超讯通信公告，公司于2023年11月与沐曦股份签订合作协议，约定2024年和2025年每年完成1万颗GPU 产品进货业绩目标。截至本公告日，公司已下达8841颗GPU产品进货订单，其中2024年进货222颗， 2025年进货4189颗。剩余4430颗订单已下达但尚未提货，公司将根据落地机房等条件成熟情况尽快提货 交付。公司与沐曦股份已签署新协议，继续开展紧密合作。 ...

图片来源：unsplash 在硅基文明的编年史中，2025年，AI芯片不再是孤立的硅片，而是一个主权与霸权的，生产永不停歇 的货币替代品。 前不久，《时代》杂志年度人物出炉，授予了"人工智能设计师"（the architects of AI）群体。 封面上，英伟达CEO黄仁勋、AMD CEO苏姿丰、OpenAI CEO萨姆·奥尔特曼（Sam Altman）、诺奖得 主同时也是谷歌DeepMind公司CEO的德米斯·哈萨比斯（Demis Hassabis）、有"AI教母"之称、同时也是 World Labs创始人的李飞飞，挤坐在一条空中横梁上，COS着1932年的著名照片《摩天大楼顶上的午 餐》。 图片来自《时代》杂志官网 这张照片引发了巨大争议。不少观点认为，媒介视角已经从赞美普通劳动者到追捧亿万富翁，无异于在 通胀高企，失业率攀升的当下，给大众补了几刀。 但也有人觉得，科技发展一向是精英引领，作为一份商业期刊，评选这些人成为年度人物是应有之义。 而更为促狭的解读是，这张封面，正是当前AI产业的现状——悬空而置、挤作一团。 这就像是一种隐喻，也像是对"AI泡沫论"的一种回响。但，投融资、产业的狂热，竞争的白热 ...

"国产GPU四小龙"之一的壁仞科技（06082.HK）计划于2026年1月2日挂牌，有望成为港股首只GPU股。日前，公 司招股活动结束，孖展金额高达约3843.79亿港元。 此次IPO，公司计划发行2.4769亿股股份，发售价区间设定为每股17-19.6港元，预计募资金额约为42.1亿-48.5亿港 元。 尽管已经收获了豪华的基石投资者，但当招股书的细节被置于聚光灯下，这家估值超百亿元的企业三年累计亏损 超63亿元、客户集中等风险还是清晰暴露在了投资者面前……资本盛宴背后，壁仞科技正面临多重考验。 三年半亏损超63亿元 壁仞科技成立于2019年，是国内领先的通用智能计算解决方案提供商，产品已应用于 AI 数据中心、电信、AI 解 决方案、能源及公用事业、金融科技及互联网等关键行业。 然而，公司自成立以来持续产生净亏损，2022年-2024年分别亏损14.74亿元、17.44亿元、15.38亿元。今年上半年 又亏损16亿元，近三年半时间净亏损合计超过63亿元。 造成如此大规模亏损的原因之一，是壁仞科技在报告期内产生了大额经营开支，特别是研发开支。2022年-2025年 上半年，公司研发费用分别达到了10.18亿 ...

Core Insights - The report highlights the ongoing iteration of large model technology, leading to a wave of innovation in AI-enabled consumer electronics, particularly in edge AI deployment, which offers low cost, high performance, and enhanced privacy security [4][20][26]. Group 1: Industry Performance - The electronic industry has shown a relative return of 30.2% over the past 12 months, outperforming the CSI 300 index, with an absolute return of 47.9% [3]. - Traditional consumer electronics have entered a phase of low growth, with smartphone and PC sales stabilizing, while TWS (True Wireless Stereo) devices are also experiencing slow growth [15]. Group 2: Edge AI Development - The development of model compression technology has laid the groundwork for deploying large models on edge devices, enhancing the capabilities of edge AI [21][26]. - Companies like Huawei and ByteDance are showcasing significant applications of edge AI in smartphones, with products like the Doubao mobile assistant demonstrating the potential for complex operations and cross-application functionality [30][32]. Group 3: ASIC Demand - The demand for ASIC (Application-Specific Integrated Circuit) is surging due to its cost-effectiveness and customization advantages over GPUs, with the market expected to grow from $6.6 billion in 2023 to $55 billion by 2028, reflecting a compound annual growth rate (CAGR) of 53% [5][71]. - Major tech companies are increasingly developing their own ASICs, with Google and Amazon leading the way in supplying these chips, further validating their performance and commercial value [9][71]. Group 4: PCB Market Growth - The demand for PCBs (Printed Circuit Boards) is expected to rise as AI companies and global internet giants invest heavily in data center expansions, with a projected CAGR of 21% in global data center capital expenditures by 2029 [6]. - The increasing complexity of AI servers and high-speed switches is driving up the value of individual PCBs, leading to a simultaneous increase in both volume and price [6][68]. Group 5: Investment Recommendations - The report suggests focusing on companies within the edge AI, ASIC, and PCB supply chains, maintaining a bullish outlook on the electronic industry [8][9]. - Specific companies to watch include Rockchip, Hengxuan Technology, and Horizon Robotics in the edge AI sector, and Chipone and Cambrian in the ASIC sector [9].

