Core Viewpoint - Huawei's Full Connect 2025 Conference showcased the Lingqu Unified Interconnection Protocol, announcing the launch of Ascend 950/960/970 and Kunpeng 950/960 over the next three years, highlighting the gradual enhancement of domestic AI computing chip capabilities amid US-China tensions [9][58]. Group 1: AI Computing Chip Development - The Ascend NPU roadmap includes the release of Ascend 950 (PR and DT versions) in 2026, followed by 960 in 2027 and 970 in 2028, with significant performance improvements [15][20]. - The Kunpeng CPU will see the launch of Kunpeng 950 in late 2026 and Kunpeng 960 in early 2028, supporting advanced computing needs [20][34]. - Domestic chip manufacturers like Haiguang and Cambricon are projecting substantial revenue growth, with Haiguang targeting a CAGR of 44% over three years [3][58]. Group 2: Advanced Manufacturing and Semiconductor Industry - The domestic lithography machine industry is focusing on complete machines and related components, with expectations for advanced process expansion by 2026 [3][59]. - The domestic semiconductor industry is expected to benefit from the acceleration of independent and controllable demands, particularly in advanced logic and storage production lines [3][62]. Group 3: Storage and Edge Computing - The demand for inference and edge computing storage is increasing, with significant growth expected in AI PCs, smartphones, and wearable devices by 2026 [4][58]. - Domestic manufacturers are enhancing their enterprise storage product lines, with companies like Jiangbolong and Baiwei Storage launching new enterprise-level solutions [4][58]. Group 4: Investment Recommendations - Investment opportunities are suggested in AI computing chips, high-end chip manufacturing, packaging, storage, and related equipment and materials [5].