Core Viewpoint - The company achieved a significant year-on-year revenue growth of 236.78% in the first quarter of 2025 for semiconductor packaging materials, indicating strong demand and successful product development [1] Company Summary - The company has successfully implemented independent design and mass production of semiconductor packaging materials [1] - The product range covers packaging needs for MOSFET, IGBT, SiC, and power modules, reflecting a diverse application in the semiconductor industry [1] - Increased order volume has contributed to the substantial revenue growth reported [1]

Group 1: Company Performance and Growth - The company achieved a revenue increase of 236.78% in Q1 2025, driven by the sales of smart card products and the successful launch of semiconductor packaging materials [1][2] - The performance trend for the first half of 2025 indicates overall business growth, particularly in the semiconductor packaging materials sector and high-margin smart card services [1][2] Group 2: Employee Stock Ownership Plan - The performance assessment targets for the 2025 employee stock ownership plan are set at a minimum of 16% growth in both net profit and operating revenue [2] - The company aims to maintain growth through enhanced cooperation with domestic operators and expansion into new application scenarios for smart cards [2] Group 3: Semiconductor Packaging Materials - The company is expanding its customer base to include major domestic and international power semiconductor packaging enterprises, with a focus on high-performance packaging materials [3][4] - The competitive landscape shows that while international giants dominate the semiconductor packaging materials market, domestic companies are rapidly catching up, particularly in high-growth sectors like electric vehicles and AI computing [3][4] Group 4: Smart Card Business - The smart card market is experiencing stable growth, with new applications in industrial internet and AIoT driving demand [5][6] - The company has established a comprehensive end-to-end system for smart card production, enhancing its competitive edge and customer loyalty [5][6] Group 5: Liquid Cooling Technology - The liquid cooling products are primarily used in AI servers and high-performance computing, with a focus on high thermal efficiency and low energy consumption [7][8] - The market for liquid cooling technology is expected to grow significantly, driven by increasing performance demands in data centers and high-performance computing [8][9] Group 6: Safety Solutions - The company's safety barrier project is designed for high-speed rail platforms, enhancing passenger safety through innovative physical isolation solutions [10][11] - The business model is based on pricing per platform length, with potential for significant value addition due to high technical barriers and safety requirements [10][11] Group 7: Business Synergy and Future Strategy - The company has developed a synergistic relationship among its four main business segments, leveraging core competencies in materials and structural design [11] - Future growth strategies include cautious consideration of mergers and acquisitions, focusing on long-term stability rather than rapid expansion [11]

Group 1 - The company, Chengtian Weiye (300689), has announced an increase in investment in digital and energy thermal management as well as smart security fields, based on developments in smart cards, semiconductors, and digital information security [1] - The company will fulfill its information disclosure obligations in a timely manner if there are significant advancements in these areas [1] - The company acknowledges that there are risks associated with the commercialization and industrialization of new technologies and products due to factors such as macroeconomic conditions, industry policies, and market environment changes [1]

关于选举 2025 年员工持股计划管理委员会委员的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假记载、 误导性陈述或重大遗漏。 深圳市澄天伟业科技股份有限公司（以下简称"公司"）于 2025 年 6 月 13 日召开的 2025 年员工持股计划第一次持有人会议，会议同意设立 2025 年员工 持股计划管理委员会，并选举陈远紫、徐金兰和张安杰为管理委员会委员，任期 为 2025 年员工持股计划的存续期。同日，管理委员会召开了 2025 年员工持股计 划管理委员会 2025 年第一次会议，会议选举陈远紫为 2025 年员工持股计划管理 委员会主任，任期为 2025 年员工持股计划的存续期。 证券代码：300689 证券简称：澄天伟业 公告编号：2025-018 深圳市澄天伟业科技股份有限公司 上述管理委员会委员均为 2025 年员工持股计划持有人，未在公司控股股东 或者实际控制人单位担任职务，不属于持有上市公司 5%以上股东、实际控制人， 未担任公司董事、监事、高级管理人员职务且与前述主体不存在关联关系。 特此公告。 深圳市澄天伟业科技股份有限公司董事会 2025 年 6 月 13 日 ...

证券代码：300689 证券简称：澄天伟业 公告编号：2025-019 深圳市澄天伟业科技股份有限公司 关于股票交易异常波动公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假记载、 误导性陈述或重大遗漏。 一、股票交易异常波动的情况介绍 公司董事会确认，公司目前没有任何根据深交所《深圳证券交易所创业板股 票上市规则》等有关规定应予以披露而未披露的事项或与该事项有关的筹划、商 谈、意向、协议等；董事会也未获悉公司有根据深交所《深圳证券交易所创业板 股票上市规则》等有关规定应予以披露而未披露的、对公司股票及其衍生品种交 易价格产生较大影响的信息；公司前期披露的信息不存在需要更正、补充之处。 深圳市澄天伟业科技股份有限公司（以下简称"公司"）股票（证券代码： 300689；证券简称：澄天伟业）交易价格连续 3 个交易日（2025 年 6 月 11 日、 2025 年 6 月 12 日、2025 年 6 月 13 日）内收盘价涨幅偏离值累计超过 30％，根 据《深圳证券交易所交易规则》的有关规定，属于股票交易异常波动的情况。 二、公司关注并核实的相关情况说明 针对公司股票异常波动的情况，公司董事 ...

