Core Viewpoint - Photolithography is a crucial component of semiconductor manufacturing technology, serving as the starting process for each mask layer. The importance of photolithography lies not only in the demand for mask layers but also in its role in determining the limiting factors for the next technology node [1][9]. Group 1: Photolithography Process - The basic flow of photolithography includes spin coating photoresist, pre-baking, exposure, and development. The prerequisite for device photolithography is the design and manufacturing of the mask [3][26]. - Photolithography technology can be divided into mask-based and maskless lithography. Maskless lithography is currently limited by production efficiency and photolithographic precision, making it unsuitable for large-scale semiconductor manufacturing [3][26]. - The production of photomasks involves three main stages: CAM layout processing, photolithography, and inspection. The mask patterns are typically generated directly on blank mask substrates using direct-write lithography [41][42]. Group 2: Market Trends and Projections - In 2024, the combined market size for wafer exposure equipment, photolithography processing equipment, and mask manufacturing equipment is projected to be approximately $29.367 billion. With the introduction of 2nm processes, the demand for EUV lithography is expected to increase, with related equipment projected to reach $31.274 billion by 2025 [7]. - The server, data center, and storage market is expected to grow at a compound annual growth rate (CAGR) of 9% from 2025 to 2030, driven by the explosive growth of AI, big data, and cloud computing applications. The total semiconductor sales scale is anticipated to exceed $1 trillion [7]. Group 3: Differences in Logic and Memory Chip Lithography - Logic chip metal interconnect layers are more complex, while memory chips (DRAM and NAND) have core storage arrays composed of highly regular line/space structures. The line width and spacing in memory chips are typically pushed to their limits and are very uniform [2][17]. - In DRAM, the word lines and bit lines are designed with the minimum possible line width to achieve maximum capacitance and minimal area occupancy. The challenges in pitch differ between logic circuits and storage arrays [2][17]. Group 4: Equipment and Technology - The imaging system of photolithography machines is critical to semiconductor photolithography technology, with lenses determining the resolution and imaging quality. DUV lenses typically use fluoride materials to ensure low absorption and high laser damage thresholds [6]. - The light source is a key factor determining the wavelength of photolithography machines. For wavelengths above 365nm, high-pressure mercury lamps are commonly used, while KrF and ArF lasers are used for shorter wavelengths [5][6]. Group 5: Advanced Lithography Techniques - Phase shift masks (PSM) introduce phase modulation elements in the light regions of the mask to enhance imaging contrast through interference. PSM can significantly improve resolution by nearly doubling it under the same numerical aperture/wavelength conditions [43][44]. - Attenuated PSMs allow a small portion of light to pass through the opaque regions, enhancing imaging contrast while maintaining a high degree of light absorption [44]. Group 6: Challenges in Lithography - The complexity of logic devices increases the difficulty of interconnecting devices in very small areas, necessitating multiple photolithography steps. Critical layers in logic devices require new processes to ensure performance and yield [24][30]. - The introduction of new technology nodes typically requires new equipment and materials, which are developed in tandem with new processes to produce higher-performance devices [30].

Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment within the semiconductor industry, emphasizing the need for domestic innovation and self-sufficiency in light of global supply chain vulnerabilities [26][35][36]. Group 1: Conference Overview - The conference will take place from July 9 to July 10, 2025, in Hefei, Anhui, at the Sheraton Hotel [30][25]. - It will feature over 20 speakers from the lithography industry, covering advanced lithography technologies, photoresists, and wet electronic chemicals [27]. - The event will include academic discussions and a combination of conference and exhibition formats to foster industry collaboration and resource integration [28][29]. Group 2: Industry Challenges - The domestic high-end photoresist supply rate is low, with significant gaps in research and production technology compared to international standards [34]. - There is a reliance on imports for high-purity and specialty wet electronic chemicals, which poses supply risks [34]. - The manufacturing of high-precision masks is challenging, with key raw materials primarily imported, leading to vulnerabilities in rapid repair and update technologies [34]. Group 3: Conference Agenda Highlights - The agenda includes specialized forums on advanced lithography technology, photoresists, and wet electronic chemicals, as well as discussions on the domestic industrialization of semiconductor lithography equipment [16][17][24]. - Key topics will include the development and application trends of advanced packaging materials and the challenges faced in the domestic production of lithography materials [18][19][22]. Group 4: Importance of Lithography Technology - Lithography technology is crucial for semiconductor manufacturing, directly impacting chip performance, integration, and production costs [34]. - The conference aims to enhance the domestic lithography industry's capabilities and competitiveness through expert discussions and collaborative efforts [35].

Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment, focusing on enhancing domestic capabilities in the semiconductor industry [22][23]. Conference Overview - The conference will take place on July 9-10, 2025, at the Sheraton Hotel in Hefei, Anhui, with an expected attendance of 300 participants [18][22]. - The event will feature over 20 speakers from the lithography industry, covering advanced lithography technologies, photoresists, wet electronic chemicals, and mask manufacturing [15][18]. Key Topics of Discussion - The conference will explore cutting-edge lithography technologies such as extreme ultraviolet (EUV), electron beam lithography, and nanoimprint lithography, along with the current state and technological bottlenecks of domestic photoresists and wet electronic chemicals [14][22]. - Discussions will also focus on the challenges faced in the localization of lithography equipment, including the development, manufacturing processes, and market conditions [14][22]. Industry Challenges - The domestic high-end photoresist supply rate is low, and there is a significant gap in research and production technology compared to international standards, affecting the quality and performance required for advanced chip manufacturing [22][23]. - The supply of high-purity and specialty wet electronic chemicals is heavily reliant on imports, posing risks to the supply chain [22][23]. Conference Highlights - The event will include academic discussions aimed at establishing a theoretical foundation for industry development, fostering deep integration of production, learning, and research [16][18]. - A roundtable forum will be held to facilitate interaction and resource integration among upstream and downstream enterprises in the lithography supply chain [17][18]. Keynote Speakers - Notable speakers include Ma Hao, a senior liquid chromatography engineer from Agilent Technologies, who will present on new trends in IC photoresist characterization [10][11].

Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment, focusing on enhancing domestic capabilities in the semiconductor industry [19][20]. Group 1: Conference Overview - The conference will take place on July 9-10, 2025, at the Sheraton Hotel in Hefei, Anhui, with an expected attendance of 300 participants [14]. - The event will feature over 20 guest speakers discussing various topics related to the lithography industry, including advanced lithography technologies and the development of photolithography materials [12][11]. Group 2: Key Topics and Discussions - Discussions will cover the latest research and application prospects of cutting-edge lithography technologies such as EUV, electron beam lithography, and nanoimprint [11]. - The conference will analyze the current state and technological bottlenecks of domestic photolithography materials, including photoresists and wet electronic chemicals, and explore solutions for improving self-sufficiency and quality [11][20]. Group 3: Featured Speakers and Presentations - Dr. Sam Sun, a leading scientist in the field of photoresists and founder of Weifang Xingtai Microelectronics Materials Co., will present on the historical and future perspectives of CAR photoresists [4][2]. - Other notable speakers include industry experts from various institutions discussing topics such as high-performance heterogeneous integration technology and the development of advanced packaging materials [7][8]. Group 4: Industry Challenges - The domestic photolithography industry faces significant challenges, including low self-sufficiency rates in high-end photoresists and reliance on imports for certain high-purity chemical products [19][20]. - The conference aims to foster collaboration among research institutions, universities, and enterprises to accelerate technological innovation and enhance the overall competitiveness of the lithography industry [20].

