Core Viewpoint - Huawei is positioning itself as a leader in AI infrastructure by introducing advanced computing capabilities and innovative AI models, aiming to simplify complex processes for enterprises while enhancing their operational efficiency [5][6][26]. Group 1: AI Infrastructure and Innovations - Huawei announced a roadmap for multiple chip releases and supernode advancements over the next three years, aiming to create the "world's strongest supernode" in AI computing [5]. - The CloudMatrix supernode specifications will upgrade from 384 cards to 8192 cards, enabling the formation of super-large clusters of 500,000 to 1,000,000 cards, significantly enhancing AI computing power [7][8]. - The CloudMatrix384 can support 384 Ascend NPUs and 192 Kunpeng CPUs, facilitating the training of large models and improving inference performance by pooling resources [7][8]. Group 2: Strategic Focus and Market Position - Huawei Cloud's strategy emphasizes "system-level innovation" and a focus on various industries, which is seen as a proactive response to global AI competition [6][7]. - The company has achieved a 268% increase in AI computing scale compared to the previous year, with the number of Ascend AI cloud customers rising from 321 to 1805 [26]. Group 3: Industry Applications and Case Studies - Huawei Cloud has successfully implemented AI solutions in various sectors, such as transportation and manufacturing, demonstrating significant improvements in operational efficiency and predictive maintenance [12][24][25]. - The integration of AI models like Pangu has led to enhanced accuracy in traffic prediction and operational processes, showcasing the practical benefits of AI in real-world applications [12][24]. Group 4: Global Reach and Data Solutions - Huawei Cloud operates in 34 geographical regions with 101 availability zones, providing a global network that enhances data processing and AI application development [20][21]. - The company has improved data integration efficiency for clients like Neogrid, enabling faster decision-making through real-time data access [22]. Group 5: Future Vision and Commitment - Huawei emphasizes the importance of collaboration across the AI industry to build a future-oriented ecosystem that benefits all stakeholders [26]. - The company's commitment to simplifying complex processes for clients while managing intricate data and AI systems reflects its long-term vision for AI and digital transformation [17][26].

Core Viewpoint - Huawei's Full Connect 2025 Conference showcased the Lingqu Unified Interconnection Protocol, announcing the launch of Ascend 950/960/970 and Kunpeng 950/960 over the next three years, highlighting the gradual enhancement of domestic AI computing chip capabilities amid US-China tensions [9][58]. Group 1: AI Computing Chip Development - The Ascend NPU roadmap includes the release of Ascend 950 (PR and DT versions) in 2026, followed by 960 in 2027 and 970 in 2028, with significant performance improvements [15][20]. - The Kunpeng CPU will see the launch of Kunpeng 950 in late 2026 and Kunpeng 960 in early 2028, supporting advanced computing needs [20][34]. - Domestic chip manufacturers like Haiguang and Cambricon are projecting substantial revenue growth, with Haiguang targeting a CAGR of 44% over three years [3][58]. Group 2: Advanced Manufacturing and Semiconductor Industry - The domestic lithography machine industry is focusing on complete machines and related components, with expectations for advanced process expansion by 2026 [3][59]. - The domestic semiconductor industry is expected to benefit from the acceleration of independent and controllable demands, particularly in advanced logic and storage production lines [3][62]. Group 3: Storage and Edge Computing - The demand for inference and edge computing storage is increasing, with significant growth expected in AI PCs, smartphones, and wearable devices by 2026 [4][58]. - Domestic manufacturers are enhancing their enterprise storage product lines, with companies like Jiangbolong and Baiwei Storage launching new enterprise-level solutions [4][58]. Group 4: Investment Recommendations - Investment opportunities are suggested in AI computing chips, high-end chip manufacturing, packaging, storage, and related equipment and materials [5].