Core Viewpoint - The company, Moore Threads, has experienced a significant decline in market value, losing over 1,066.87 billion yuan in just 13 trading days following its IPO, raising concerns about its financial management and investment strategies [1][3]. Group 1: IPO and Financial Performance - Moore Threads' stock closed at 587.90 yuan, reflecting a drop of 3.50% [1]. - The company went public on December 5, 2025, on the Shanghai Stock Exchange's Sci-Tech Innovation Board, issuing 70 million shares at a price of 114.28 yuan per share, which accounted for 14.89% of the total post-issue share capital [1]. - The total funds raised from the IPO amounted to 799.96 million yuan, with a net amount of 757.61 million yuan after deducting issuance costs, which were 42.35 million yuan [2][1]. Group 2: Use of Funds - The company plans to use the raised funds for the development of new AI training and inference chips, graphics chips, and AI SoC chips, as well as to supplement working capital [1]. - A significant portion of the raised funds, up to 750 million yuan, will be allocated for cash management to enhance the efficiency of fund utilization, without affecting the implementation of investment projects [2][3]. - The decision to manage idle funds has sparked controversy, as over 90% of the raised capital is being directed towards financial management rather than direct investment in projects [3].

人民财讯12月31日电，希荻微(688173)12月31日公告，公司拟以现金方式收购曹建林、曹松林、深圳市 链智创芯管理咨询合伙企业（有限合伙）、深圳市汇智创芯管理咨询合伙企业（有限合伙）合计持有的 深圳市诚芯微科技股份有限公司（简称"诚芯微"）100%的股份。根据银信资产评估有限公司以2025年6 月30日为基准日出具的评估报告，诚芯微股东全部权益价值评估值为3.12亿元；参考评估值并经双方协 商确定，本次交易价格确定为3.1亿元。公司可通过本次交易快速吸收标的公司成熟的专利技术、研发 资源、销售渠道和客户资源等，快速扩大公司的产品品类，从而有利于公司拓宽在电源管理芯片、电机 类芯片、MOSFET和电池管理芯片等领域的技术与产品布局，为更多下游细分行业客户提供更为完整的 解决方案和对应的产品。 ...

证 券 研 究 报 告 AI电源两大重要方向：ACDC模块及电源管理芯片！ ——AIDC电源系列研究之2 证券分析师： 杨海晏 A0230518070003 杨紫璇 A0230524070005 联系人：杨紫璇 A0230524070005 2025.12.31 投资要点 证券研究报告 www.swsresearch.com 2 ◼ 2025年全球/中国服务器电源市场有望达316/91亿元。服务器电源产品的价值量随着功率的提升而提升。 ◼ 方向1——ACDC电源模块：大陆电源厂商加速崛起。在服务器电源领域，市场份额主要由台达、光宝等 企业占据。全球服务器电源生产企业集中在中国台湾省，前十企业中国台湾占据五家，市场占比60%左 右；中国大陆电源厂商麦格米特挤进前十，占比6%。 ◼ 方向2——DCDC电源管理芯片：多相电源是多相控制器与DrMOS的组合，可为高性能计算提供供电方 案。通过多相控制器和智能功率级模块的组合使用，将多个降压电路的输出并联使用，从而输出数百安 培到数千安培的电流，适用于超大功率供电的需求。以英伟达GPU为例，预计V100到B300单卡DrMOS 价值量增长约4倍！我们预计未来3年国内AI ...