Core Viewpoint - The article discusses the challenges and potential solutions related to the implementation of high numerical aperture (NA) EUV lithography technology, particularly focusing on the issues of mask stitching and the implications of larger reticle sizes on manufacturing efficiency and yield [1][2][10]. Group 1: Challenges of High NA EUV Lithography - The transition to high NA (0.55) EUV lithography presents significant challenges in circuit stitching between exposure fields, impacting design, yield, and manufacturability [1][2]. - The use of deformable lenses in high NA systems reduces the exposure range of standard 6×6 inch masks by half, complicating the alignment and yield of critical layers [2][3]. - Misalignment issues can lead to significant errors in critical dimensions, with a 2nm mask overlay error potentially causing at least a 10% deviation in pattern sizes [2][4]. Group 2: Design and Performance Implications - Advanced lithography techniques require precise calibration to ensure accurate printing of features, with any overlap between masks needing careful consideration to avoid interference [4][5]. - The design of masks must account for the black border that prevents stray reflections, which can introduce stress relaxation and distort adjacent multilayer structures [5][6]. - Avoiding critical features in boundary areas is essential to mitigate yield risks, as misalignment can lead to increased wire lengths and potential performance degradation [7][8]. Group 3: Solutions and Optimizations - Strategies to optimize designs include clustering I/O ports and minimizing the number of lines crossing boundary areas, which can reduce the impact of stitching on performance [8][9]. - Implementing design rules specific to boundary areas can help ensure that features print correctly, although this may complicate overall design [8][9]. - The potential for larger reticle sizes (6×11 inches) is seen as a solution to eliminate stitching issues, although it poses significant challenges in terms of equipment costs and manufacturing processes [10][11]. Group 4: Industry Perspectives and Future Considerations - Industry experts express cautious optimism about larger reticle sizes, noting that while they could improve efficiency, the associated costs and equipment changes are substantial [10][11]. - The cost of EUV lithography machines is nearing $400 million, and their production efficiency is a critical factor affecting overall wafer fabrication costs [11]. - The shift to larger masks may be necessary for future technology nodes, particularly as the industry approaches 1nm technology, which will require upgrades to many existing tools [11].

Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment, fostering collaboration among experts and industry leaders to enhance the domestic semiconductor industry's capabilities [24][23]. Conference Details - The conference will take place on July 9-10, 2025, at the Sheraton Hotel in Hefei, Anhui, with an expected attendance of 300 participants [13][6]. - The agenda includes discussions on advanced lithography technologies, photolithography materials, and equipment, covering the entire industry chain [15][14]. Key Topics of Discussion - The conference will explore cutting-edge lithography technologies such as EUV, electron beam lithography, and nanoimprint lithography, along with the current state and technological bottlenecks of domestic photolithography materials [14][22]. - Specific sessions will focus on the development and challenges of photolithography resins, wet electronic chemicals, and mask manufacturing technologies [11][12]. Expert Participation - Notable speakers include Li Zili, a researcher from Fudan University, who will present on guided self-assembly lithography technology for integrated circuit manufacturing [10][7]. - The conference will feature over 20 industry experts sharing insights through keynote speeches and specialized discussions [15]. Industry Challenges - The domestic lithography industry faces significant challenges, including low self-sufficiency rates in high-end photolithography resins and reliance on imports for critical materials and equipment [22][23]. - The conference aims to address these challenges and promote technological innovation and industrial upgrades to enhance the competitiveness of the lithography sector [23][24].

Core Viewpoint - The 2025 TrendBank (Fifth) Photoresist Materials Industry Conference will be held on July 9-10, 2025, in Hefei, Anhui, focusing on the collaboration between industry, academia, and research to promote industry development [14]. Group 1: Conference Details - The conference will take place at the Sheraton Hotel in Hefei, with an expected attendance of 300 participants [7]. - The agenda includes discussions on semiconductor, display, and packaging photoresists, wet electronic chemicals, mask plates, and specialty gases, covering technological breakthroughs and application trends [7][12]. - Over 10 academic and research institutions have confirmed participation and will present at the conference [4]. Group 2: Agenda Highlights - The first day will feature an opening ceremony, speeches from guiding and organizing units, and sessions on advanced lithography technology and industry development [5]. - The second day will include topics such as the latest advancements in extreme ultraviolet lithography technology, electron beam lithography, and the development of new display technologies [6]. - The third day will focus on the application mechanisms and key technologies of wet electronic chemicals, the current state of the electronic specialty gas market, and advancements in lithography equipment [6]. Group 3: Market Context - The global competition in the photoresist materials market is intensifying, with increasing technological innovation and rising barriers to technology protection [12]. - The semiconductor chip industry demands high-performance and high-precision manufacturing processes, making photoresist materials critical components [12]. - China's share in the global photoresist market is steadily increasing, supported by various government policies aimed at fostering a favorable development environment for the industry [13].

