新华财经北京9月23日电（记者闫鹏、刘旭阳）近日，在市场持续调整下，算力硬件股依然展现强劲活力，华勤技术便是其中的典型代表，这背后是来自 AI算力高景气的支撑。2025年上半年，华勤技术实现营业收入839.39亿元，同比增长高达113.06%，数据业务成为其增速最快的业务之一。 新华财经调研了解到，华勤技术正从消费电子ODM（硬件原始设计制造）龙头向AI服务器领域多维跃迁。依托服务器领域全栈式产品矩阵，华勤技术已 成为阿里、腾讯、字节跳动核心供应商，今年在数据业务上继续加大投入积极备货，随着国内外云厂商资本开支落地，华勤技术数据业务将迎来更大增长 空间。 数据业务营收有望超400亿元 2005年，华勤技术从手机方案设计业务（IDH）起家，目前已构建起"3+N+3"全球智能产品大平台，即以智能手机、笔记本电脑、服务器三大成熟业务为 基石，衍生智慧生活、商业数字生产力及数据中心全栈解决方案的"N"生态，并锚定机器人、汽车电子、软件三大新兴赛道。 2025年上半年，华勤技术凭借多元业务实现强劲增长，实现营业收入839.4亿元，同比增长113.1%；实现归母净利润18.9亿元，同比增长46.3%。智能手 机、个人电脑 ...

Core Viewpoint - Co-packaged optics (CPO) technology is emerging as a promising solution to enhance bandwidth and energy efficiency in data centers, particularly for applications involving generative AI and large language models. However, manufacturing challenges remain, particularly in fiber-to-photonics integrated circuit (PIC) alignment, thermal management, and optical testing strategies [1][20]. Group 1: CPO Technology and Benefits - CPO enables network switches to route signals at speeds of terabits per second while significantly improving bandwidth and reducing power consumption required for AI model training [1][20]. - The technology achieves a bandwidth density of 1 Tbps/mm, optimizing rack space in increasingly crowded data centers [1][6]. - CPO can reduce power consumption associated with high-speed data transmission from approximately 15 pJ/bit to around 5 pJ/bit, with expectations to drop below 1 pJ/bit [6][7]. Group 2: Manufacturing Challenges - Key challenges in CPO manufacturing include achieving precise alignment between fiber and PIC, which is critical for effective optical signal coupling [8]. - The most common passive alignment method is the V-groove technique, which connects the fiber directly to the PIC to minimize loss [8][9]. - Efficient coupling between standard single-mode fibers and silicon waveguides is complicated due to significant differences in size and refractive index, leading to potential light loss [8][9]. Group 3: Thermal Management - CPO systems are sensitive to temperature fluctuations caused by high-power devices like GPUs and ASICs, which can affect the performance of photonic devices [11][12]. - A temperature change of just 1°C can lead to approximately 0.1nm wavelength shift in most photonic systems, necessitating careful thermal management strategies [11][12]. - Advanced thermal interface materials and monitoring circuits are deployed to maintain PIC temperature within predefined ranges [11][13]. Group 4: Reliability Design - Ensuring reliability in CPO systems is crucial, especially with multi-chip integration, requiring known good die (KGD) testing and optical testing solutions [14][16]. - High reliability designs incorporate redundancy, such as backup lasers, to maintain operation in case of component failure [15][16]. - Integrated monitoring and self-correcting features are being developed to detect performance degradation and facilitate quick recovery [15][16]. Group 5: Integration Techniques - Both 2.5D and 3D packaging methods are utilized in CPO, with 2.5D placing electronic ICs and PICs side by side on a silicon interposer [17][18]. - 3D integration allows for optimal manufacturing processes for each chip type, enhancing performance while increasing complexity and cost [18][19]. - The integration of optical features with traditional CMOS processes is becoming more compatible, facilitating advancements in CPO technology [17][18].

来源：内容 编译自 IEEE ，谢谢。 如果将过多的铜线捆扎在一起，最终会耗尽空间——前提是它们不会先熔合在一起。人工智能数据 中心在GPU和内存之间传输数据的电子互连方面也面临着类似的限制。为了满足人工智能的海量 数据需求，业界正在转向更大尺寸、更多处理器的芯片，这意味着在机架内实现更密集、更长距离 的连接。初创公司正在展示 GPU 如何摆脱铜互连，用光纤链路取而代之。 光纤链路对数据中心来说并不陌生。它们使用可插拔收发器在机架之间传输数据，将电信号转换为 光信号。为了提高能源效率，"将光学元件集成到芯片封装中一直是一个梦想，"加州大学圣巴巴拉 分校电气工程教授克林特·肖( Clint Schow)表示。这就是共封装光学器件（CPO），科技巨头们正 在全力支持它。英伟达 (Nvidia) 最近宣布量产一款网络交换机，该交换机使用嵌入在与交换机同 一基板上的光子调制器。"这震惊了整个行业，"加州桑尼维尔初创公司Avicena的首席执行官巴迪 亚·佩泽什基 (Bardia Pezeshki) 表示。 哥伦比亚大学电气工程教授、Xscape Photonics联合创始人Keren Bergman解释说， Nvid ...