龙磁科技 20260226 摘要 公司永磁铁氧体业务稳健扩张，产能五年翻倍至 5 万吨，显著高于行业 5%-10%的平均增速，主要受益于较早的海外市场布局和持续的海外产 能扩张，目前海外产能占比 1.2 万吨。 公司积极寻求第二增长曲线，从软磁业务向下游延伸至芯片电感领域， 目前国内仅 2-3 家企业具备客户验证和订单落地能力，公司将芯片电感 作为重要增长极，并积极与国内外客户对接。 芯片电感单价因规格而异，非 TLVR/VR 类产品约 3 元/颗，TLVR/VR 类 产品可达 7-14 元/颗，单颗 GPU 用量约 35-70 颗，GB200 阶段价值量 约 200 多元，若切换至 TLVR 路径，价值量可能翻倍。 公司芯片电感定增规划新增产能 1.8 亿只，项目土地厂房已具备，设备 产能投放将依据订单节奏，单品从验证到订单落地周期约半年，重点拓 展垂直供电结合 TLVR 技术路径。 海外永磁铁氧体产能稀缺性增强，主要竞争对手 TDK 和日立金属有效产 能远低于名义产能，且用工成本较高，公司越南基地扩张迅速，2023 年之前约 4,000 吨增至当前约 2 万吨。 永磁铁氧体作为基础产业长期持续投入，扩产节 ...

会议助理: 大家好，欢迎大家参加 AI 加通胀系列 MLCC 专家交，线上会议。目前所有参会人员均处 于经营状态，下面有请主讲老师开始发言，谢谢。 王心怡 华泰证券电子分析师: 那各位线上投资人，大家晚上好。欢迎大家来参加我们这个 AI 加通胀系列的 MACC 专场 的专家交流。我是华泰电子研究员王欣怡。那在会议开始前，其实我们也再重申一下对于 整个 MLC C 最新看到的一些变化吧。就确实是在春节期间，观测到包含村田和三星电机 在内的一些日韩大厂对于涨价的这个事情的口风，确实是发生了一些扭转然后另外就是渠 道现货价也在春节期间迎来了一些继续的上涨。那这个从海外的这些催化来看的话，其实 是进一步加深了大家对于台系，包括大陆的公司后续跟涨的一个预期的。 然后另外一个层面就是从这个 AI 相关，包含 AI 在内的吧，这些高端需求来看，确实是今 年全年还是非常的旺盛。那这个对于非 AI 的高容，以及说一些中低端产能的挤占，可能 也是短期大家比较关心的事情。所以我们今天也是特别邀请到了台系的被动元件大厂的资 深专家，然后来给我们做这样一个专场分享。专家您好，请问能听到吗？ 台系被动元件大厂资深专家: 能听到，很清楚。 ...

20260224复盘 宏观： 1. 本月MLF操作，开展6000亿，净投放3000亿，加上此前的买断式逆回购，本月合计投放中长资金9000亿。 2. 20家日本实体列入出口管制管控名单。 日本宣布拟在距台湾110公里小岛，5年内部署导弹。 3. 特朗普政府正在考虑对六个行业征收新的国家安全关税。 可能涵盖大型电池 20260224复盘 宏观： 1. 本月MLF操作，开展6000亿，净投放3000亿，加上此前的买断式逆回购，本月合计投放中长资金9000亿。 2. 20家日本实体列入出口管制管控名单。 日本宣布拟在距台湾110公里小岛，5年内部署导弹。 3. 特朗普政府正在考虑对六个行业征收新的国家安全关税。 可能涵盖大型电池、铸铁及铁制配件、塑料管道、工业化学品以及电网和电信设备等行业。 人工智能： 1. Meta将采购足够数量的AMD最新芯片，以在未来五年内为其数据中心提供高达6吉瓦的计算能力。 3. 努比亚手机将在3月2日-5日的世界移动通信大会上发布一款"AI新物种"新手机，定位"AI手机先锋"。 4. 盘中传金刚石冷却技术交付，盘后辟谣。 5. 字节跳动 AI 代码开发工具 Trae 修改付费方式，由按 ...