Core Viewpoint - The 2025 TrendBank (Fifth) Photoresist Materials Industry Conference will be held on July 9-10, 2025, in Hefei, Anhui, focusing on the collaboration between industry, academia, and research to promote industry development [15][9]. Conference Overview - The conference will feature over 20 speakers from the photoresist materials industry, covering various topics related to application terminals, materials, equipment, and processes, providing new insights and prospects for the industry [8][10]. - The event aims to create an interactive platform for upstream and downstream supply chain connections [10]. Agenda Highlights - The agenda includes sessions on advanced lithography technology, market analysis of the Chinese photoresist market, and discussions on challenges and opportunities in new display technologies [5][7]. - Specific topics include the latest advancements in extreme ultraviolet lithography technology, electron beam lithography, and the development of new photoresists for displays [5][7]. Industry Context - The photoresist materials market is characterized by increasing global competition, accelerated technological innovation, and rising barriers to technology protection [13][14]. - The demand for high-performance and high-precision manufacturing processes in the semiconductor chip industry is driving the need for advancements in photoresist materials [14]. Participation and Registration - The conference is expected to host around 300 participants, with registration fees set at RMB 2600 before June 30 and RMB 2800 thereafter [11][9]. - Participants will receive conference materials, guest speaker presentations, and access to meals and a banquet [11]. Background and Significance - The development of the photoresist materials market is crucial for achieving breakthroughs in cutting-edge technology and ensuring the stability and diversification of the supply chain [14]. - Recent government policies at various levels aim to create a favorable environment for the growth of the photoresist materials industry, emphasizing the importance of achieving "win-win" scenarios across the industry chain [14].

Core Viewpoint - The 2025 TrendBank Photoresist Materials Industry Conference will focus on the collaboration between industry, academia, and research to promote the development of the photoresist materials sector, amidst increasing global competition and technological innovation in the semiconductor industry [4][6]. Group 1: Conference Background - The photoresist materials market is experiencing intensified global competition, accelerated technological innovation, and rising barriers to technology protection as of 2025 [4]. - The demand for high-performance and high-precision manufacturing processes in the semiconductor chip industry is driving the need for advancements in photoresist materials [4]. - The international landscape is marked by a blend of cooperation and competition, presenting both significant opportunities and challenges for the photoresist materials industry [4]. Group 2: Industry Development - The growth of China's photoresist materials market is not only a trend but also a crucial element for achieving breakthroughs in cutting-edge technology at the national level [5]. - Various supportive policies have been introduced at both national and provincial levels to create a favorable environment for the development of photoresist materials and related industries [5]. - Companies in the photoresist materials supply chain should seize the opportunity to strengthen their capabilities and pursue a "win-win" strategy across the industry [5]. Group 3: Conference Details - The 2025 TrendBank Photoresist Materials Industry Conference will be held on July 9-10, 2025, in Hefei, Anhui, with a focus on "collaboration between industry, academia, and research to support industry development" [6]. - The conference will cover discussions on semiconductor, display, and packaging photoresists, as well as wet electronic chemicals and specialty gases, addressing technological breakthroughs and application trends [6][9]. - The event will feature over 20 industry chain guest speakers, academic discussions, and a combination of conference and exhibition formats to foster industry interaction and supply chain connections [8][9].