Core Viewpoint - The expansion of the "Two Chips and One Ecosystem" initiative signifies a shift towards a more open and versatile domestic computing ecosystem, moving away from the previously closed ARM architecture model [1][3][4]. Group 1: Expansion of the Ecosystem - The "Two Chips and One Ecosystem" initiative, which includes Feiteng and Kunpeng CPUs along with the Kirin OS, is evolving to encompass a broader range of general-purpose and specialized chips, thus creating a more comprehensive domestic computing framework [1][3]. - This initiative aims to address key technical challenges in domestic secure computing by integrating various platforms and technologies, thereby enhancing compatibility and adaptability [3][4]. Group 2: Challenges and Opportunities - Despite advancements in the domestic computing industry, challenges such as fragmented technology routes, insufficient hardware-software compatibility, and low standardization remain significant barriers [3][4]. - The shift towards a more open ecosystem is expected to provide users with greater flexibility and better product matching, moving from a "usable" to a "user-friendly" computing environment [5][7]. Group 3: Risks and Concerns - The dependency on ARM's licensing model has led to a stagnation in the performance and iteration of domestic ARM chips, raising concerns about the long-term sustainability of the domestic ARM market [9][10]. - The recent vulnerabilities in ARM architecture highlight the risks associated with outdated technology, emphasizing the need for continuous innovation and adaptation to maintain competitiveness [10].

Core Viewpoint - Huawei is positioning itself as a leader in AI infrastructure by introducing advanced computing capabilities and innovative AI models, aiming to simplify complex processes for enterprises while enhancing their operational efficiency [5][6][26]. Group 1: AI Infrastructure and Innovations - Huawei announced a roadmap for multiple chip releases and supernode advancements over the next three years, aiming to create the "world's strongest supernode" in AI computing [5]. - The CloudMatrix supernode specifications will upgrade from 384 cards to 8192 cards, enabling the formation of super-large clusters of 500,000 to 1,000,000 cards, significantly enhancing AI computing power [7][8]. - The CloudMatrix384 can support 384 Ascend NPUs and 192 Kunpeng CPUs, facilitating the training of large models and improving inference performance by pooling resources [7][8]. Group 2: Strategic Focus and Market Position - Huawei Cloud's strategy emphasizes "system-level innovation" and a focus on various industries, which is seen as a proactive response to global AI competition [6][7]. - The company has achieved a 268% increase in AI computing scale compared to the previous year, with the number of Ascend AI cloud customers rising from 321 to 1805 [26]. Group 3: Industry Applications and Case Studies - Huawei Cloud has successfully implemented AI solutions in various sectors, such as transportation and manufacturing, demonstrating significant improvements in operational efficiency and predictive maintenance [12][24][25]. - The integration of AI models like Pangu has led to enhanced accuracy in traffic prediction and operational processes, showcasing the practical benefits of AI in real-world applications [12][24]. Group 4: Global Reach and Data Solutions - Huawei Cloud operates in 34 geographical regions with 101 availability zones, providing a global network that enhances data processing and AI application development [20][21]. - The company has improved data integration efficiency for clients like Neogrid, enabling faster decision-making through real-time data access [22]. Group 5: Future Vision and Commitment - Huawei emphasizes the importance of collaboration across the AI industry to build a future-oriented ecosystem that benefits all stakeholders [26]. - The company's commitment to simplifying complex processes for clients while managing intricate data and AI systems reflects its long-term vision for AI and digital transformation [17][26].

Core Viewpoint - Huawei's Full Connect 2025 Conference showcased the Lingqu Unified Interconnection Protocol, announcing the launch of Ascend 950/960/970 and Kunpeng 950/960 over the next three years, highlighting the gradual enhancement of domestic AI computing chip capabilities amid US-China tensions [9][58]. Group 1: AI Computing Chip Development - The Ascend NPU roadmap includes the release of Ascend 950 (PR and DT versions) in 2026, followed by 960 in 2027 and 970 in 2028, with significant performance improvements [15][20]. - The Kunpeng CPU will see the launch of Kunpeng 950 in late 2026 and Kunpeng 960 in early 2028, supporting advanced computing needs [20][34]. - Domestic chip manufacturers like Haiguang and Cambricon are projecting substantial revenue growth, with Haiguang targeting a CAGR of 44% over three years [3][58]. Group 2: Advanced Manufacturing and Semiconductor Industry - The domestic lithography machine industry is focusing on complete machines and related components, with expectations for advanced process expansion by 2026 [3][59]. - The domestic semiconductor industry is expected to benefit from the acceleration of independent and controllable demands, particularly in advanced logic and storage production lines [3][62]. Group 3: Storage and Edge Computing - The demand for inference and edge computing storage is increasing, with significant growth expected in AI PCs, smartphones, and wearable devices by 2026 [4][58]. - Domestic manufacturers are enhancing their enterprise storage product lines, with companies like Jiangbolong and Baiwei Storage launching new enterprise-level solutions [4][58]. Group 4: Investment Recommendations - Investment opportunities are suggested in AI computing chips, high-end chip manufacturing, packaging, storage, and related equipment and materials [5].