Core Insights - The chip market in 2025 is showing signs of recovery compared to the lows of previous years, driven by tariffs, market events, and a sustained demand for storage chips [3][4] - Monthly tracking of popular chip models has revealed both transient and stable demand patterns, with certain models consistently appearing in the market [3][4] Summary by Sections Annual Stable Chip Model - The W25Q128JVSIQ, a 128M-bit SPI NOR Flash from Winbond, has been a standout model, applicable across various sectors including wearables and automotive [5][7] - Its price surged from 1.8 RMB in July to around 6 RMB by December, with a notable increase to 9-10 RMB in January 2026, indicating strong market demand [7] Consistent Presence in Market - The ICM-42688-P, a 6-axis MEMS motion tracker from TDK InvenSense, has maintained a strong market presence, with prices rising from around 9 RMB to nearly 30 RMB by December, and further escalating to 50-60 RMB in January 2026 [9][11] - The KLM8G1GETF-B041, an 8GB eMMC chip from Samsung, has also seen significant price increases, from approximately 20 RMB in April to around 120 RMB in January 2026, following a product lifecycle end notification [13][15] Power Module Performance - The LTM4644, a highly integrated DC/DC buck converter, has been consistently featured in popular models, with prices peaking at 450 RMB in April before stabilizing around 150-160 RMB [19][20][21] MCU Market Stability - The STM32F103 and STM32F407 series from STMicroelectronics have shown consistent demand, appearing frequently in popular models despite a less volatile market for MCUs [23][24][25] Impact of Market Events - The Nexperia BAV99 series, particularly the automotive-grade BAV99-Q, experienced a price spike following a market event in October, with prices reaching close to 10 RMB, reflecting the volatility in the automotive chip sector [27][28] Summary of Popular Chip Models - A comprehensive list of popular chip models for 2025 includes various types such as NOR Flash, eMMC, and IMUs, indicating diverse applications and ongoing demand across sectors [29][30][34]

Core Insights - The global MEMS packaging market is expected to grow significantly from $48.08 billion in 2024 to $85.64 billion by 2030, driven by increasing demand in consumer electronics, automotive, industrial, and medical electronics sectors [2] - The report emphasizes that packaging technology is becoming a critical factor in determining MEMS performance, reliability, and mass production capabilities, with complexity in packaging emerging as a key competitive focus in the industry [2] Market Drivers - The continuous increase in sensor integration in automotive and consumer electronics is identified as the primary driver of market demand. Automotive applications require high stability, vibration resistance, and often hermetic sealing for MEMS used in safety and control functions [3] - In the consumer electronics sector, there is a trend towards higher integration and smaller sizes, with various inertial sensors, pressure sensors, and MEMS microphones being compactly arranged in devices like smartphones, wearables, AR/VR headsets, and wireless earbuds [3] - The medical sector is also seeing growth in MEMS applications, with requirements for biocompatibility and long-term sealing performance in portable diagnostic devices, hearing aids, implantable pressure sensors, and drug delivery systems [3] Technological Innovations - The MEMS packaging market is categorized into four main types: inertial sensors, optical sensors, environmental sensors, and ultrasonic sensors. Inertial and ultrasonic MEMS present unique challenges for packaging design, driving technological innovation [4] - Ultrasonic MEMS are widely used in automotive obstacle detection, robotic navigation, and industrial proximity sensing, requiring packaging that ensures sound wave transmission while protecting circuits from moisture, dust, and vibration [4] - Inertial sensors depend on precise mechanical isolation and low-stress packaging structures to ensure measurement accuracy [4] Competitive Landscape - The report lists key players in the MEMS packaging market, including specialized packaging manufacturers, leading sensor companies, and wafer foundries such as ChipMOS, AAC Technologies, Bosch Sensortec, Infineon, Analog Devices, Texas Instruments, TSMC, MEMSCAP, Orbotech (part of KLA), and TDK [5] - The market is projected to achieve a compound annual growth rate (CAGR) of 10.1%, indicating that MEMS packaging is no longer a mere ancillary part of the supply chain. In the context of increasing sensor density in AI systems, packaging is becoming a central point for cost, yield, reliability, and product differentiation [5]

