（文章来源：证券日报） 证券日报网讯新恒汇8月14日在互动平台回答投资者提问时表示，最新的股东数量将在8月19日的半年报 中披露。 ...

Group 1 - The company, Xin Heng Hui (301678), has stated that it currently does not have any factories established overseas [1] - The company has also confirmed that it has not set up any subsidiaries in the Greater Bay Area [1]

证券之星消息，8月14日半导体板块较上一交易日上涨1.06%，龙图光罩领涨。当日上证指数报收于 3666.44，下跌0.46%。深证成指报收于11451.43，下跌0.87%。半导体板块个股涨跌见下表： | 代码 | 名称 | 收盘价 | 涨跌幅 | 成交量(手) | 成交额(元) | | | --- | --- | --- | --- | --- | --- | --- | | 688721 | 龙图光罩 | 53.72 | 12.98% | 12.93万 | | 7.12亿 | | 688256 | 寒武纪 | 949.00 | 10.35% | 15.07万 | | 140.35 Z | | 688041 | 海光信息 | 152.49 | 8.83% | 78.90万 | | 120.20亿 | | 688110 | 东芯股份 | 93.25 | 4.58% | 39.86万 | | 37.14亿 | | 688591 | 泰凌微 | 52.40 | 4.26% | 18.81万 | | 9.97亿 | | 688347 | 表可公司 | 70.50 | 3.62% | 28.94万 | | 20.3 ...

Group 1 - The company has not established factories overseas and does not have a branch in the Greater Bay Area [1] - The company is currently focusing on its business layout in artificial intelligence [1] - The company expressed gratitude for investor interest in its future business breakthroughs [1]

Group 1 - The company, Xinhenghui Electronics Co., Ltd., is set to hold its online roadshow for its initial public offering on June 10, 2023, on the P5W platform [1] - Key executives from the company, including Chairman Ren Zhijun and CFO Wu Zhongtang, will participate in the roadshow alongside representatives from the lead underwriter, Founder Securities [2] - Xinhenghui specializes in integrated circuit solutions, focusing on chip packaging materials, and has established itself as a national high-tech enterprise and a "little giant" in the industry [2][3] Group 2 - The company has a significant market share of approximately 30% in the smart card business, ranking second globally, with applications in communications, finance, transportation, and identity verification [2] - In the etching lead frame business, the company has developed core technologies such as laser direct imaging and continuous etching, leading to improved product yield and increased capacity [3] - The IoT eSIM chip packaging sector is emerging as a new revenue growth point for the company, leveraging its advantages in traditional SIM card packaging [3] Group 3 - The company is committed to independent research and product innovation, with established laboratories and a high-level R&D team, holding over 120 patents and software copyrights [3] - Future strategies include increasing investment in core technology research, enhancing the R&D system, and expanding product varieties and applications [4] - The company aims to become a leading enterprise in the global integrated circuit packaging materials sector through collaboration with top global partners [4]

此外，由于激光直接成像曝光工艺省去了传统制作工艺需要制作电路曝光掩膜版的环节，将新品导入周 期从传统的8~10周时间，缩短到2~4周，显著节省了客户开发新品的周期与成本，具有明显的客户吸引 力。公司目标是在稳定工艺与提高产品品质的同时，计划用三年的时间提高蚀刻引线框架产能，致力于 成为全球主流的蚀刻金属引线框架供应商。（全景网） 更多精彩请点击：https://rs.p5w.net/html/147882.shtml 新恒汇（301678）首次公开发行股票并在创业板上市网上路演6月10日成功举行。新恒汇董事长任志军 在回答投资者提问时表示，蚀刻金属引线框架是集成电路封装的关键材料，近年来集成电路封测市场对 蚀刻金属引线框架的需求量在逐年增大。目前蚀刻引线框架的主要供应商还集中在日本、韩国、中国香 港等地区，国内大陆地区自给率较低。公司在技术工艺方面采用独特的激光直接成像曝光技术，生产工 艺不同于传统厂家，可以有效提升产品良率，因此在成本方面有较大的潜力与竞争优势。 ...

Group 1 - The core viewpoint of the article is that Xinhenghui (301678) successfully held an online roadshow for its initial public offering (IPO) and listing on the ChiNext board on June 10 [1] - The company introduced new products and services in the field of IoT eSIM chip packaging, including IoT QFN/DFN packaging and MP2 packaging, to meet the needs of downstream IoT customers [1]

Group 1 - The core viewpoint of the article highlights the successful online roadshow for the initial public offering of Xinhenghui (301678) on June 10, which indicates strong investor interest and market confidence [1] - According to statistics from Eurosmart, the global smart card shipment volume has remained stable at around 9.5 billion units in recent years, with SIM cards accounting for approximately 4.5 billion units, banking chip cards for about 3.3 billion units, and ID and industry application cards for around 1.5 billion units [1] - By the end of 2024, the market share of the company's core packaging material, flexible lead frames for smart cards, is projected to reach 32%, while the market share for smart card module products is expected to be around 13% [1]

Core Viewpoint - New Henghui (301678) successfully held its online roadshow for its initial public offering and listing on the ChiNext board on June 10, emphasizing its commitment to independent research and development across different business segments [1] Group 1: Business Strategy - The company focuses on ensuring product quality and performance in its mature smart card business while aiming to reduce production costs through the development of new processes, technologies, and materials [1] - For its new businesses in etching lead frames and packaging testing for IoT eSIM chips, the company is dedicated to developing new technologies, processes, and products to enhance production efficiency and product quality, as well as to expand its product range [1]

Core Viewpoint - The company Xin Heng Hui is positioning itself as a leading player in the integrated circuit packaging materials sector, leveraging its technological innovations and commitment to quality service in the global market [1][2]. Company Overview - Xin Heng Hui is an integrated circuit enterprise that focuses on the research, production, sales, and testing services of chip packaging materials. Its main business areas include smart card operations, etching lead frame business, and IoT eSIM chip testing services [1]. - The company has developed over 120 patents and software copyrights and has established national standards for integrated circuit card packaging frameworks [1]. IPO Details - The company successfully held an online roadshow for its initial public offering (IPO) on June 10, with key executives participating alongside representatives from the underwriting firm, Founder Securities [1]. - Xin Heng Hui plans to issue 59.888867 million new shares, accounting for 25% of the total shares post-IPO, with an offering price of 12.80 yuan per share. The subscription date is set for June 11, and payment is due by June 13 [3]. Fund Utilization - The funds raised from the IPO will primarily be allocated to the industrialization upgrade of packaging materials and the construction of a research and development center. This is expected to enhance the company's global competitiveness and facilitate a transition towards intelligent services [3].