证券研究报告|电子 [Table_Title] 2024Q4 营收规模超百亿，先进封装盈利能 力有望提升 投资要点: ⚫ 2024Q4 单季度营收超百亿，再创单季度营收新高：2024 年第四季度， 营收方面，公司实现单季度营业收入 109.84 亿元，同比+18.99%，环比 +15.73%；毛利率方面，2024Q4 单季度毛利率为 13.34%，同比+0.17pct， 环比+1.11pct；营收再创单季度历史新高，毛利率有所提升，主要系下 游需求持续复苏，产能利用率提升。期间费用方面，2024Q4 销售费用 率 / 管 理 费 用 率 / 研 发 费 用 率 / 财 务 费 用 率 分 别 为 0.60%/3.58%/4.43%/0.32%，同比分别+0.05pct/+1.25pct/+0.55pct/- 0.93pct，期间费用整体同比+0.92pct；净利率方面，2024Q4 单季度净 利率为 4.93%，同比-0.45pct，环比+0.15pct，毛利率上升但净利率下 降，主要系费用率增长所致。归母净利润方面，2024Q4 公司实现归母 净利润 5.33 亿元，同比+7.28%，环比+16.63%。现 ...

Core Viewpoint - The change in controlling shareholder of Konka Group to China Resources is expected to revitalize the company, which has struggled in the competitive electronics market, particularly in the television sector [2][6]. Shareholder Change - On April 29, Konka Group announced that nearly 30% of its shares held by Overseas Chinese Town Group would be transferred to two wholly-owned subsidiaries of China Resources, with the actual controller remaining the State-owned Assets Supervision and Administration Commission [2][3]. - Following the announcement, the stock price of Shen Konka A surged by 42% from the closing price on April 8, reaching 5.45 yuan [2]. Business Transition - The transfer of shares will result in China Resources' subsidiaries, Panshi Run Chuang and He Mao Company, holding approximately 30% of Shen Konka's shares, with Panshi Run Chuang owning about 21.76% of A shares [3]. - Konka Group, founded in 1980, has undergone significant changes, with the new controlling shareholder expected to enhance its capital support and resource allocation [3][4]. Industry Synergy - Experts believe that China Resources' diverse business portfolio, including real estate and microelectronics, could create synergies with Konka's smart home and semiconductor operations [4]. - However, there are concerns about potential competition between Konka's semiconductor business and China Resources' Jiangsu Changdian Technology, leading to commitments to avoid conflicts [4]. Financial Performance - In Q1 2024, Konka reported revenue of 2.544 billion yuan, a year-on-year increase of 3.32%, but still faced a net loss of 440 million yuan after adjustments [6]. - The 2024 financial report indicated a significant decline in revenue to approximately 11.1 billion yuan, down 37.73% year-on-year, with a net loss of about 3.3 billion yuan [6][8]. Market Challenges - The television market has become increasingly competitive, with a reported decline in overall shipments in 2024, highlighting the challenges faced by Konka in maintaining its market position [7]. - Despite efforts to pivot towards semiconductor technology, Konka's semiconductor and storage chip business accounted for only 1.53% of total revenue, reflecting a nearly 95% year-on-year decline [8]. Future Outlook - Analysts suggest that Konka must undergo significant transformation to survive, as its traditional television business faces challenges from outdated branding and product misalignment [8].

如果您希望可以时常见面，欢迎标星收藏哦~ 自半导体工业诞生以来，集成电路就一直被封装在封装件中。最初的想法主要是保护内部脆 弱的硅片不受外部环境的影响，但在过去的十年中，封装的性质和作用发生了巨大的变化。 虽然芯片保护仍然重要，但它已成为封装中最不引人关注的作用。 本文探讨了封装领域最大的变化，即通常所说的先进封装。先进的含义并没有明确的定义。相反， 该术语广泛涵盖了多种可能的封装方案，所有这些方案都比传统的单芯片封装复杂得多。先进封装 通常封装了多个元件，但组装方式却千差万别。 在这种讨论中，经常会提到 2.5D 或 3D 封装，这些描述指的是内部元件的排列方式。 本文首先讨论了从外部观察到的封装类型，然后向内讨论了高级封装所集成的基本组件。之后，将 更详细地探讨每个组件。大部分讨论将涉及高级软件包的各种组装过程。文章最后探讨了任何技术 讨论都必须涉及的四个主题--工程师如何设计先进封装、如何对其进行测试、先进封装的总体可靠 性影响以及任何安全影响。 文章还简要讨论了两个相关的广泛话题。首先是键合。虽然这是封装的一个必要组成部分，但它本 身也是一个很大的话题，在此不作详细讨论。其次是不属于集成电路但可能包含 ...