Core Viewpoint - The article discusses the challenges of managing excess inventory in the semiconductor industry, highlighting the financial burden of storage and capital costs associated with unsold materials, while promoting a service that facilitates quick transactions for surplus stock [1][10]. Group 1: Inventory Management - A significant amount of excess inventory, specifically 100,000 units, is causing financial strain due to monthly storage and capital costs of at least 5,000, leading to a potential loss of 30,000 if held for six months [1]. - The company offers a platform, "Chip Superman," which has served 22,000 users and can complete transactions in as little as half a day, aiming to alleviate the burden of unsold inventory [10]. Group 2: Inventory Listings - The article lists various semiconductor components available for sale, including models from brands like Winbond, Infineon, and Broadcom, with quantities ranging from 2,000 to 500,000 units [4][5][6]. - Specific models include Winbond's W25Q16JVBYIQ with 90,000 units and Broadcom's BCM54991ELB0IFEBG with 12,653 units, showcasing a diverse inventory [4][5]. Group 3: Purchase Requests - The article also includes a section for purchasing requests, indicating demand for specific components such as Winbond's W25Q16JVSSIQ and Samsung's K4AAG165WA BCTD, with quantities up to 10,000 units [7]. Group 4: Warehouse and Quality Control - The company operates a 1,600 square meter smart warehouse with over 1,000 models and 50 million chips in stock, valued at over 100 million, ensuring quality control through an independent laboratory [9].

算笔账 一批十万的呆料压在库存 每月仓储费➕资金成本至少5k 放半年就亏3万 有料单不知道怎么推广？ 芯片超人已经 累计服务2.2万用户 ，打折清库存，最快半天完成交易！ 找不到，卖不掉，价格还想再好 点 ，都可以来找我们！ 求购以下料号 | 品牌 | 型号 | 数量 | 年份 | | --- | --- | --- | --- | | 华邦 | W25Q16JVSSIQ | 30K | 两年内 | | 三星 | K4AAG165WA BCTD | 10K | 两年内 | | 芯科 | RS9113-N00- D0W-X78 | 1764个 | 两年内 | | TI | TPS62932DRLR | 20K | 现货 | | 华邦 | W25Q80DVSSIG | 50K | 25+ | | 华邦 | W631GU6RB09I | 6K | 两年内 | | 华邦 | W664GG6RB-06 | 10K | 两年内 | | 旺宏 | MX66L2G45GXRI10K | | 两年内 | | 旺宏 | MX66L2G45GXRI00 | 10K | 两年内 | | ADI | ADL5304ACPZ | 3K ...

Core Viewpoint - The recent price hikes in passive components, led by major players like Yageo and Walsin, indicate a significant shift in the market driven by supply-demand imbalances and rising raw material costs, particularly in high-end sectors like AI and electric vehicles [1][4][19]. Group 1: Price Adjustments - Yageo announced a price increase of 15%-20% for certain resistor products starting February 1, marking its third price adjustment in a short period [1]. - Walsin and Panasonic also announced price hikes of around 20% and 15%-30% respectively for various passive components, reflecting a broader trend among major manufacturers [1][2]. - Smaller manufacturers in China, such as Fenghua Advanced Technology and Shunluo Electronics, have also followed suit with price adjustments ranging from 5%-30% across multiple product categories [2][3]. Group 2: Supply Chain Dynamics - The passive component market is experiencing supply tightness, with lead times extending and some distributors pausing quotes due to uncertainty in price adjustments [3][4]. - Rising costs of raw materials, particularly precious metals like silver and palladium, have significantly increased production costs for passive components, with estimates suggesting a 20%-30% rise in production costs [5][6]. - Capacity constraints are exacerbated by major manufacturers shifting focus to high-end products, leading to a structural shortage in the mid-range market [7][8]. Group 3: Demand Drivers - The demand for passive components is being driven by the rapid growth of AI and electric vehicles, with AI servers requiring significantly more MLCCs than traditional servers [10][11]. - The automotive sector is also a major growth area, with electric vehicles using up to three times more passive components compared to traditional vehicles, creating a favorable environment for price increases [11][12]. - The overall market for passive components in China is projected to grow from 1237.65 billion yuan in 2023 to 2583.59 billion yuan by 2030, with a compound annual growth rate of 11.09% [13]. Group 4: Market Structure Changes - The current price hikes reflect a structural change in the passive components market, with high-end products experiencing significant demand while traditional consumer electronics face challenges [15][19]. - Domestic manufacturers in China are beginning to capture more market share, particularly in high-end segments, as they improve their technology and production capabilities [19][20]. - The geopolitical landscape and supply chain diversification are providing opportunities for Chinese manufacturers to enter high-end markets, as global players face capacity and delivery challenges [19][24]. Group 5: Future Outlook - The passive components market is expected to continue evolving, with AI and automotive electronics driving demand for high-value products [25][26]. - Companies need to focus on high-capacity, miniaturized, and reliable products to meet the changing market demands and maintain competitiveness [25][26]. - Collaboration across the supply chain will be crucial for manufacturers to overcome technical challenges and align with market needs [25][26].

