Investment Rating - The report maintains an "Accumulate" rating for Dongwei Technology (688700) [1] Core Views - The demand for high-end electroplating equipment is expected to increase due to the CoWoP technology combined with HDI, positioning the company to benefit significantly [7] - The company is well-positioned to capitalize on the growth in HDI electroplating equipment demand, supported by its advanced technology and product offerings [7] Financial Forecasts - Projected total revenue (in million RMB) for 2023A is 909.23, with a decline of 10.13% year-on-year, and is expected to rise to 1,266.38 by 2027E, reflecting a growth of 11.45% [1] - The forecasted net profit attributable to the parent company (in million RMB) is 151.43 for 2023A, with a significant drop of 29.01% year-on-year, expected to recover to 224.36 by 2027E, showing a growth of 21.48% [1] - The latest diluted EPS is projected to be 0.51 for 2023A, increasing to 0.75 by 2027E [1] - The current price-to-earnings ratio (P/E) is 94.25, with future projections of 206.03 for 2024A, decreasing to 63.61 by 2027E [1] Market Data - The closing price of the stock is 47.83 RMB, with a market capitalization of 14,272.54 million RMB [5] - The stock has a price-to-book ratio of 8.15 and a one-year price range of 16.95 to 51.00 RMB [5] Key Technologies and Market Trends - The CoWoP process is emerging as a mainstream packaging technology, simplifying processes and reducing transmission losses, which is crucial for the PCB industry [7] - The MSAP and SAP processes are identified as key technologies for achieving HDI, driving the demand for high-value electroplating equipment [7] - The company’s horizontal electroplating equipment is validated by leading customers, indicating a promising domestic replacement trend [7]

Investment Rating - The report maintains a "Buy" rating for the company [1] Core Views - The demand for laser micro-hole equipment is expected to increase due to the adoption of CoWoP technology combined with HDI, positioning the company to benefit significantly [7] - The company's TGV laser micro-hole equipment is technologically advanced, meeting the stringent quality requirements of high-end HDI PCBs, and is already being utilized in semiconductor and display chip packaging [7] - The financial forecasts indicate a steady growth in revenue and net profit, with projected net profits of 6.4 billion, 7.2 billion, and 7.6 billion RMB for 2025, 2026, and 2027 respectively, corresponding to dynamic P/E ratios of 31, 28, and 26 times [7][8] Financial Projections - Total revenue is projected to grow from 2,014 million RMB in 2024 to 3,177 million RMB in 2027, with a compound annual growth rate (CAGR) of approximately 9.96% [1][8] - The net profit attributable to the parent company is expected to increase from 643 million RMB in 2025 to 760 million RMB in 2027, reflecting a growth rate of 5.57% in the final year [1][8] - The earnings per share (EPS) is forecasted to rise from 1.93 RMB in 2024 to 2.78 RMB in 2027 [1][8]

证券日报网讯电连技术8月15日在互动平台回答投资者提问时表示，公司产品多层软板及软硬结合板制 程能力涵盖HDI技术，目前不存在应披露而未披露的相关信息。 （文章来源：证券日报） ...

高端 PCB 需求跃迁，算力基座价值重构 20250811 摘要 全球 PCB 市场规模预计在未来几年内显著增长，从 2024 年的 735.65 亿美元增长到 2026 年的 1,000 亿美元，AI 服务器市场是主要驱动力， 其价值量提升速度超过全球 AI 服务器的增长速度。 AI 算力需求通过增加 GPU 和 ASIC 出货量推动 PCB 行业发展，尤其 ASIC 在功耗性能方面要求更高，对高多层板和高频高速材料等高端 PCB 产品需求更大，高端材料如马九、银部、PDFE 等将推动单板价值 量提升。 GPU 出货量预计明年（2026 年）将达到 676 万颗，相较于 2025 年的 576 万颗增长约 20%至 30%。各代 GPU 产品单服务器或单 GPU 对应 价值持续增长，每一代产品大约有 30%的价格增长。 云计算厂商对 AI 商业化进程加速持乐观态度，并上调资本开支，预计 2025 年北美四大云计算厂商总 CAPEX 达到 3,661 亿美元，同比增长 接近 50%，2026 年进一步增至 4,262 亿美元，推动 ASIC 和 PCB 需求 持续增加。 Q&A 近年来，AI 算力需求的增长对 ...

