Group 1 - The core viewpoint of the article highlights the significant demand for High Bandwidth Memory (HBM) due to AI servers, leading to a supply shortage of standard DRAM for personal computers, laptops, smartphones, and general servers [1][2] - SK Hynix, the world's second-largest memory manufacturer, is actively expanding its standard DRAM production capacity, aiming for over a 10% increase in supply by 2026 compared to 2025 [1][2] - The company is adjusting production strategies at its main wafer fabs, M15 and M16, to enhance capacity utilization and convert some production lines to DRAM manufacturing [1][2] Group 2 - Despite being a leader in the HBM market with a market share of 70% to 80%, SK Hynix recognizes that the standard DRAM market is significantly larger, making it a strategic focus to meet this demand while maintaining its AI memory leadership [2] - The competitive landscape includes Samsung, which is also expanding its DRAM capacity, utilizing its P3 alternative factory and planning to increase capacity at P4 [2] - Market analysts expect global DRAM supply to see double-digit growth by 2026, supported by SK Hynix's commitment to invest up to 106.2 trillion Korean Won from 2022 to 2027 [2]

人工智能（AI）相关需求激增，美国银行（BofA）近期上修全球半导体销售展望，估计到2027年可能 逼近1兆美元，高于原本预估的8,600亿美元。 美银预测，半导体销售将在2025年达7,450亿美元、2026年升至8,700亿美元、2027年续增至9,710亿美 元，跟先前预估相比，调高幅度在3%-6%间。若不计存储器，这三年的半导体销售则分别为5,380亿美 元、6,210亿美元、7,060亿美元。 美银也调升半导体制造设备开支展望，估计2025年为1,180亿美元、2026年为1,280亿美元、2027年为 1,380亿美元。资本密集度可能维持在14%到17%，较长期平均值的13%，高出一到四个百分点，反映芯 片复杂性提高、AI基建需求。 美银并重申半导体的五大首选股，分别是英伟达、博通、超微（AMD）、科林研发（Lam Research）、科磊（KLA），看好相关业者在资料中心和存储器展望方面，握有筹码。 美银分析师提出报告，尽管消费端和车用市场的动能疲弱，略为抵销涨幅，但存储器的成长前景明显提 高，包括高频宽存储器（HBM）、标准型DRAM、NAND，资料中心与AI相关零组件的前景也更佳。 美银持续 ...