硅芯科技主要从事新一代2.5D/3D堆叠芯片EDA软件设计，团队致力于新一代2.5D/3D堆叠芯片EDA软 件开发，专注于后端核心实现流程。 硅芯科技自研3Sheng Integration Platform，实现三维堆叠芯片的系统级规划、物理实现与分 析、可测性与可靠性设计等，集成"系统-测试-综合-仿真-验证"五引擎合一，具有统一数据底 座，支持三维异构集成系统的敏捷开发与可定制化的协同设计优化，并在多个功能和性能上具有 独创性。 三维堆叠芯片（2.5D/3D/3.5D/SoW）包含多个堆叠芯片（Stacked Die），这些Die通过中介 层上特殊过孔（via）或互连凸块（bump）来实现所需的连接。然而，微凸块与Die间互连、 硅通孔和相关晶圆薄化以及无源中介层的键合，均是不可逆过程，相较传统SoC开发研制，多 样化封装测试和新的结构流程给复合堆叠带来新的测试流程和可测性需求。 以下文章来源于硅芯科技 ，作者Robin 硅芯科技 . 硅 芯 科 技 的 3Sheng Integration EDA 是 如 何 帮 助 3DIC 设 计 ， 在 新 的 测 试 流 程 的 键 合 （bonding）前后 ...

Core Viewpoint - The article discusses the advancements and importance of 3D integrated circuits (3D IC) and the role of EDA tools like 3Sheng Stratify™ in ensuring the accuracy and integrity of stacked chip designs, which are crucial for high-performance applications in various industries [3][30]. Group 1: 3D IC and Advanced Packaging - 3D IC technology provides significant flexibility and reusability in product design, particularly for AI computing and high-end mixed-signal integration [3]. - Stacked chips utilize advanced packaging techniques that are essential for performance, functionality, cost, and iteration methods [3]. - The demand for high-density interconnect advanced packaging is growing across various applications, including military, aerospace, and consumer electronics [4]. Group 2: EDA Tools and Verification - 3Sheng Stratify™ EDA tool offers rapid and accurate assembly-level verification for interconnections between dies and intermediary layers in stacked chip designs [10]. - The tool supports design rule checks (DRC) and layout versus schematic (LVS) checks to ensure consistency and compliance with design specifications [10][12]. - The verification process includes checks for signal integrity and functionality across complex interconnect structures [9]. Group 3: Key Performance Indicators - The EDA tool provides various functionalities, including high-density interconnect verification, static timing analysis, and design rule compliance checks [12][13]. - It also features automated detection of anomalies and supports multi-file collaborative checks to enhance design efficiency [13][14]. - The tool aims to improve manufacturability and reliability of 2.5D designs by ensuring that physical layouts meet manufacturing process specifications [23]. Group 4: Design Rule Checks and Automation - The 3Sheng DRC tool supports a wide range of design rule checks, including geometric rules and special process checks, to ensure compliance with foundry specifications [25][28]. - The tool incorporates machine learning algorithms for anomaly detection in 2.5D designs, enhancing the accuracy of network connection checks [18][20]. - Automated repair features are included to address design rule violations, thereby reducing manual intervention and speeding up the design iteration process [28][29]. Group 5: Future Directions - The company aims to enhance the automation design capabilities for 2.5D/3D/3.5D systems, providing comprehensive design and verification solutions to the industry [31]. - The integration of various design engines within the 3Sheng Integration Platform facilitates rapid design and verification processes, ensuring a balance between performance, power consumption, area, and cost [30].

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 添加文末微信，加 先进封装 群 作为从事新一代 2.5D/3D堆叠芯片EDA软件设计的研发及产业化企业。珠海硅芯科技有限公司拥 有强大的研发团队，创始人团队从2008年开始研究2.5D/3D堆叠芯片设计方法，是世界最早期研 究前沿芯片架构设计方法的研究团队之一，并在堆叠芯片EDA后端布局、布线、可测试、可靠性等 方面均有世界领先成果。 针对 Chiplet堆叠芯片技术，其自研的3Sheng Integration Platform，支持三维异构集成系统的敏 捷开发与可定制化的协同设计优化，涵盖先进封装设计所需环节的全流程工具。目前，硅芯科技系 列产品已通过先进封装产业验证，完成设计制造闭环，并打造首批客户案例，全方位助力 AI,GPU,CPU,NPU,FGPA,硅光等各类芯片及终端应用领域发展。 直面需求 早先在HiPi联盟大会上， 多位业内顶级设计专家发声Chiplet和3D IC对设计和EDA挑战 。 近年来国内设计三维异构集成芯片的困扰似乎集中于设计出的堆叠结构 ...

