2025年11月20日，SesameX多维具身智能计算平台在上海浦东文华东方酒店首次完整亮相。在"多维进化，智赋新生"2025黑芝麻智能机器人平台产品发布会 上，当SesameX多维具身智能计算平台首次完整呈现在行业面前时，台下几十位来自机器人、智能驾驶、科研与投资界的领军人物，几乎不约而同地前倾了 身体——与其说是为技术的突破性所震撼，不如说是一种发自内心的认可：一个业界期盼已久、认为早该有人去做的事情，今天终于等到了。 这并不是一次普通的技术升级。它是业内首个真正面向机器人商业化部署的全栈计算平台。这是第一次有企业把感知、理解、推理、运动控制、安全体系全 部拉到同一套架构里，并且以车规级安全的标准去构建机器人"全脑"。 一个集成了车规级安全、异构算力、多模态感知、跨模组统一生态等特性的平台就此诞生，机器人领域或许正迎来属于自己的"安卓时刻"。 一、产业处于拐点：机器人从Demo时代迈向商业化时代 机器人新纪元已经到来 0 0 C 所有智能从数字世界溢出到物理世界的迹象，都在机器人身上集中重演：过去十年，智能先在互联网跃迁，再在车端扎根，如今它正向更复杂的物理场景 ——机器人渗透。市场数据也支撑了这一判断： ...

"这不是跨界转型，而是技术能力的自然扩展。机器人与汽车的核心零部件重叠度极高，芯片、传感器、电机等供应链可直接复用。"黑芝麻智能机器人业务 负责人徐劲博士在接受经济观察报等媒体采访时表示。而车规级ISO 26262功能安全标准的引入，让SesameX平台在医疗、电力等对安全性要求极高的场景 中形成差异化优势。 产业爆发的关键在于生态协同。发布会上，黑芝麻智能公布了首批机器人合作伙伴名单，包括云深处、傅利叶智能、极智嘉、联想等11家企业，覆盖商用服 务、特种作业、具身智能等多个细分领域。同时，黑芝麻智能与均胜电子达成战略合作，计划联合推出机器人头部总成和域控制器；黑芝麻智能还与湖北华 中电力科技达成合作，双方将在监控跟踪高危作业、配网带电登高作业等深入合作。 从商业化进度来看，黑芝麻智能已具备一定的先发优势。据透露，黑芝麻智能自2024年底已启动机器人业务落地并产生收入，目前处于卡位布局阶段。"商 业化进程将加速，因为我们提炼的通用平台更符合客户需求。"黑芝麻智能首席市场营销官杨宇欣表示，机器人业务将成为公司"第二增长曲线"，长期目标 是在上市公司营收中占据重要比重。 值得一提的是，当前，AI芯片和工业机器人核 ...

Core Viewpoint - The launch of the SesameX multidimensional intelligent computing platform marks a significant expansion of the company's development path from smart driving to the embodied intelligence industry, showcasing a combination of technology, experience, and overall capability [3][6]. Group 1: Product Overview - SesameX is the industry's first full-stack self-evolving platform that supports whole-brain intelligence for commercial deployment in robotics, addressing key industry pain points such as safety, system integration, and algorithm evolution [6][8]. - The platform consists of a comprehensive system from hardware to software, including self-developed modules and a neural communication layer [8][10]. Group 2: Technical Structure - The SesameX system architecture is divided into four layers: the computing platform with three self-developed modules (Kalos, Aura, Liora), the middleware layer, the atomic application layer, and the safety assurance layer [8][10]. - Kalos is designed for low-speed robotic applications, Aura serves high-performance heterogeneous computing needs, and Liora acts as the all-encompassing brain for embodied intelligence [9][10]. Group 3: Safety and Evolution - The platform emphasizes safety as an intrinsic attribute rather than a standalone feature, encapsulated in the principle "Action = Safety" [10]. - Future robots are envisioned as self-evolving intelligent entities rather than mere program executors, enabled by the SesameX architecture [10]. Group 4: Strategic Partnerships and Deployment - The company has established strategic partnerships with various firms, including Junsheng Electronics and Hubei Huazhong Electric Power Technology, to explore applications in the robotics field [11]. - Commercial deployments of the SesameX platform have already been realized with partners, showcasing its core value in logistics and robotic applications [10].

