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英伟达算力架构持续迭代升级,行业高景气度不断夯实,高速光模块需求确定性极强,CPO步入实质落地阶段
Xin Lang Cai Jing· 2026-02-26 10:27
(来源:淘金ETF) 1. 中际旭创(300308)作为全球高速光模块领域的绝对龙头企业,中际旭创深度绑定英伟达、微软、谷 歌等北美头部云厂商,是AI算力爆发周期内最具确定性的核心受益标的。800G与1.6T高速光模块出货 量稳居全球前列,产品结构持续向高端迭代,毛利率与盈利水平稳步抬升。随着英伟达GB300与Rubin 新一代算力平台规模化落地,单机光模块用量大幅提升,直接推动公司订单持续高增。在CPO共封装光 学领域,企业技术储备完善,与产业链上下游协同推进下一代互联方案,长期成长空间进一步打开。北 美四大云厂商资本开支同比增长超60%,叠加英伟达业绩超预期,公司未来两年业绩确定性极高,产能 持续满载,客户结构优质且壁垒深厚,是光模块板块中业绩弹性最强、成长逻辑最清晰的龙头企业。 2. 新易盛(300502) 专注于高速光模块研发、生产与销售的新易盛,是国内少数具备全球竞争力的核心企业,产品覆盖数据 中心、电信传输全场景,在400G、800G高端模块领域出货量位居行业第一梯队。企业海外收入占比 高,深度绑定全球主流云厂商与设备商,订单能见度高且交付能力突出。受益于AI数据中心建设提速 与高速互联需求爆发, ...
A股PCB概念股集体走强,深南电路、沪电股份等多股涨停,胜宏科技涨超9%
Ge Long Hui A P P· 2026-02-26 05:26
MACD金叉信号形成,这些股涨势不错! | 代码 | 名称 | | 涨幅% ↓ | 总市值 | 年初至今涨幅% | 最新 | | --- | --- | --- | --- | --- | --- | --- | | 301630 | 同宇新材 | | 17.25 | 89.20亿 | 31.03 | 223.01 | | 300739 | 明阳电路 | 1 | 16.31 | 127亿 | 85.42 | 34.08 | | 920060 | 力源通 | 1 | 11.29 | 56.07亿 | 12.17 | 36.88 | | 301251 | 威尔高 | 一般 | 10.14 | 92.87 亿 | 31.89 | 68.95 | | 002008 | 大族激光 | 4 | 10.00 | 718亿 | 69.26 | 69.72 | | 001389 | 广合科技 | 1 | 10.00 | 501亿 | 44.15 | 117.67 | | 002916 | 深南电路 | 1 | 10.00 | 1976 Z | 24.90 | 290.14 | | 002463 | 沪电股份 | 1 | 10. ...
超预期!PCB、CPO大爆发
Xin Lang Cai Jing· 2026-02-26 03:39
炒股就看金麒麟分析师研报,权威,专业,及时,全面,助您挖掘潜力主题机会! 2月26日早盘,算力硬件股持续活跃,PCB、CPO概念板块涨幅居前。 PCB概念拉升,明阳电路涨超15%,威尔高涨超12%,大族激光、广合科技、贤丰控股(维权)、沪电 股份10%涨停,深南电路3天2板。 | 休力 | PCB(i) | | Ai) [3 Q | | --- | --- | --- | --- | | | 3347.43 2.75% | | | | 成份股 受金 | 关联基金 必读 | 股明 | 资讯 | | 全部市场(129) v | 自选 | 最新 (129) v | 龙头(10) | | 图 品 图 | 最新 | 涨幅↓ | 涨跌 | | 明阳电路 | 33.79 | 15.32% | 4.49 | | 300739 融 | | | | | 威尔高 | 70.56 | 12.72% | 7.96 | | 301251 融 | | | | | 万源通 | 37.10 | 11.95% | 3.96 | | 920060 京 融 | | | | | 大族激光 | 69.72 | 10.00% | 6.34 | | 002 ...
广合科技创历史新高
Ge Long Hui· 2026-02-26 01:40
格隆汇2月26日丨广合科技(001389.SZ)涨6.76%,报114.200元,股价创历史新高,总市值486.14亿元。 ...