Market Overview - The main board saw significant gains with Aerospace Changfeng (+10.02%), Vision China (+10.02%), and Tianjian Technology (+10.01) leading the charge [1] - The ChiNext board experienced a surge with Jinlong Machinery (+20.08%) and AVIC Chengfei (+20.01%) showing strong performance [1] - The Sci-Tech Innovation board also led with Aerospace Nanhu (+20.02%) and Youfang Technology (+13.14%) [1] - Active sub-industries included SW Communication Network Equipment and Devices (+5.77%) and SW Military Electronics III (+3.62%) [1] Domestic News - Semiconductor industry research indicates that Silicon Core Technology has developed a self-research 3Sheng Integration Platform, achieving system-level planning for 3D stacked chips [1] - Semiconductor Investment Alliance reports that Maijie Technology plans to invest 10 million yuan to acquire a 10% stake in Zhongke Hongjing, enhancing its layout in the magnetic materials sector [1] - CINNO confirms that Jiangsu Gaoguang's first 8.6-generation AMOLED metal mask production line has officially entered Jiangsu Zhenjiang, marking a significant step for China's AMOLED industry [1] - CATL has launched the world's first 9MWh energy storage system, improving volume utilization by 45% and energy density by 50%, capable of charging 150 electric vehicles [1] Company Announcements - Weicet Technology announced financial support for its subsidiaries, providing up to 1.3 billion yuan for business expansion focused on high-performance chips and advanced packaging [2] - Dash Smart announced a contract for a smart hospital project with a total value of 58.13 million yuan [2] - Huahong Semiconductor reported a total revenue of 3.913 billion yuan for Q1 2025, a year-on-year increase of 18.66%, but a net profit decline of 89.73% [2] - Shengtian Network has repurchased 2,786,660 shares, accounting for 0.57% of total equity, with a total transaction amount of 29.76 million yuan [2] Semiconductor Industry Insights - AMD anticipates a revenue loss of $1.5 billion due to new U.S. restrictions on chip exports to China [3] - Broadcom has been sending termination letters to VMware license holders, potentially leading to significant legal repercussions [3] - Samsung and SK Hynix are collaborating on hybrid bonding technology for next-generation HBM products, with Samsung expected to apply it to HBM4 next year [3] - Hanwha Semiconductor has established an advanced packaging equipment development center to expand its capabilities into next-generation technologies [3]

来源： 硅芯科技官微 硅芯科技自研3Sheng Integration Platform，实现三维堆叠芯片的系统级规划、物理实现与分 析、可测性与可靠性设计等，集成"系统-测试-综合-仿真-验证"五引擎合一，具有统一数据底 座，支持三维异构集成系统的敏捷开发与可定制化的协同设计优化，并在多个功能和性能上具有 独创性。 直面需求 3月在HiPi联盟大会，已听到 多位业内顶级设计专家发声Chiplet和3D IC对设计和EDA挑战。 近年来国内设计三维异构集成芯片的困扰似乎集中于设计出的堆叠结构，却在仿真和验证以后 仍然发现诸多问题！于是 "缺乏架构设计，急需设计协同和优化，设计要素全线左移" 已经成 为了业界对三维芯片堆叠设计的共识！ 要做一个设计，初心始于SoC的迭代，如果没有架构设计，严格说是能融合支持IP划分、工艺 选择、版图探索、前仿真、互连检查与优化、基于电源和热的物理实现、跨Die物理签核的多 点协同设计的架构设计和早期分析工具，那这样的设计通常会南辕北辙。 在近期硅芯科技的行业分享讲座上，创始人赵毅博士 基于业界3D IC设计遇到的问题 做了又 一轮的总结。其中提到：顶层架构对于应用场景、有效探索 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 珠海硅芯科技有限公司 诚邀您莅临于2025年4月29日在浙江 · 宁波 （ 甬江实验室） 举办的 2025势银异质异构集成封装产业大会 公司介绍 珠海硅芯科技有限公司主要从事新一代2.5D/3D堆叠芯片EDA软件设计的研发及产业化。创始人团队从2008年开始研究2.5D/3D芯片设计方法，是世界最 早期研究设计方法的研究团队之一，并在堆叠芯片EDA后端布局、布线、可测试、可靠性等方面均有世界领先成果。 公司自主研发3Sheng Integration Platform，分为系统级架构设计、物理实现、Multi-die测试容错、分析仿真、多Chiplet集成验证五大中心，涵盖堆叠 芯片设计所需环节的全流程工具。目前，硅芯科技系列产品已通过先进封装产业验证，完成设计制造闭环，并打造首批客户案例，全方位助力 AI,GPU,CPU, ...