Core Insights - The next decade is expected to usher in a "robotic new era," with significant advancements in the integration of intelligent technology into the physical world [2] - Black Sesame Intelligence has launched the SesameX multidimensional intelligent computing platform, marking the industry's first dedicated deployment platform for commercial robots [2][5] Group 1: Company Developments - Black Sesame Intelligence's founder and CEO, Dan Jizhang, emphasized the company's experience in the smart automotive sector will support new applications in robotics, aiming to drive the evolution of embodied intelligence [4][5] - The SesameX platform is designed to address four major technical pain points in the robotics industry, including safety mechanisms and system integration [7][11] - The platform consists of a four-layer system architecture, including a computing platform, middleware, atomic application layer, and a comprehensive safety framework [8][11] Group 2: Technological Innovations - The SesameX platform features three core computing modules: Kalos, Aura, and Liora, each targeting different levels of robotic intelligence and capabilities [8][11] - Kalos is designed for low-speed robotic applications, while Aura serves as a high-performance computing platform for more complex robotic tasks [8][11] - Liora is positioned as the most advanced robotic brain, capable of handling complex tasks with a processing power of nearly 600 TOPS [11] Group 3: Market Strategy and Collaborations - Black Sesame Intelligence aims to foster an open ecosystem for robotics, collaborating with various partners to drive the commercialization of robotic solutions [12][13] - The company has already established partnerships with several firms, including Junsheng Electronics and Hubei Huazhong Electric Power Technology, to explore applications in the robotics sector [13] - The launch event included a roundtable forum discussing the future of intelligent robotics, featuring experts from academia and industry [13]

Group 1: Company Updates - Ansem Semiconductor welcomes the U.S. authorities' decision to suspend the "penetration rule" for one year, which could have impacted its operations as a subsidiary of Wingtech Technology [1] - Ansem has had to suspend direct wafer supply to its factories in China since October 29, while operations in Europe and other regions continue normally [1] - Honda is adjusting its strategy to manage existing parts amid ongoing semiconductor supply chain issues affecting the automotive industry [1][2] Group 2: Automotive Industry Insights - The automotive industry has faced multiple production disruptions due to natural disasters and supply chain issues, highlighting the importance of supply chain stability [2] - China's automotive production and sales are projected to reach 31.28 million and 31.43 million units in 2024, with a year-on-year growth of 3.7% and 4.5% respectively [3] - The penetration rate of new energy vehicles in China is expected to exceed 40%, providing significant market demand for automotive chip manufacturers [3] Group 3: Semiconductor Market Developments - Domestic automotive chip production is accelerating, with a high import ratio still present in the automotive chip market [4] - Horizon Robotics announced that its chip family has surpassed 10 million units in production, indicating a strong growth trajectory in the SoC segment [5] - Black Sesame Technologies has successfully integrated its A1000 chip into multiple vehicle models, with plans for further production in 2025 [5][6] Group 4: MCU and Power Device Trends - The automotive MCU market is expected to exceed 100 billion by 2029, with domestic MCU production rapidly increasing [7] - Chip manufacturers like Chipone Technology and GigaDevice have reported significant milestones in MCU and SoC product lines, indicating robust growth in the automotive electronics sector [7] - Power devices are becoming increasingly critical in hybrid and electric vehicles, with domestic manufacturers like Silan Microelectronics gaining market share [11][12] Group 5: Industry Challenges and Future Outlook - The automotive semiconductor industry faces challenges in high-end product capacity, while domestic brands are covering mid-to-low-end products [8] - The Chinese automotive semiconductor market is expected to grow, but collaboration among automakers, Tier 1 suppliers, and chip manufacturers is essential for a complete development model [14] - The future of the semiconductor supply chain will require a shift from linear models to collaborative networks among various stakeholders [14][15]