根据中国证监会《关于上市公司实施员工持股计划试点的指导意见》及《深 圳证券交易所上市公司自律监管指引第 2 号——创业板上市公司规范运作》的相 关规定，现将公司 2025 年员工持股计划实施的进展情况公告如下： 一、本次员工持股计划的股票来源及规模 证券代码：300689 证券简称：澄天伟业 公告编号：2025-017 深圳市澄天伟业科技股份有限公司 关于 2025 年员工持股计划完成非交易过户的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假记载、 误导性陈述或重大遗漏。 深圳市澄天伟业科技股份有限公司（以下简称"公司"）于 2025 年 4 月 29 日召开第五届董事会第三次会议和第五届监事会第三次会议、于 2025 年 5 月 14 日召开 2024 年度股东会，审议通过了《关于公司〈2025 年员工持股计划（草案）〉 及其摘要的议案》，具体内容详见公司于 2025 年 4 月 30 日和 2025 年 5 月 14 日在巨潮资讯网披露的相关公告。 本员工持股计划的股票来源为公司回购专用证券账户内已回购的部分股份。 公司于 2024 年 1 月 26 日至 2024 年 8 月 ...

Group 1: Company Overview and Product Advantages - The company specializes in liquid cooling products with self-developed high-performance manufacturing processes, offering significant advantages in thermal conductivity and pressure resistance compared to traditional methods [1] - The liquid cooling technology is increasingly replacing traditional air cooling solutions, particularly in high-performance computing and AI servers, leading to a notable increase in the value of each server [2] - The company has no direct competitors due to its unique technological advantages and patent protections [2] Group 2: Business Growth and Financial Performance - Revenue from the lead frame products increased by 467.80% year-on-year in 2024, with a further 236.78% growth in Q1 2025 [2] - The company expects continued strong growth in this product line, driven by high market demand and positive customer feedback [3] Group 3: Product Development and Market Strategy - The company is transitioning its lead frame products towards higher integration levels, focusing on IGBT and SiC power module packaging materials to meet the demands of rapidly growing industries like electric vehicles and AI [3] - The Super SIM card project aims to enhance user experience in railway scenarios, relying on partnerships with domestic operators and railway departments for implementation [4] Group 4: Market Position and Competitive Landscape - The market for smart safety solutions, including railway safety barriers, is characterized by high entry barriers and limited competition, positioning the company favorably for growth [5] - The company is actively promoting its smart safety projects, leveraging its advanced technology to meet the increasing safety demands of expanding high-speed rail networks [5] Group 5: Future Business Structure and R&D Investment - The company plans to optimize its product structure towards high-growth, high-tech value-added areas, with liquid cooling and packaging materials expected to become significant revenue sources [6] - R&D investment will remain a priority, with a focus on maintaining a balance between foundational research and core technology development [10] Group 6: Financial Health and Risk Management - The company reported a net profit of 11.57 million yuan in 2024, a 29.77% increase from the previous year, driven by improved product structure and cost management [11] - The company maintains a healthy accounts receivable turnover, with a focus on managing credit risk as it expands into new markets [11]

