证券代码：688362 证券简称：甬矽电子 甬矽电子（宁波）股份有限公司投资者关系活动记录表 ☑特定对象调研 □分析师会议 投资者关系 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 活动类别 □现场参观 R其他 （电话会议） 参与单位名 万家基金、长城基金 称及人员姓 名 时间 2024年4月22日 地点 电话会议 上市公司接 董事会秘书李大林先生 ...

投资评级 增持-A(维持) 股价(2024-04-23) 18.19 元 总市值（百万元） 7,415.34 总股本（百万股） 407.66 12 个月价格区间 41.30/16.86 甬矽电子（688362.SH） 公司快报 投资要点 公司主要产品封装产量 35.79 亿颗，同比增长 33.06%；销售量 35.72 亿颗，同比 增长 31.44%，主要系市场开拓及部分客户需求增长所致，销售量与生产量较 2022 年均有所增加。2023 年公司共有 11 家客户销售额超过 1 亿元，14 家客户（含前 述 11 家客户）销售额超过 5,000 万元，客户结构持续优化。受外部经济环境及行 业周期波动影响，全球终端市场需求依旧较为疲软，下游需求复苏不及预期，公司 所处封测环节亦受到一定影响。根据 WSTS 数据，2023 年全球半导体市场规模估 一年股价表现 计为 5,201 亿美元，同比下降 9.4%。2023 年公司稼动率整体呈稳定回升趋势，营 业收入规模逐季上升，全年实现营业收入 23.91 亿元，同比增长 9.82%，其中 23Q4 实现营业收入 7.60 亿元，环比增长 17.28%，同比增长 64. ...

证券代码：688362 证券简称：甬矽电子 甬矽电子（宁波）股份有限公司投资者关系活动记录表 ☑特定对象调研 □分析师会议 投资者关系活动 □媒体采访 ☑业绩说明会 □新闻发布会 □路演活动 类别 □现场参观 £其他 （电话会议） 参与单位名称及 详见附件《参会人员名单》 人员姓名 时间 2024年4月19日 地点 公司会议室 上市公司接待人 董事、CTO徐玉鹏先生；副总经理、财务总监金良凯先生； 副总经理、董事会秘书李大林先生 员姓名 ...

证券代码：688362 证券简称：甬矽电子 同时，客户基于多种考虑在寻求供应链本土化，公司在发展 的过程中与台湾地区的头部客户也存在业务合作。从商务角 度来说，在技术水平接近的情况下，公司无论在成本、交 期、服务、稳定性等方面都具有一定的竞争优势。 4.公司去年主要资本开支集中在什么地方？今年的资本 开支计划是什么样的？ 去年 公 司 主 要 投 资 于厂房和 设 备 ， 应 用 于 Pamid 模 甬矽电子（宁波）股份有限公司投资者关系活动记录表 | 投资者关系活动 | ☑特定对象调研 □分析师会议 | | --- | --- | | | □媒体采访 ☑业绩说明会 | | 类别 | □新闻发布会 □路演活动 | | | □现场参观 | | | £其他 （电话会议） | | 参与单位名称及 | 详见附件《参会人员名单》 | | 人员姓名 | | | 时间 | 2024 年 4 月 19 日 | | 地点 | 公司会议室 | | 上市公司接待人 | 董事、CTO 徐玉鹏先生；副总经理、财务总监金良凯先生； | | | 副总经理、董事会秘书李大林先生 | | 员姓名 | | | 投资者关系活动 | 1.公司今年 ...