Core Viewpoint - The A-share market in 2025 experienced a significant overall rise, with the Shanghai Composite Index up 18.4%, the ChiNext Index soaring nearly 50%, and the Shenzhen Component Index increasing close to 30%. This year marked a rare "true bull market" with over 4,000 stocks rising, accounting for nearly 80% of the total [1]. Group 1: Top Bull Stocks - The top bull stocks of 2025 were driven by trends in AI and mergers and acquisitions, with significant price increases observed across the board [3]. - **Shangwei New Materials**: Achieved a staggering 1827.3% increase due to a control change and a shift from traditional chemicals to humanoid robots, supported by a strong recovery in its main business [4][5]. - **Tiangpu Co., Ltd.**: Experienced a 1645.4% rise, fueled by expectations of a shell merger with an AI chip company, capitalizing on the booming demand for AI models [8][10]. - **ST Yushun**: Saw a 719.4% increase as it successfully transitioned from its old business to AI infrastructure, supported by a significant acquisition [11][12]. - **ST Yanzhen**: Increased by 636.7% due to asset injection and a change in control, transforming its traditional home goods business into a resource stock [13]. - **Shenghong Technology**: Rose by 586.0%, benefiting from its position as a Tier 1 supplier to Nvidia and the growing demand for AI server PCBs [14]. - **Changwo Technology**: Achieved a 581.7% increase, driven by surging orders in the wind power and new energy vehicle sectors [15][16]. - **Feilinger**: Increased by 568.5% due to a change in control and expectations of transitioning to AI home products [17]. - **Dingtaikao Technology**: Saw a 567.1% rise, benefiting from the increased demand for AI server PCB materials [18]. - **Hengbo Co., Ltd.**: Increased by 527.0%, capitalizing on the dual benefits of PEEK material localization and new energy vehicle components [19]. - **Shunhao Co., Ltd.**: Achieved a 507.7% increase, driven by policy support for industrial hemp and new tobacco products [20]. Group 2: Top Bear Stocks - The top bear stocks of 2025 were primarily associated with risks of delisting and deteriorating operations [22]. - **Zitian Technology**: Experienced a dramatic decline of 98.4% due to long-term fraud and refusal to comply with regulatory checks, leading to its forced delisting [23]. - **Delisted Suwu**: Fell by 96.9% after years of inflated profits and financial hollowing, triggering delisting conditions [25]. - **Renle Co., Ltd.**: Dropped by 94.6% due to operational collapse and insolvency, reflecting the impact of e-commerce and mismanagement [27]. - **Guangdao Co., Ltd.**: Declined by 94.2% as the first delisted stock from the Beijing Stock Exchange, due to significant financial fraud [29]. - **Dongtong Co., Ltd.**: Fell by 91.8% due to internal strife and fraud, leading to governance issues [30]. - **Delisted Pengbo**: Experienced a 92.9% drop, marking a record for financial fraud in A-shares, resulting in forced delisting [31]. - **Hengli Co., Ltd.**: Dropped by 92.8% after 21 years of continuous losses, leading to its eventual delisting [32]. - **Gongzhi Co., Ltd.**: Fell by 91.1% due to a collapse in revenue and management issues [34]. - **Zhongcheng Co., Ltd.**: Experienced a 90.5% decline due to blind diversification into new energy and financial fraud [35]. - **ST Changyao**: Dropped by 82.7% due to price cuts from centralized procurement and ongoing fraud investigations [36].

如果您希望可以时常见面，欢迎标星收藏哦~ 世界与计算的关系正在发生变化——从集中式云到覆盖所有设备、表面和系统的分布式智 能。2026年，我们将进入智能计算的新时代——计算将更加模块化、节能高效，并在云 端、物理环境和边缘人工智能环境中无缝连接。 基于此，Arm预测以下20项技术将在2026年引领下一波创新浪潮。 1. 模块化芯片重新定义了硅设计 随着硅芯片行业不断突破技术极限，从单片芯片到模块化芯片设计的转变将加速。通过将计算、存 储和I/O分离成可重用的构建模块，设计人员可以混合使用不同的工艺节点，降低成本，并更快地 扩展规模。对模块化的日益重视将标志着芯片设计从"更大的芯片"向"更智能的系统"转变，使芯片 团队能够自由地混合使用不同的工艺节点，并快速定制片上系统 (SoC) 以适应各种工作负载。这 将推动可定制芯片的持续发展——这些高度可配置的模块将通用计算与特定领域的加速器、存储单 元或专用人工智能引擎相结合——使芯片团队无需从零开始即可构建差异化产品，从而显著缩短设 计周期并降低创新门槛。此外，预计行业标准化也将不断发展，新兴的开放标准将使来自不同供应 商的芯片能够可靠且安全地组合使用。这将降低集成 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 消息人士称，英伟达正努力满足中国科技公司对其H200人工智能芯片的强劲需求，并已与代工制 造商台积电接洽，以提高产量。 两位知情人士透露，中国科技公司已订购超过 200 万颗 H200 芯片，预计将于 2026 年交付，而 英伟达目前仅有 70 万颗库存。 他们表示，英伟达计划向台积电追加订购的具体数量尚不清楚。第三位消息人士称，英伟达已要求 台积电开始生产这些额外的芯片，预计将于2026年第二季度开始生产。 这些举措引发了人们对全球人工智能芯片供应是否会进一步收紧的担忧，因为英伟达现在必须在满 足中国强劲的需求和解决其他地区供应紧张的问题之间找到合适的平衡点。 这也可能加剧英伟达的风险，因为北京方面尚未批准任何H200芯片的出货。美国总统特朗普政府 直到最近才允许向中国出口H200芯片。 两位知情人士表示，2026 年超过 200 万颗芯片的订单主要来自中国大型互联网公司，这些公司 认为 H200 比他们目前可用的芯片有了显著的升级。 英伟达目前拥有 70 万颗芯片，其中约 10 万颗是 GH200 Grace Hopper 超级芯片，它将英伟达 的 Grace C ...