Core Viewpoint - The recent price hikes in passive components, driven by supply-demand imbalances and rising raw material costs, indicate a significant transformation in the market dynamics of the passive components industry [6][9][12]. Price Adjustments - Yageo announced a price increase of 15%-20% for certain resistor products starting February 1, reflecting its position as a market leader with an 18% global market share [2]. - Other companies, including Walsin Technology and Panasonic, have also announced price hikes for various passive components, with increases ranging from 15% to 30% [2][3]. - The price adjustments are widespread, with many small and medium-sized manufacturers in China also raising prices by 5%-20% across multiple product categories [3]. Supply Chain Dynamics - The price increases are primarily driven by rising costs of raw materials such as silver, copper, and aluminum, which have seen significant price surges, with silver prices increasing over 140% in 2025 [7][9]. - The production costs for passive components have risen by 20%-30% due to these raw material price increases, prompting manufacturers to pass on costs to customers [7][9]. - Capacity constraints are exacerbating the situation, as many Japanese manufacturers have shifted focus to high-end products, reducing supply in the mid-to-low-end market [8][9]. Demand Drivers - The demand for passive components is being driven by the rapid growth of AI and electric vehicle markets, with AI server motherboards requiring significantly more MLCCs than traditional servers [10][11]. - The demand for passive components in electric vehicles is also increasing, with the number of MLCCs used per vehicle rising dramatically compared to traditional vehicles [10][11]. - The overall market for passive components in China is projected to grow from 1237.65 billion yuan in 2023 to 2583.59 billion yuan by 2030, with a compound annual growth rate of 11.09% [12]. Market Structure Changes - The current price hikes reflect a structural change in the passive components market, with high-end products for AI servers and electric vehicles experiencing significant demand while traditional consumer electronics face challenges [14][17]. - Domestic manufacturers are beginning to capture more market share, with companies like Walsin Technology and Sunlord Electronics seeing increased orders and expanding their production capabilities [18][19]. - The shift towards high-end products presents opportunities for domestic manufacturers to enter the supply chains of larger companies, especially as global manufacturers face capacity and delivery challenges [22][23].

数说新能源 欢迎订购数说新能源2026年月度电池装机数据库和中国汽车上险数据库 联系方式：13220160736（同微信） Panasonic 25Q4业绩跟踪（Energy板块） 25Q4对应Panasonic 26财年Q3 1、财务数据 2、业绩影响因素 二、ATL 25Q4业绩跟踪（TDK 旗下 Energy Application Products segment 板块） 1、财务数据 收入：25Q4公司Energy业务实现收入118亿元，同比+22.3%，环比+15.5%；分产品来看，车载动力电池收入49亿元，同 比-0.5%，环比+10.6%，工业&消费级电池收入69亿元，同比+46.6%，环比+20.0% 营业利润：25Q4公司Energy业务调整后营业利润18.7亿元，同比-2.1%，环比显著提升；分产品来看，车载动力电池营业 利润5.6亿元，同比-44.9%，环比扭亏，工业&消费级电池收入13.0亿元，同比+58.5%，环比+59.3% IRA影响：25Q4北美AMPC补贴对营业利润影响约10.1亿元，剔除补贴后营业利润约8.6亿元，同比+55.3%，环比扭亏 营业利润率：25Q4公司Ene ...