Group 1: Company Overview and Market Position - The company operates in the smart card industry, which has a market capacity that is stabilizing but facing saturation in traditional applications. However, new applications in IIoT, AIoT, and eSIM are driving growth [1] - The gross margin for the smart card business is approximately 20%, positioning the company at a medium level within the industry [1] - The company is transitioning towards the super SIM card sector to enhance value and market space [2] Group 2: Competitive Advantages - The company is the first in the industry to offer a one-stop service, integrating the entire supply chain from chip application development to end-user delivery, which enhances product consistency and customer loyalty [2] - Over 60% of the company's product sales are international, with established partnerships with global leaders like THALES and IDEMIA, showcasing strong global operational capabilities [2] - The company has a robust project delivery and local service capability, having secured contracts with major Chinese telecom operators [2] Group 3: Semiconductor Business Development - The company entered the power semiconductor packaging materials sector in 2019, leveraging its existing technology to tap into a high-potential market [3] - Future plans include accelerating production of thermal management products and expanding customer bases in the power module sector [3] Group 4: Research and Development Investment - The company maintains a consistent investment in R&D, focusing on core technologies and optimizing resource allocation based on market feedback and financial status [4] - R&D personnel compensation is a significant portion of the R&D budget, with ongoing employee stock ownership plans to incentivize innovation [4] Group 5: Overseas Market and Production Capacity - Overseas operations account for over 60% of revenue, with production facilities in India and Indonesia achieving utilization rates of 70%-80% and 80%-90%, respectively [5] - The company emphasizes local production to enhance responsiveness to customer needs [5] Group 6: Customer Stability and Risk Management - The smart card business remains the primary revenue source, with a high customer concentration. Long-term agreements with major clients mitigate dependency risks [6] - The revenue share from the top five customers decreased from 87.92% in 2023 to 77.75% in 2024, indicating diversification efforts [7] Group 7: Liquid Cooling Business - The company has developed liquid cooling products with integrated designs that enhance efficiency and reliability, targeting high-performance computing needs [7] - The products are in the final stages of preparation for mass production, with a focus on meeting the rising demand in AI and data center markets [7] Group 8: Smart Security Business - The company is leveraging its expertise in digital information security to develop smart security solutions, particularly in transportation safety [8] - Current efforts are focused on market promotion, with ongoing exploration of business models [8] Group 9: Challenges and Opportunities - Key challenges include rapid technological changes and market entry risks for new businesses, which could impact production efficiency and competitiveness [9] - Opportunities exist in the growing demand for efficient cooling and packaging materials in AI and high-performance computing sectors, with potential for rapid growth [9] Group 10: Chip Production and Partnerships - The company primarily sources smart card chips externally, with some proprietary chips for internal use and external sales [10] - The company has not yet established a partnership with Huawei in the liquid cooling sector but remains open to future collaborations [10] Group 11: Acquisition Strategy - The company is cautious about pursuing acquisitions, focusing on long-term stability and evaluating potential targets within the industry [10] Group 12: Risk Disclosure - The company acknowledges risks associated with new product development, including technological, market, and validation risks, and commits to timely information disclosure [12]

Group 1: Company Overview and R&D Investment - The company positions technological innovation as its core competitiveness, maintaining a certain proportion of investment in basic research and core technologies based on business development needs [1] - R&D investment has shown a declining trend over the past three years, with future allocations to be dynamically optimized based on market feedback, technological advancements, and financial conditions [1][2] Group 2: Semiconductor Business - The semiconductor product capacity utilization rate is currently low, with revenue primarily dependent on smart card business; future plans include increasing capacity utilization and revenue from semiconductor packaging materials [2] - In 2024, semiconductor and packaging materials are expected to account for approximately 10% of total revenue, with significant revenue growth anticipated in Q1 2025 [2] Group 3: Profitability and Market Strategy - Different semiconductor products exhibit varying gross profit margins, with lead frames around 20% and copper bases reaching 20%-30% [2] - The company aims to promote high-performance products like copper needle-type heat dissipation bases to leading power module clients, adjusting order volumes based on client project timelines [2] Group 4: Smart Safety and Super SIM Card Business - The smart safety business focuses on digital information security, targeting transportation safety applications with multiple patents and a high industry entry barrier [3] - The super SIM card business leverages long-term experience in smart cards, showing advantages in speed, convenience, and system integration, with stable partnerships established with major domestic operators [4][5] Group 5: Liquid Cooling Technology - The liquid cooling products utilize self-developed high-performance manufacturing processes, showing advantages in structure integration, thermal conductivity, and pressure resistance [5] - The company is preparing for mass production of liquid cooling products, with market demand driven by AI servers and high-performance computing [6][7] Group 6: Future Plans and Market Position - The company plans to continue optimizing product structure based on market demand, focusing on semiconductor packaging materials, digital and energy thermal management, and smart safety technologies for new growth points [10] - Future liquid cooling business will explore chip-level thermal management solutions, aiming for deep applications in high-performance computing and advanced packaging [9][10] Group 7: Risk Management - The company acknowledges potential technical, market, and application validation risks in new business and product development, emphasizing the importance of timely information disclosure in compliance with legal regulations [10]

北京市金杜（深圳）律师事务所 关于深圳市澄天伟业科技股份有限公司 2024 年年度股东会的法律意见书 致：深圳市澄天伟业科技股份有限公司 北京市金杜（深圳）律师事务所（以下简称本所）接受深圳市澄天伟业科技 股份有限公司（以下简称公司）的委托，根据《中华人民共和国证券法（2019 修 订）》（以下简称《证券法》）、《中华人民共和国公司法（2023 修订）》（以 下简称《公司法》）、中国证券监督管理委员会《上市公司股东会规则》（以下 简称《股东会规则》）等中华人民共和国境内（以下简称中国境内，为本法律意 见书之目的，不包括中国香港特别行政区、中国澳门特别行政区和中国台湾地区） 现行有效的法律、行政法规、规章、规范性文件和现行有效的《深圳市澄天伟业 科技股份有限公司章程》（以下简称《公司章程》）的规定，指派律师出席了公 司于 2025 年 5 月 14 日召开的 2024 年年度股东会（以下简称本次股东会），并 就本次股东会相关事项出具本法律意见书。 8．公司本次股东会相关议案及涉及相关议案内容的公告等文件； 为出具本法律意见书，本所律师审查了公司提供的以下文件，包括但不限于： 1．经公司 2024 年 7 月 2 ...