分析师声明 本报告署名分析师声明，本人具有中国证券业协会授予的证券投资咨询执业资格，勤勉尽 责、诚实守信。本人对本报告的内容和观点负责，保证信息来源合法合规、研究方法专业 审慎、研究观点独立公正、分析结论具有合理依据，特此声明。 本公司具备证券投资咨询业务资格的说明 国投证券股份有限公司（以下简称"本公司"）经中国证券监督管理委员会核准，取得证券 投资咨询业务许可。本公司及其投资咨询人员可以为证券投资人或客户提供证券投资分 析、预测或者建议等直接或间接的有偿咨询服务。发布证券研究报告，是证券投资咨询业 务的一种基本形式，本公司可以对证券及证券相关产品的价值、市场走势或者相关影响因 素进行分析，形成证券估值、投资评级等投资分析意见，制作证券研究报告，并向本公司 的客户发布。 本报告版权属于国投证券股份有限公司，各项声明请参见报告尾页。 4 公司快报/甬矽电子 免责声明 本报告仅供国投证券股份有限公司（以下简称"本公司"）的客户使用。本公司不会因为任 何机构或个人接收到本报告而视其为本公司的当然客户。 本报告基于已公开的资料或信息撰写，但本公司不保证该等信息及资料的完整性、准确性。 本报告所载的信息、资料、建议及 ...

欢迎接入永熙电子2023年度及2024年第一季度业绩说明会您已成功加入会议感谢大家参加本次会议会议即将开始请稍后 感谢大家参加本次会议会议即将开始请稍后 感谢大家参加本次会议会议即将开始请稍后各位同学大家下午好欢迎参加勇气电子2023年度及2024年第一季度业绩说明会目前所有参会者均处于静音状态下面开始播报声明本次会议仅服务于邀请参会的广大投资者会议音频及文字记录的内容仅供参会者内部使用不得公开发布 勇气电子未授权任何媒体转发本次会议相关内容未经允许授权的转载转发军事侵权勇气电子将保留追究其法律责任的权利勇气电子不承担因转载转发而产生的任何损失和责任市场有风险投资需谨慎提醒广大投资者只能做出投资决策 在会议开始前我们提示各位投资者在主讲嘉宾发言结束后将留有提问时间首先介绍今天出席本次交流会的公司领导他们是公司董事GPO徐玉鹏徐总副总经理财务总监建良凯金总副总经理董事会秘书李大林李总各位投资者大家好下面有请公司领导发言谢谢 尊敬的各位投资人和各位分析师朋友大家好首先非常感谢大家的时间也感谢大家对永熙的关注和支持首先我借这个机会向大家就我们整体23年和今年20年一季度的经营情况做一个简要的汇报汇报之后如果有任何问 ...

证券代码：688362 证券简称：甬矽电子 公告编号：2024-030 甬矽电子（宁波）股份有限公司 关于召开 2023 年度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 会议召开时间：2024 年 04 月 29 日(星期一) 下午 14:00-15:00 会议召开地点：上海证券交易所上证路演中心（网址： https://roadshow.sseinfo.com/） 会议召开方式：上证路演中心网络互动 （二） 会议召开地点：上证路演中心 （三） 会议召开方式：上证路演中心网络互动 三、 参加人员 董事长/总经理：王顺波先生 董事会秘书：李大林先生 投资者可于 2024 年 04 月 22 日(星期一) 至 04 月 26 日(星期 五)16:00 前登录上证路演中心网站首页点击"提问预征集"栏目或 通过公司邮箱 zhengquanbu@forehope-elec.com 进行提问。公司将在 说明会上对投资者普遍关注的问题进行回答。 甬矽电子（宁波）股份有限公司（以下简称"公司"）已于 ...