Group 1 - The core viewpoint is that the semiconductor industry is entering a golden decade driven by AI technology, with global semiconductor revenue expected to exceed $1 trillion in the next ten years [1] - The company emphasizes the importance of sustainable supply chain development through collaboration in four key areas: technological innovation, supply chain resilience, ESG priority projects, and expanding strategic partnerships [1] - The company held an award ceremony for the best suppliers, inviting 140 partners from various sectors, highlighting the importance of collaboration within the semiconductor supply chain [1] Group 2 - This year, the evaluation criteria for the best suppliers have been expanded to include ESG practices and performance, with 17 suppliers recognized for their achievements [2] - The company has partnered with 19 equipment suppliers to promote energy-saving designs, aiming for a 20% reduction in energy consumption by 2030 [2] - The global marketing director of SEMI noted that the company continues to lead the semiconductor supply chain towards advanced technology and sustainable transformation through close collaboration with customers and partners [2]

Group 1 - The company, Qizhong Technology, plans to issue convertible bonds totaling no more than 850 million yuan, with net proceeds allocated to specific projects [1][2] - The convertible bonds will be listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board and have a maturity of six years [1][2] - The company reported a revenue of 1.96 billion yuan for 2024, a year-on-year increase of 20.26%, but a net profit of 313.28 million yuan, a decrease of 15.71% [2] Group 2 - The company successfully raised 2.42 billion yuan in its initial public offering, with a net amount of 2.23 billion yuan after expenses [3] - The funds raised will be used for various projects, including advanced packaging and testing production bases [3] - The underwriting fees for the issuance totaled approximately 187.37 million yuan [3][4]

Core Viewpoint - The demand for semiconductor packaging is increasing due to the rise of artificial intelligence, leading companies to shift towards Fan-Out Panel Level Packaging (FOPLP) for better efficiency and cost reduction [1][2]. Group 1: Industry Developments - Taiwan's panel manufacturer Innolux plans to start mass production of FOPLP in the first half of 2025, aiming to surpass competitors like TSMC and ASE [1][2]. - ASE has invested $200 million to develop large-size FOPLP technology, expanding substrate size from 300mm x 300mm to 600mm x 600mm, with equipment expected to arrive in Q2 and trial production in Q3 [2]. - TSMC is focusing on micro FOPLP production lines, with expectations to achieve results within three years, favoring a 300mm x 300mm size over the rumored 515mm x 510mm [2]. Group 2: Technical Advantages - Current CoWoS packaging technology uses circular substrates, which limit chip placement as size increases. In contrast, FOPLP utilizes rectangular substrates, allowing for more chips per panel, thus improving utilization and reducing costs [2].

股票简称：蓝箭电子 股票代码：301348 佛山市蓝箭电子股份有限公司 FOSHAN BLUE ROCKET ELECTRONICS CO.,LTD. （佛山市禅城区古新路 45 号） 首次公开发行股票并在创业板上市之 上市公告书 保荐人（主承销商） （海口市南宝路36号证券大厦4楼） 二零二三年八月 特别提示 佛山市蓝箭电子股份有限公司（以下简称"蓝箭电子"、"本公司"、"发行 人"或"公司"）股票将于 2023 年 8 月 10 日在深圳证券交易所创业板上市。本公 司提醒投资者应充分了解股票市场风险及本公司披露的风险因素，在新股上市初期 切忌盲目跟风"炒新"，应当审慎决策、理性投资。 如无特别说明，本上市公告书中的简称或名词的释义与本公司首次公开发行股 票并在创业板上市招股说明书中的相同。 2 第一节 重要声明与提示 一、重要声明与提示 本公司及全体董事、监事、高级管理人员保证上市公告书的真实性、准确性、完 整性，承诺上市公告书不存在虚假记载、误导性陈述或者重大遗漏，并依法承担法律 责任。 深圳证券交易所、有关政府机关对本公司股票上市及有关事项的意见，均不表明 对本公司的任何保证。 本公司提醒广大投资者认 ...