Group 1: Technology Innovation and Investment - During the "14th Five-Year Plan" period, China's R&D investment is expected to exceed 3.6 trillion yuan in 2024, a 48% increase from 2020[2] - R&D intensity is projected to reach 2.68%, surpassing the average level of EU countries[2] - The total number of R&D personnel in China ranks first in the world, indicating a solid foundation for becoming a technology powerhouse[2] Group 2: A-Share Market Developments - In 2025, 780 A-share listed companies announced semi-annual cash dividend plans, totaling 644.6 billion yuan, significantly higher than the previous year[2] - The increase in dividend levels is expected to enhance investor confidence and promote long-term capital market health[2] Group 3: Market Trends and Economic Policies - Multiple cities are implementing cash subsidies and housing fairs to stimulate housing consumption, particularly in second and third-tier cities[3] - The recent signing of a historic technology agreement between the US and UK aims to lead the world in artificial intelligence[3] Group 4: Commodity Market Insights - International precious metal futures saw a decline, with COMEX gold futures down 1.07% to $3678.2 per ounce, and silver futures down 0.12% to $42.1 per ounce[4] - The Federal Reserve's hawkish stance and a rebound in the dollar index have pressured gold and silver prices[4] Group 5: Financial Market Indicators - The latest 10-year government bond yield is 1.852%, with a change of 1.52 basis points[5] - The latest value of the USDCNH is 7.1087, reflecting a 0.09% increase[7]

Company Movements - Nvidia will invest $5 billion in Intel at a price of $23.28 per share, establishing a partnership where Intel will customize x86 CPUs for Nvidia's AI infrastructure platform [5] - Huawei announced new product plans at the Huawei Connect 2025 event, including the Ascend 950PR chip expected in Q1 2026 and the Kunpeng 950 chip anticipated in Q4 2026 [6] - DeepSeek issued a statement warning against fraudsters impersonating the company for "computing power leasing" and "equity financing," emphasizing that all payments should be made through official channels [6] - Fulin Precision signed a prepayment agreement worth 1.5 billion yuan with CATL to secure lithium iron phosphate supply [6] - Shenzhen Huaqiang stated on an interactive platform that it provides electronic components to Yushu Technology [6] Investment News - On September 18, A-shares experienced volatility with the Shanghai Composite Index closing down 1.15% at 3,831.66 points, with a total market turnover of 3.17 trillion yuan [3] - The Hong Kong Hang Seng Index fell 1.35% to 26,544.85 points, with significant declines in cyclical stocks and financial sectors, while semiconductor and robotics sectors showed resilience [3] - The Shanghai Stock Exchange reported unusual trading activities in Tianpu Co., leading to regulatory measures against certain investors [3] - Goldman Sachs maintained an "overweight" rating on A-shares and H-shares, predicting an 8% and 3% upside respectively over the next 12 months [4] - As of September 17, the total scale of bond issuance by securities firms reached 1.14 trillion yuan, significantly higher than the 693.7 billion yuan in the same period last year [4]

Core Insights - Huawei's rotating chairman Xu Zhijun announced the Ascend chip roadmap at the Huawei Connect 2025 conference, planning to launch three series of products: Ascend 950PR/Ascend 950DT, Ascend 960, and Ascend 970 over the next three years [3] - The company emphasizes that computing power is crucial for artificial intelligence and will continue to be a key factor for AI development in China [3] - Huawei aims to meet the growing demand for AI computing power with the planned launches of Ascend chips in 2026 and 2028 [3] Product Launch Timeline - The Ascend 950PR/Ascend 950DT will be launched in Q1 2026, followed by Ascend 960 in Q4 2026, and Ascend 970 in Q4 2028 [3] - In the general computing field, Huawei plans to release Kunpeng 950 and Kunpeng 960, scheduled for Q4 2026 and Q1 2028 respectively [3] Competitive Positioning - Xu acknowledged that due to U.S. sanctions, Huawei cannot produce chips at TSMC, resulting in a performance gap compared to NVIDIA [4] - Despite this, Huawei leverages over 30 years of experience in connectivity technology, achieving breakthroughs that enable ultra-node capabilities [4] - The company expresses a willingness to collaborate with the industry to build a robust foundation for AI computing power both in China and globally [4]