Group 1: Technology Innovation and Investment - During the "14th Five-Year Plan" period, China's R&D investment is expected to exceed 3.6 trillion yuan in 2024, a 48% increase from 2020[2] - R&D intensity is projected to reach 2.68%, surpassing the average level of EU countries[2] - The total number of R&D personnel in China ranks first in the world, indicating a solid foundation for becoming a technology powerhouse[2] Group 2: A-Share Market Developments - In 2025, 780 A-share listed companies announced semi-annual cash dividend plans, totaling 644.6 billion yuan, significantly higher than the previous year[2] - The increase in dividend levels is expected to enhance investor confidence and promote long-term capital market health[2] Group 3: Market Trends and Economic Policies - Multiple cities are implementing cash subsidies and housing fairs to stimulate housing consumption, particularly in second and third-tier cities[3] - The recent signing of a historic technology agreement between the US and UK aims to lead the world in artificial intelligence[3] Group 4: Commodity Market Insights - International precious metal futures saw a decline, with COMEX gold futures down 1.07% to $3678.2 per ounce, and silver futures down 0.12% to $42.1 per ounce[4] - The Federal Reserve's hawkish stance and a rebound in the dollar index have pressured gold and silver prices[4] Group 5: Financial Market Indicators - The latest 10-year government bond yield is 1.852%, with a change of 1.52 basis points[5] - The latest value of the USDCNH is 7.1087, reflecting a 0.09% increase[7]

Company Movements - Nvidia will invest $5 billion in Intel at a price of $23.28 per share, establishing a partnership where Intel will customize x86 CPUs for Nvidia's AI infrastructure platform [5] - Huawei announced new product plans at the Huawei Connect 2025 event, including the Ascend 950PR chip expected in Q1 2026 and the Kunpeng 950 chip anticipated in Q4 2026 [6] - DeepSeek issued a statement warning against fraudsters impersonating the company for "computing power leasing" and "equity financing," emphasizing that all payments should be made through official channels [6] - Fulin Precision signed a prepayment agreement worth 1.5 billion yuan with CATL to secure lithium iron phosphate supply [6] - Shenzhen Huaqiang stated on an interactive platform that it provides electronic components to Yushu Technology [6] Investment News - On September 18, A-shares experienced volatility with the Shanghai Composite Index closing down 1.15% at 3,831.66 points, with a total market turnover of 3.17 trillion yuan [3] - The Hong Kong Hang Seng Index fell 1.35% to 26,544.85 points, with significant declines in cyclical stocks and financial sectors, while semiconductor and robotics sectors showed resilience [3] - The Shanghai Stock Exchange reported unusual trading activities in Tianpu Co., leading to regulatory measures against certain investors [3] - Goldman Sachs maintained an "overweight" rating on A-shares and H-shares, predicting an 8% and 3% upside respectively over the next 12 months [4] - As of September 17, the total scale of bond issuance by securities firms reached 1.14 trillion yuan, significantly higher than the 693.7 billion yuan in the same period last year [4]

在通算领域，华为规划了鲲鹏950与鲲鹏960，分别将于2026年第四季度和2028年第一季 度上市，围绕支持超节点和更多核、更高性能持续演进。 "由于我们受到美国的制裁，不能到台积电去投片，我们单颗芯片的算力相比英伟达是有差 距的。"徐直军坦言，但是华为有三十多年联人、联机器的积累，在联接技术上强力投资、 实现突破，使得能够做到万卡级的超节点，从而一直能够做到世界上算力最强。"华为愿与 产业界一起继续努力，构筑起支撑我国乃至全世界AI算力需求的坚实底座。"他说。 来源：新浪科技 更多财经视频，请关注视频号"新浪财经" 在今日的华为全联接大会2025上，华为轮值董事长徐直军公布了昇腾芯片规划：未来三年 将推出昇腾950PR/昇腾950DT、昇腾960和昇腾970三个系列产品。 他表示，算力过去是，未来也将继续是人工智能的关键，更是中国人工智能的关键。他公布 了一系列即将上市和规划中的新品。 昇腾芯片方面，华为面向未来三年，规划了昇腾950PR/昇腾950DT、昇腾960和昇腾970 三个 系列产品，分别将于2026年第一季度和2026年第四季度，以及2027年第四季度、 2028年第四季度上市，持续满足AI算力 ...