AI PCB 新材料对设备提出新要求？20250731 摘要 高多层板及 HDI 生产对 LDI 曝光机、真空二流体蚀刻线、PN 类型压机、 直接钻孔和垂直电镀线等设备需求旺盛，尤其脉冲整流器提升电镀电动 纵横比能力，增加设备价值。 22 层 5 阶 HDI 板生产需多次镭射加工、压合、机械钻孔和电镀填充， 设备产能需求远高于传统 PCB，例如需要 6 次压合、激光打孔和电镀填 充。 高端压机市场由博克和拉萨等国外品牌主导，交期长，部分企业通过国 内组装缩短交期，但顶级客户仍倾向选择知名品牌以确保质量。 镭射战机市场三菱公司占据主导地位，其产品以高产能著称，被广泛应 用于 HDI 技术，是现代电子制造业不可或缺的重要设备。 电镀设备市场中，水平层铜线和垂直连续电镀线是两种主要技术路线， 垂直连续电镀线因易于自动化和环境友好而备受青睐，并采用脉冲电流 提高阻抗比。 ASIC 产品制造中，Google 采用 16+2+16 机械盲孔设计，总共 34 层 板，需要多次钻孔、电镀和压合，对设备场地承重能力有严格要求。 电镀环节在 PCB 制造中投资价值巨大，高端 VCP 系统价格远高于线路 曝光机，一个现代化工厂可能 ...

Group 1: Company Operations and Capacity Utilization - The company's overall business operations are normal, with a comprehensive capacity utilization rate remaining relatively high. The PCB business benefits from sustained demand in computing power and automotive electronics, maintaining high capacity utilization [1] - The packaging substrate business has seen improved demand in the storage sector, with capacity utilization increasing compared to Q4 2024 and Q1 2025 [1] Group 2: Product Development and Project Progress - The company has achieved mass production capability for packaging substrates with up to 20 layers, and the technical development for products with over 20 layers is progressing as scheduled [1] - The Guangzhou packaging substrate project has entered its first phase, with production capacity steadily increasing and batch orders for BT and some FC-BGA products being accepted, although it is still in the early stages of capacity ramp-up [1][2] Group 3: Client Base and Market Position - The packaging substrate business serves a diverse client base, including IDM (Integrated Device Manufacturers), Fabless (semiconductor design companies), and OSAT (Outsourced Semiconductor Assembly and Test) manufacturers [3] Group 4: Expansion Plans and Technological Capabilities - The PCB business is expanding with factories located in Shenzhen, Wuxi, Nantong, and a new facility under construction in Thailand. The company is upgrading existing PCB factories to enhance capacity and is progressing with the Nantong Phase IV project to establish an HDI technology platform [4] - The company’s PCB business utilizes HDI technology, which allows for high-density wiring, primarily applied in communication, data centers, industrial control medical, and automotive electronics sectors [5] Group 5: Investment and Market Strategy - The total investment for the Thailand factory is 1.274 billion RMB, with construction progressing on schedule. The factory will have capabilities in high-layer and HDI PCB technologies, aiding in expanding overseas market reach [6] Group 6: Raw Material Price Trends - Key raw materials include copper-clad laminates, prepregs, copper foil, gold salts, and inks. In Q1 2025, prices for some raw materials, such as gold salts, increased year-on-year and compared to Q4 2024 due to commodity price fluctuations [7] Group 7: Compliance and Disclosure - The company adhered to the "Information Disclosure Management System" during the research process, ensuring no significant undisclosed information leaks occurred [8]