PCB产业链深度报告:2025年业绩预告高增,2026年景气持续
Dongguan Securities· 2026-02-10 08:41
Investment Rating - The report maintains an "Overweight" rating for the PCB industry chain, anticipating high growth in 2025 and sustained prosperity in 2026 [1]. Core Insights - The PCB industry is expected to experience significant growth in 2025, driven by increasing demand for AI computing power and the upgrade of PCBs towards high-performance and high-density products. This includes a rise in demand for high-layer boards and advanced HDI products, which will also boost related sectors such as high-end copper-clad laminates, drilling consumables, and equipment [4][61]. - Despite some disruptions in Q4 2025 performance, the growth logic for 2026 remains intact, with new computing platforms and technologies like orthogonal backplanes and CoWoP expected to enhance product value significantly [4][61]. Summary by Sections PCB - Q4 2025 performance may face disruptions, but the growth logic for 2026 remains unchanged. The demand for high-layer and advanced HDI PCBs is increasing, leading to high growth rates for companies like Shenghong Technology, Huadian Co., and Shennan Circuit, with projected net profits of 43.60 billion, 38.22 billion, and 32.48 billion respectively, reflecting year-on-year growth rates of 277.68%, 47.74%, and 73.00% [13][14]. Copper Clad Laminate (CCL) - The CCL sector is expected to see high growth in 2025, benefiting from increased demand for high-end products driven by AI computing power and price adjustments. Major CCL manufacturers are projected to achieve significant profit increases, with companies like Shengyi Technology expected to report a net profit of 33.50 billion, a year-on-year increase of 92.50% [36][41]. Drilling Tools and Equipment - The drilling tool sector is anticipated to exceed market expectations in 2025, with companies like DingTai High-Tech projected to achieve a net profit of 4.35 billion, reflecting a year-on-year growth of 91.74%. This growth is driven by increased demand for high-end PCBs and the optimization of product structures [48][49]. - Equipment demand is expected to rise due to the expansion of PCB production capacity, with companies like Dazhu CNC and Chip Quik projected to see significant profit increases, driven by the growing market for PCB-specific processing equipment [55][57].
CPO概念震荡下挫 新易盛跌近10%
Mei Ri Jing Ji Xin Wen· 2026-02-04 01:48
Group 1 - The CPO concept experienced a downward trend in early trading on February 4, with several companies facing significant declines [1] - New Yisheng (300502) and Zhongji Xuchuang (300308) both dropped nearly 10% [1] - Other companies such as Guanghe Technology (001389), Liante Technology (301205), Dongtianwei (301183), and Cambridge Technology (603083) saw declines exceeding 5% [1]
广合科技:公司围绕算力产品各个芯片架构、各个代际平台均有覆盖研究
Zheng Quan Ri Bao Wang· 2026-02-03 09:11
Group 1 - The company, Guanghe Technology (001389), has established a comprehensive research and development system for computing power PCB products, covering various chip architectures and generational platforms [1] - The sales channels of the company extend to global leading server manufacturers, indicating a strong market presence [1]
广合科技:公司算力场景pcb业务收入占比达80%
Ge Long Hui· 2026-02-03 07:24
Group 1 - The core business of the company is the research, development, production, and sales of PCBs (Printed Circuit Boards) [1] - The revenue from the company's computing scenario PCB business accounts for 80% of its total revenue [1]
广合科技(001389.SZ):公司算力场景pcb业务收入占比达80%
Ge Long Hui· 2026-02-03 07:17
Group 1 - The core business of the company is the research, development, production, and sales of PCBs (Printed Circuit Boards) [1] - The revenue from the company's computing scenario PCB business accounts for 80% of its total revenue [1]
广合科技(001389) - 关于香港联交所审议公司发行境外上市外资股(H股)的公告
2026-01-30 11:00
证券代码:001389 证券简称:广合科技 公告编号:2026-006 公司本次发行上市尚需取得香港证券及期货事务监察委员会和香港联交所 等相关监管机构、证券交易所的最终批准,该事项仍存在不确定性。公司将根据 该事项的进展情况依法及时履行信息披露义务,敬请广大投资者注意投资风险。 特此公告。 广州广合科技股份有限公司 董事会 2026 年 1 月 31 日 广州广合科技股份有限公司 关于香港联交所审议公司发行境外上市外资股(H 股)的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整,没有虚 假记载、误导性陈述或重大遗漏。 广州广合科技股份有限公司(以下简称"公司")正在进行申请发行境外上 市外资股(H 股)并在香港联合交易所有限公司(以下简称"香港联交所")主 板挂牌上市(以下简称"本次发行上市")的相关工作,香港联交所上市委员会 于 2026 年 1 月 29 日举行上市聆讯,审议公司本次发行上市的申请。 公司本次发行上市的联席保荐人已于 2026 年 1 月 30 日收到香港联交所向其 发出的信函,其中指出香港联交所上市委员会已审阅公司的上市申请,但该信函 不构成正式的上市批准,香港联交所仍 ...