Group 1 - The core viewpoint of the news highlights the positive market response to Hezhima's stock, which saw a rise of over 6% due to recent developments in the intelligent driving sector in China [1] - The Ministry of Industry and Information Technology has released a draft for mandatory national standards on intelligent connected vehicles, establishing safety baselines for these products [1] - The government is promoting the industrial application of intelligent connected technology and has proposed conditional approval for L3 level vehicle production [1] Group 2 - According to Puyin International, the A1000 high-speed NOA solution is set to enter mass production in passenger vehicles starting in 2023, with extensive validation already completed [2] - Hezhima has deepened cooperation with core existing customers, expanding from driver assistance to cabin and driving integration, which is expected to significantly boost shipment volume and revenue by 2025 [2] - The company anticipates shipping over 300,000 A1000 units and is exploring potential growth opportunities through overseas projects and collaborations based on the C1200 series [2]

Group 1 - The stock of Hezhima Intelligent (02533) rose over 6% recently, with a current price of 20.26 HKD and a trading volume of 664 million HKD [1] - The Ministry of Industry and Information Technology of China has released a draft for mandatory national standards on intelligent connected vehicles, establishing a safety baseline for these products [1] - The draft requires that systems can only be activated under their designed operating conditions, indicating a regulatory push towards safer intelligent driving technologies [1] Group 2 - According to Puyin International, the high-speed NOA solution based on Huashan A1000 will begin mass production in passenger vehicles starting in 2023, having undergone thorough validation [2] - Hezhima Intelligent has deepened cooperation with core existing customers this year, expanding from driver assistance to cabin and driving integration [2] - The company is expected to benefit from the trend of domestic automakers accelerating the deployment of vehicles equipped with NOA features, with projected shipments of A1000 exceeding 300,000 units by 2025 [2]

Core Viewpoint - The article highlights the journey and vision of the company Black Sesame Intelligence, focusing on its development of advanced intelligent driving chips and the broader implications for the automotive and AI industries. The founder, Dan Jizhang, emphasizes the importance of safety in driving and the potential of intelligent driving technology to significantly reduce accident rates. Group 1: Company Overview - Black Sesame Intelligence was founded in 2016 and launched its first mass-produced intelligent driving chip, the "Hua Shan A1000," in 2020, which has been adopted by several major automotive brands [1][2]. - The company has since developed the "Wudang" series of chips, such as the C1236 and C1296, which integrate cockpit management and intelligent driving tasks, thereby reducing costs for automakers [1][2]. Group 2: Technological Advancements - The latest chip, the Hua Shan A2000, utilizes a 7nm process and offers performance comparable to 4nm flagship chips, supporting L3-L4 level autonomous driving [2]. - The company aims to break traditional chip application boundaries by expanding into various forms of robotics, promoting a "one chip, multiple functions" approach [2]. Group 3: Market Trends and Opportunities - The global intelligent automotive market is projected to exceed $500 billion by 2030, with an annual growth rate of over 20%, and China is expected to reach a 40% market share in smart vehicles by 2025 [6]. - The company recognizes the challenges of high R&D costs and the need for substantial investment in software and tools for mass production [6]. Group 4: Strategic Partnerships and Ecosystem - Black Sesame Intelligence positions itself as a full-process technology partner, providing not only chips but also algorithms and development support, which enhances collaboration with automotive manufacturers [7]. - The company emphasizes the importance of an open ecosystem to achieve scale, as the development cost of automotive-grade chips can exceed $100 million [8]. Group 5: Future Outlook - Black Sesame Intelligence plans to go public in Hong Kong, becoming the first listed company focused on automotive-grade chips, which reflects its strategic foresight [9]. - The company is also exploring the integration of vehicle and road technologies, aiming to reduce costs and improve efficiency in traffic management systems [12]. Group 6: Industry Challenges - The intelligent driving chip industry is expected to face a brutal elimination process, with only a few companies likely to survive due to intense competition [12]. - The company is aware of the geopolitical challenges affecting the chip industry but sees opportunities in the growing demand for AI-driven solutions and embodied intelligence [11].