或公积金转增股本预案 公司2025年半年度利润分配预案为：公司拟以实施权益分派股权登记日登记的总股本扣减公 司回购专用证券账户中的股份为基数，向全体股东每10股派发现金红利0.5元（含税）。截至2025 年7月31日，公司总股本为1,189,03 ...

Core Viewpoint - The company, Hefei Qizhong Technology Co., Ltd., is a leading provider of advanced packaging and testing services for integrated circuits, maintaining a strong position in the industry through technological leadership and a solid customer base [1] Industry Overview - The display driver industry chain is shifting to mainland China, leading to rapid growth in domestic packaging and testing demand. In 2020, the market size for display driver chip packaging in mainland China reached 4.68 billion yuan, with a CAGR of 16% from 2016 to 2020 [2] - The penetration of AMOLED technology in smartphones, wearables, and tablets is driving incremental demand. The global AMOLED penetration rate is expected to rise from 18% in 2017 to 41% by 2024 [2] Company Positioning - The company offers comprehensive packaging services across various processes, including gold bump manufacturing and COG/COP/COF packaging, and has established a strong customer base including leading firms like Novatek and Etron Technology. The company is well-positioned to benefit from the domesticization trend in the industry [3] - The company is strategically targeting the high-growth AMOLED DDIC packaging segment, with projections indicating that revenue from AMOLED products will account for 20% of total revenue by 2024 [3] Non-Display Business Development - The company's non-display packaging services focus on power management and RF front-end chips, providing a complete solution for wafer-level chip-scale packaging. The projected revenue from non-display chip packaging is approximately 150 million yuan in 2024, reflecting a year-on-year growth of about 17% [4] Financial Projections - The company is expected to achieve revenues of 2.253 billion, 2.686 billion, and 3.042 billion yuan in 2025, 2026, and 2027, respectively, with corresponding net profits of 310 million, 410 million, and 520 million yuan. The projected EPS for these years are 0.26, 0.34, and 0.44 yuan, with PE ratios of 43.65, 33.54, and 26.21 based on the closing price on August 8, 2025 [5]

华安证券8月12日发布研报称，给予颀中科技（688352.SH，最新价：11.91元）买入评级。评级理由主 要包括：1）显示封测龙头地位稳固，技术领先构筑护城河；2）国产化浪潮+AMOLED渗透双轮驱动， 显示封测业务有望持续高增；3）发力非显示类先进封装，构筑第二增长曲线。风险提示：若产品开发 及技术迭代不及预期，或引发市场同质化竞争加剧，导致毛利率持续下滑风险；募投项目建设不及预期 风险；下游需求不及预期风险；新增固定资产折旧导致利润阶段性下滑风险；存货跌价风险及商誉减值 风险。 （文章来源：每日经济新闻） ...

Market Overview - The Shanghai Composite Index closed at 3608.33 points, above the annual line, with an increase of 0.70% [1] - The total trading volume of A-shares reached 1,290.701 billion yuan [1] Stocks Breaking Annual Line - A total of 40 A-shares have surpassed the annual line today, with notable stocks including: - Datang Telecom (4.33% deviation) - Xinquan Co., Ltd. (3.26% deviation) - Galaxy Electronics (3.20% deviation) [1] - Stocks with smaller deviations that just crossed the annual line include: - Huatech (0.00% deviation) - Huaxing Yuanchuang (0.00% deviation) - Guizhou Gas (0.00% deviation) [1] Top Performers - Datang Telecom: Increased by 5.18% with a turnover rate of 4.64% [1] - Xinquan Co., Ltd.: Increased by 10.00% with a turnover rate of 2.69% [1] - Galaxy Electronics: Increased by 7.30% with a turnover rate of 20.12% [1] Additional Notable Stocks - Other stocks with significant performance include: - Huafu Fashion: 3.71% increase, 2.87% turnover [1] - Xingrui Technology: 5.72% increase, 3.77% turnover [1] - China Shipbuilding: 2.79% increase, 1.75% turnover [1]

Core Viewpoint - Hefei Chipmore Technology Co., Ltd. is issuing convertible bonds to unspecified investors, with a focus on meeting the suitability requirements for investors in the Sci-Tech Innovation Board [1][2]. Group 1: Convertible Bond Issuance - The company is issuing convertible bonds with redemption clauses, including maturity redemption and conditional redemption, with the redemption price determined by the board based on market conditions [2][3]. - The company has set a credit rating of "AA+" for the bonds, with a stable outlook, as assessed by Dongfang Jincheng [3][4]. Group 2: Risks and Considerations - Investors who do not meet the suitability requirements may face risks, including the inability to convert bonds into shares and potential losses if redemption prices are lower than the acquisition cost [2][3]. - The company has not provided guarantees for the bonds, which may lead to repayment risks if significant negative events affect its operational management and debt repayment capabilities [3][4]. Group 3: Business Development and Market Position - The company has been expanding its non-display advanced packaging technology since 2015, but its overall scale remains relatively small compared to leading competitors in the industry [6][7]. - The company faces risks from intensified market competition, particularly in the advanced packaging sector, where larger firms are actively investing [6][7]. Group 4: Fund Utilization and Project Risks - The funds raised will be used for projects including high-pin-count micro-sized bump packaging and advanced power and flip-chip packaging technology upgrades, which are expected to enhance the company's core competitiveness [7][8]. - There are risks associated with project implementation, including potential delays, market changes, and the possibility of not achieving expected profitability from the new projects [8][9]. Group 5: Measures to Mitigate Immediate Return Dilution - The company plans to implement various measures to protect investors' interests and mitigate the dilution of immediate returns from the bond issuance [10][11]. - The company has committed to strict governance and management practices to ensure effective use of raised funds and to enhance its profitability and core competitiveness [10][11].

Core Viewpoint - Hefei Qizhong Technology Co., Ltd. is applying for the issuance of convertible bonds to raise funds for specific projects, including advanced packaging and testing technology upgrades, which align with the company's strategic growth in the semiconductor industry [1][2][3]. Group 1: Fundraising and Project Overview - The funds raised will be used for two main projects: the high-footprint micro-sized bump packaging and testing project, and the advanced power and flip-chip packaging technology upgrade project [2][3]. - The total planned investment for the advanced power and flip-chip packaging technology upgrade project is approximately 851.11 million yuan, with 850 million yuan sourced from the raised funds [4][5]. - Previous fundraising projects included the advanced packaging testing production base project and high-density micro-sized bump packaging technology upgrades, which have been completed [4][32]. Group 2: Market Trends and Demand - The global display driver chip packaging market is expected to grow significantly, with a projected market size of 3.24 billion USD by 2028, driven by increasing demand for high-performance display technologies [19][20]. - The demand for advanced packaging solutions is rising due to the shift towards cost-effective materials like copper-nickel-gold bumps, which are gaining traction in high-end applications such as AMOLED displays [19][20]. - The Chinese mainland's display driver chip market is projected to reach 44.1 billion yuan in 2024, reflecting a growth rate of 13.4% year-on-year, indicating a robust demand for display technologies [27][28]. Group 3: Company Positioning and Strategy - Hefei Qizhong Technology has established itself as a leading provider of advanced packaging and testing services, particularly in the display driver chip sector, where it ranks among the top three globally [7][8]. - The company aims to enhance its service capabilities and market competitiveness through the implementation of the new projects, which are aligned with industry trends and customer demands [16][24]. - The focus on non-display chip packaging is part of a broader strategy to diversify and strengthen the company's market position in the semiconductor industry [9][24].