Company and Industry Overview * **Company**: Yungxi Semiconductor * **Industry**: Semiconductor packaging and testing * **Focus**: High-end advanced packaging solutions Key Points Revenue and Profitability * **2023**: Revenue of approximately 2.4 billion RMB, up 10% year-on-year. Net profit declined due to increased investment in construction and personnel expansion. * **Q1 2024**: Revenue of 720 million RMB, up over 70% year-on-year. Profitability improved due to scale effects and product mix changes. * **2024 Outlook**: Targeting revenue growth of over 50% compared to 2022, aiming for 3.3 billion RMB. Customer Structure and Market Segments * **Main Customers**: Consumer electronics, IoT, automotive electronics, and computing. * **Market Segments**: IoT (50%), PA (20%), security (10-15%), and others (10-20%). * **Growth Drivers**: Expansion of customer base, especially in new large customers and vertical integration solutions. Product Development and Technology * **Product Lines**: Wafer-level packaging, bumping, CSP, WLCSP, FCBGA, and automotive electronics. * **Focus**: Bumping, microflow CSP, FCBGA, and automotive electronics. * **2.5D Packaging**: Currently in development, expected to have commercial products in the second half of 2024. Capacity Expansion and Investment * **Second Phase Expansion**: Construction progressing smoothly, with initial capacity of 30,000 wafers per month. * **Capital Expenditure**: Expected to be around 2 billion RMB in 2024, focusing on equipment investment. Competitive Landscape * **Competitors**: Other domestic and international semiconductor packaging and testing companies. * **Competitive Advantage**: Strong customer relationships, technical expertise, and cost competitiveness. Future Outlook * **Growth Drivers**: Expansion of customer base, product innovation, and capacity expansion. * **Challenges**: Intense competition, technological advancements, and economic uncertainties. Additional Points * **Investment in R&D**: 6% of revenue in Q1 2024. * **Employee Expansion**: Significant increase in personnel in 2023. * **Strategic Partnerships**: Collaborations with leading customers and technology providers.

Financial Performance - The company's operating revenue for 2023 was CNY 2,390.84 million, primarily from integrated circuit packaging and testing products [23]. - The company's operating revenue for 2023 reached ¥2,390,841,120.27, representing a year-on-year increase of 9.82% compared to ¥2,176,992,689.58 in 2022 [57]. - The net profit attributable to shareholders was a loss of ¥93,387,886.95, a significant decline of 167.48% from a profit of ¥138,400,419.38 in the previous year [57]. - The net cash flow from operating activities increased by 19.10% to ¥1,071,479,586.66, up from ¥899,615,766.86 in 2022 [57]. - The total assets of the company grew by 48.20% to ¥12,330,906,165.46, compared to ¥8,320,726,323.62 at the end of 2022 [57]. - The net profit attributable to shareholders decreased by 167.48% year-on-year, primarily due to weak demand and increased costs [74]. - The company's gross profit margin declined compared to the previous year due to weak downstream customer orders and price pressure on certain product lines [74]. - The company's net profit attributable to shareholders of the listed company was -9,338.79 thousand yuan, a decrease of 167.48% year-on-year [141]. - The company's operating costs increased by 21.08% to CNY 2,058,472,654.08 from CNY 1,700,110,847.59 in the previous year [169]. Shareholder Structure - The total number of shares held by the top ten shareholders includes Zhejiang Yongshun Chip Electronics Co., Ltd. with 74,210,000 shares, Wang Shunbo with 16,000,000 shares, and Ningbo Yongjing Enterprise Management Consulting Partnership with 15,250,000 shares [9]. - The company has no controlling shareholder, indicating a diversified ownership structure [13]. - There are no significant changes in the shareholder structure compared to the previous period [8]. - The company has not reported any changes in control during the reporting period [17]. Risks and Mitigation - The company has outlined various risks and corresponding mitigation strategies in its annual report [26]. - The company is facing risks related to gross margin fluctuations, which are directly linked to capacity utilization rates, raw material price volatility, and market supply-demand dynamics [50]. - The company is committed to maintaining reasonable levels of raw material inventory through production planning and supply chain management to mitigate inventory impairment risks [50]. - The company faces risks of underperformance or losses if the semiconductor industry remains sluggish or if project