公众号记得加星标⭐️，第一时间看推送不会错过。 至于先进封装产能，台积电CoWoS仍将是AI芯片的主流封装方案。法人认为，台积电明年先进封装 产能建置依旧积极，CoWoS至年底月产能上看12万片。程正桦观察，封装需求外溢至专业封测代工 厂（OSAT），不仅可纾解短期产能压力，也有助于降低未来封装技术世代更迭所带来的风险。 半导体业界观察，随着AI GPU与ASIC导入更多运算单元与I/O设计，单位晶圆可切割的有效晶粒数 下降，放大先进制程晶圆需求；以辉达Rubin GPU为例，8倍光罩尺寸（Reticle size）之可切割晶粒 （Good die per wafer）只有4颗，但如果以方形载具效率将成长3倍，CoPoS将会是明年技术发展重 点。 据悉，代工龙头预计在明年第二季建置CoPoS之RD实验线，研发预计2027年底完成、2028年进入量 产。 设备业者指出，CoPoS仍然会先沿用既有CoWoS供应商，但是存在机会并不代表一定能顺利打入， 其中，相关验证时间长达三～五年、良率也是大客户要求的重点。 设备业者透露，未来CoPoS处理的晶圆变大，机台面积（footprint）也要放大，此外，因为处理的芯 ...

Core Viewpoint - TSMC is advancing its 2nm production with plans for four factories to operate at full capacity, despite high costs for customers due to increased pricing per wafer [2] Group 1: 2nm Production Progress - TSMC is set to have four 2nm factories operational next year, with a total monthly output of 60,000 wafers [2] - The current yield rate for 2nm in the trial production phase has reached 60%, indicating readiness for stable mass production [2] - Major clients like Apple, Qualcomm, and MediaTek are expected to be the first to adopt the new technology [2] Group 2: Cost Implications - The price per wafer for the 2nm process is projected to be around $30,000, which is 50% higher than the 3nm process [2] - To help clients manage costs, TSMC has initiated a shared trial production service called "CyberShuttle," allowing multiple clients to share a single test wafer for design validation [2] Group 3: Competitive Landscape - There is potential pricing pressure on TSMC if competitors like Samsung successfully launch their first 2nm GAA architecture chip, Exynos 2600, with improved yield rates [2]