capacity ramp-up does not meet expectations [74]. - The company is actively monitoring global economic trends and industry policies to mitigate risks associated with market fluctuations and changes in government regulations [114]. Research and Development - Research and development expenses for the period amounted to 145.12 million, a year-on-year increase of 19.23%, mainly due to the growth in the number of R&D personnel and related salary costs [51]. - R&D investment reached 145 million yuan, accounting for 6.07% of operating revenue, with 27 new invention patents and 74 utility model patents filed during the reporting period [89]. - The total R&D investment for the year is approximately ¥145.12 million, representing a 19.23% increase from the previous year [104]. - The total R&D personnel increased to 793, representing 16.54% of the company's total workforce, compared to 14.67% in the previous period, indicating a focus on enhancing R&D capabilities [5]. - The company has filed 105 patent applications during the year, with 82 new patents granted [104]. Market and Industry Trends - The semiconductor market is projected to decline by 9.4% in 2023, with a total market size of approximately 520.1 billion USD [74]. - The company anticipates a 13.1% growth in the global semiconductor market in 2024, reaching an estimated value of 588 billion dollars, with expectations for continued revenue growth and improved profitability [89]. - In 2023, the global semiconductor market size is estimated at $520.1 billion, a year-on-year decline of 9.4% [163]. - The global advanced packaging market is projected to grow from $44.3 billion in 2022 to $78.6 billion by 2028, with a compound annual growth rate (CAGR) of 10.6% [94]. Production and Sales - The company's packaging output reached 3.579 billion units, an increase of 33.06% compared to the previous year, while sales volume increased by 31.44% to 3.572 billion units, driven by market expansion and customer demand growth [52]. - The company expanded its product lines in advanced packaging and automotive electronics, achieving one-stop delivery capability with Bumping, CP, FC, and FT technologies [87]. - The company is actively pursuing market expansion, particularly in the automotive electronics sector, with successful certifications from end vehicle manufacturers and Tier 1 suppliers [87]. - The company achieved a revenue of CNY 2,390,841,120.27, representing a year-on-year increase of 9.82% compared to CNY 2,176,992,689.58 in the previous year [169]. - The company had 11 customers with sales exceeding 100 million RMB, and 14 customers with sales over 50 million RMB, indicating an optimized customer structure [79]. Financial Management - The audit report confirms that the financial statements fairly reflect the company's financial position as of December 31, 2023 [30]. - The company has not engaged in any external guarantees that violate decision-making procedures [32]. - The company has not disclosed any information that is subject to confidentiality or exemption due to national secrets or commercial secrets [27]. - The company has implemented strategies to reduce product costs and improve delivery times, further enhancing its competitive position in the semiconductor industry [109]. Innovations and Technologies - The company has developed advanced packaging technologies, including system-level packaging and high-density packaging, to enhance future performance sustainability [63]. - The company has achieved breakthroughs in large FC-BGA, bumping, and RDL technologies through continuous independent research and development [98]. - The company has developed advanced packaging technology for high-density fine-pitch flip chip interconnects, achieving a minimum bump pitch of <80um and a minimum bump diameter of 40um, with over 3,400 bumps per die [99]. - The company’s FC-BGA products have reached 18,000 bumps per die, marking a significant breakthrough in high-density flip chip packaging technology [99]. - The company has successfully developed vacuum molding bottom filling technology for FCCSP flip chips, addressing challenges related to narrow gaps and ensuring effective filling [99].

目 录 一、关于营业收入扣除情况的专项核查意见………………………第 1—2 页 二、2023 年度营业收入扣除情况表…………………………………第 3—5 页 关于营业收入扣除情况的专项核查意见 天健审〔2024〕2154 号 甬矽电子（宁波）股份有限公司全体股东： 我们接受委托，审计了甬矽电子（宁波）股份有限公司（以下简称甬矽电子 公司）2023 年度财务报表，包括 2023 年 12 月 31 日的合并及母公司资产负债表， 2023 年度的合并及母公司利润表、合并及母公司现金流量表、合并及母公司所 有者权益变动表，以及财务报表附注，并出具了审计报告。在此基础上，我们核 查了后附的甬矽电子公司管理层编制的《2023 年度营业收入扣除情况表》（以 下简称扣除情况表）。 一、对报告使用者和使用目的的限定 本报告仅供甬矽电子公司年度报告披露时使用，不得用作任何其他目的。我 们同意将本报告作为甬矽电子公司年度报告的必备文件，随同其他文件一起报送 并对外披露。 我们的核查是根据中国注册会计师执业准则进行的。中国注册会计师执业准 则要求我们计划和实施核查工作，以对扣除情况表是否不存在重大错报获取合理 保证。在核查过程中， ...